JP2610757B2 - Method for producing ultra-thin Au-Si alloy brazing material with excellent thickness accuracy - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an Au-Si alloy brazing material used particularly for joining electronic components.

[0002]

2. Description of the Related Art The thickness of a material used as a brazing material is an important factor for controlling the amount of a brazing material to be used. When the amount of the brazing filler metal used changes, the characteristics and shape of the obtained product change. In particular, in the case of electronic components, it is important to control the amount of brazing material to be used because the performance of the joint greatly affects the performance of the component and the size of the component is small. When using a brazing material in the form of foil, the amount of use can be controlled by the area of the foil, but in the case of electronic components with small joints, it is not possible to control only by the area of the foil. It is necessary to control it. However, the foil-like Au-Si alloy brazing material used to join electronic parts and the like has a thickness of at most 50 μm.
m, there was a limit on the thickness of foil that could be provided. Therefore, when the used amount of the brazing material is very small, it is very difficult to control the amount.

[0003] The limitation on the thickness of the conventional Au-Si alloy brazing material originated from the manufacturing method. Heretofore, the Au-Si alloy brazing material has been manufactured by solidifying by a normal ingot casting method, and thereafter hot or warm rolling to form a foil. Au-Si alloys cannot be cold rolled due to their mechanical properties and must be rolled hot or warm. However, the thickness of the foil obtained by hot rolling is also limited. The lower limit was 50 μm.

On the other hand, a thinner foil-like Au-Si
As a method for obtaining an alloy brazing material, for example,
No. 103764 states that a foil-like Au—Si alloy brazing material having a plate thickness of 50 μm or less entirely amorphous or an amorphous surface layer can be obtained by a single roll method. However, although a foil-like Au-Si alloy is actually obtained by a single roll method, this foil-like alloy is very brittle and is not suitable for use as a brazing material. Moreover, such foils have a thickness accuracy of, for example, ±
It is not good for use as a brazing material from this point. Because foil with poor thickness accuracy,
This is because there is a problem in controlling the amount of the brazing material to be used.

In addition, Japanese Patent Application Laid-Open No. 55-103297 proposes a brazing filler metal having at least 50% of an amorphous structure and ductility not exceeding 63.5 μm. Although it is stated that such a thin brazing material is obtained by quenching at a rate of at least 10 ⁵ ° C / s, such an as-cast foil still has poor thickness accuracy of the foil, and It is not preferable for use as a brazing filler metal in electronic parts and the like in which the amount of use of the material is very small and the amount of use is strictly controlled.

[0006]

SUMMARY OF THE INVENTION The present invention is to solve the above-mentioned problems in an Au-Si alloy brazing material used as a brazing material for electronic parts and the like, and has a plate thickness of less than 50 μm and Au-Si with excellent thickness accuracy
An object of the present invention is to provide a method for manufacturing an alloy brazing material.

[0007]

In order to achieve the above object, the present invention has the following constitution. That is, Si
Au-Si alloy having a content of 10 mass% or less
Is rapidly solidified by a single roll method to form an amorphous foil.
Heat-treated in a temperature range of 100 ° C. or higher and just below the melting point.
Then, cold rolling is performed to a predetermined plate thickness of less than 50 μm and a plate thickness accuracy of ± 10% or less of the plate thickness, the ultra-thin Au-Si alloy brazing material having an excellent plate thickness accuracy . Manufacturing method
Is the law.

Hereinafter, the present invention will be described in detail.

According to the present invention, if the Au-Si alloy is rapidly solidified by a single roll method and further heat-treated under appropriate conditions, the ductility of the foil is developed, the cold rolling is possible, and the sheet thickness accuracy is excellent. It is based on a new finding that an extremely thin Au-Si alloy foil can be obtained.

A method for obtaining an Au-Si alloy brazing material having a thickness of less than 50 μm and a thickness accuracy of ± 10% or less of the thickness is specifically described below. That is, Au-Si
The alloy is melted, for example, by high-frequency induction melting, and spouted onto a roll made of a metal with high thermal conductivity, such as copper,
A foil-like Au-Si alloy having a thickness of about 100 μm is used.
At this time, the roll is rotating at a high surface speed of, for example, 5 m / s or more. The thickness of the resulting foil can be controlled by manufacturing factors such as the surface speed of the roll. In addition, Au-Si
Appropriate casting conditions for producing the alloy foil will be specifically described in Examples below.

Next, the foil is heat-treated under appropriate conditions.
At this time, the optimal heat treatment condition varies depending on the Si content in the Au-Si alloy, but the treatment temperature is set to a temperature of 100 ° C. or more to just below the melting point. Further, the processing time is in the range of several minutes to about ten and several hours, and the higher the processing temperature, the shorter the processing time. For example, the optimum heat treatment condition in the case of a eutectic composition having a Si content of 3.15 mass% is as follows:
To 360 ° C., and the treatment time is 5 minutes to 5 hours. Due to this heat treatment, ductility of the foil is developed, and rolling can be performed even in a cold state. The optimum heat treatment conditions for various Au-Si alloys are specifically described in Examples.

Further, in order to improve the thickness accuracy of the foil, cold rolling is performed to obtain a foil having a predetermined thickness of 50 μm or less. At this time, a certain amount of reduction is required to improve the thickness accuracy of the foil, and depending on the final target thickness of the foil, the thickness of the foil obtained by casting by the single roll method is about 100 μm. Is preferred. The numerical values used to define the range of the thickness accuracy of the foil of the present invention are indicated by the ratio of the variation of the maximum and minimum thickness to the average thickness of the foil to the average thickness. For example, when the thickness of a foil having an average thickness of 40 μm is within ± 4 μm, the thickness accuracy of the foil is ± 40 μm.
Expressed as 10% or less.

[0013] The production of a foil-shaped Au-Si alloy brazing material by the single roll method is particularly easy when the Si content is 10 mass% or less. It is more effective to provide the brazing material of the foil.

[0014]

According to the present invention, it is possible to provide an Au-Si alloy brazing material having a plate thickness of 50 μm or less and a good plate thickness accuracy. Therefore, it is possible to control the amount of the brazing material used in joining electronic parts and the like. This has made it easier to suppress variations in the properties and shapes of products that have occurred until now due to variations in the amount of brazing material used for brazing. In addition, the occurrence of troubles due to excessive brazing material can be suppressed.

[0015]

EXAMPLE 200 g of an Au--Si alloy having various Si contents as shown in Table 1 was applied to a sheet having a width of 6 by a single roll method.
Foil having various thicknesses was prepared in mm. The roll of the single roll device was made of copper and had a diameter of 300 mm. During casting, the ejection pressure was 0.2 kg / cm ² and the casting atmosphere was helium gas. Next, the obtained foil was heat-treated under appropriate conditions. Table 1 shows the respective heat treatment conditions.
The thus prepared Au—Si alloy foil was rolled under various loads one to several times using a pair of rolls having a diameter of 60 mm. The thickness and accuracy of the thickness of the foil thus obtained were investigated. Table 1 shows the results.

[0016]

[Table 1]

As shown in Table 1, an Au—Si alloy brazing material having a thickness of less than 50 μm and a thickness almost as intended and having a thickness accuracy of ± 10% or less of the thickness was obtained. Such an A
The u-Si alloy brazing material enables the use amount to be controlled even when the amount used at the time of brazing is very small, and was extremely suitable for joining electronic parts and the like.

[0018]

As described above, the Au-Si according to the present invention is described.
Since the alloy brazing filler metal enables the control of the usage amount to a minute unit as compared with the conventional Au-Si alloy brazing filler metal, particularly in the joining of electronic parts and the like in which the usage amount of the brazing filler metal is small , The quality of electronic components is improved, the quality is made uniform, and the production yield is remarkably improved.

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Tanaka Shin 1-1, Tobata-cho, Tobata-ku, Kitakyushu-shi, Fukuoka Nippon Steel Corporation Yawata Works (72) Inventor Tomohiro Hanamura Nakahara-ku, Kawasaki-shi, Kanagawa 1618 Ida New Nippon Steel Corporation Advanced Technology Research Laboratories (72) Inventor Yoichi Ikematsu 1618 Ida Nakahara-ku Kawasaki City, Kanagawa Prefecture New Nippon Steel Corporation Advanced Technology Research Laboratories (56) References JP 60-199593 (JP, A)

Claims (1)

(57) [Claims] 1. When the Si content is 10% by mass or less,
A certain Au-Si alloy is rapidly solidified by the single roll method
Amorphous foil and a temperature range of 100 ° C or higher and just below the melting point
After the heat treatment , the steel sheet is cold rolled to a predetermined thickness of less than 50 μm and the thickness accuracy is ± 10% or less of the thickness.
Excellent ultrathin Au-Si manufacturing method of alloy brazing material accuracy of plate thickness, characterized in that to.