JP2607389B2 - Coating device and coating method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a coating apparatus and a coating method.

(Prior Art) In the resist coating step of the semiconductor wafer manufacturing process, it is necessary to uniformly apply a coating liquid, for example, a resist liquid, to the semiconductor wafer. Therefore, the wafer is suction-fixed on a spin chuck, and a quantitative pump or the like is placed thereon. In this method, a certain amount of resist is dropped from one or a plurality of discharge nozzles, and the spin chuck is rotated at a high speed to apply a resist having a uniform film thickness.
issue). Provision of heating / cooling means in the resist liquid flow path to the discharge nozzle is disclosed in JP-A-60-86542 and JP-A-62-21164.
No. 3 known.

Conventionally, such a resist coating apparatus has used a discharge nozzle as shown in the sectional view of FIG. In FIG. 5, the fitting nozzle (1) is fixed to the fitting nozzle fixing plate (2) with a nut (3),
The fitting nozzle (1) is passed through a discharge nozzle (4) connected to a pipe (7) connected to a resist supply system (not shown), and the discharge nozzle (4) is suctioned by a chuck (5). (W) On an arbitrary distance, for example, a =
It is fixed with a cap nut (6) so that it is 1 to 15 mm, preferably a = 7 to 10 mm. Then, the resist liquid discharged from the resist supply system through the pipe at a constant rate is supplied to the wafer (W).
After dripping from the discharge nozzle (4), the wafer (W)
To rotate at high speed.

(Problems to be Solved by the Invention) However, even if such ejection nozzles have different viscosities even with different resist liquids or the same kind of resist liquid, it is necessary to change the shape and inner diameter depending on the resist liquid. Usually, the diameter of the discharge nozzle is increased for a high-viscosity resist, and the diameter of the discharge nozzle is decreased for a low-viscosity resist. Since the discharge nozzle is formed according to the commercially available piping, if the nozzle specifications need to be changed due to a change in the resist specifications, it must be replaced corresponding to the piping, which is an obstacle from the viewpoint of full automation, and further costs It was not satisfactory both in terms of efficiency and efficiency. In particular, a recent trend in the production process of integrated circuits has been a strong shift to high-mix low-volume production, and the above demands have been strong.

In addition, the resist liquid is a high-viscosity liquid, and is cooled during the passage from the resist supply system to the discharge nozzle through the pipe to increase the viscosity, often hindering formation of uniform film quality. Atsuta.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned drawbacks and to provide a coating apparatus and a coating method capable of switching a nozzle to be used at high speed and forming a film with a predetermined film thickness. In addition, an object of the present invention is to provide a coating apparatus capable of controlling the temperature of a plurality of processing liquids, keeping the viscosity of the processing liquid constant, using the same piping, and applying a processing liquid having a uniform film thickness. To provide.

[Configuration of the invention]

(Means for Solving the Problems) According to the invention of claim 1, in a coating apparatus for supplying a coating liquid onto a member to be coated by a nozzle, a liquid supply unit integrally provided with a plurality of nozzles; A rotating body for rotating the application body, a means for selecting one of the plurality of nozzles to discharge the application liquid onto the object to be coated, and a liquid discharged from the selected nozzle Moving means for moving the liquid supply unit above the object to be coated so as to be located at the center of the object to be applied; temperature adjusting means for adjusting the temperature of the application liquid flowing through each nozzle by the same temperature adjusting fluid; Means for placing the tip of the nozzle in a solvent atmosphere of the coating liquid.

According to a second aspect of the present invention, in a coating method of supplying a coating liquid onto a body to be coated by a nozzle and applying the coating liquid to a surface of the body to be coated, a liquid supply unit integrally provided with a plurality of nozzles A rotating body for rotating the object to be coated, a moving means for moving the liquid supply unit above the object to be coated placed on the rotating body, and one of the plurality of nozzles A first step of selecting a nozzle for discharging the coating liquid according to a predetermined program, using a coating apparatus having means for selecting a nozzle and discharging the coating liquid onto the object to be coated, A second step of moving the selected nozzle onto the center of the object by the moving means, and discharging the application liquid from the selected nozzle to the center of the object, and applying the application liquid to the object. Spread over the surface and apply liquid A coating method, comprising: a third step of forming a film; and a fourth step of retracting the nozzle from the object to be coated and placing the tip of the nozzle in a solvent atmosphere of the coating solution. Is provided.

(Operation) According to the coating apparatus of the first aspect, a liquid supply unit integrally provided with a plurality of nozzles, a rotating body for rotating the body to be coated, and one of the plurality of nozzles. Means for selecting one of the nozzles to discharge the application liquid onto the object to be coated, and the liquid supply unit for the object to be coated such that the liquid discharged from the selected nozzle is located at the center of the object to be coated. Since there is provided a moving means for moving the coating liquid upward, a predetermined coating liquid can be supplied from a nozzle selected by a predetermined program such as the type and viscosity of the coating liquid. Therefore, nozzle switching can be performed at high speed. In addition to providing a rotating body for rotating the object to be coated,
Moving means for moving the liquid supply unit above the object to be coated so that the liquid ejected from the selected nozzle is located at the center of the object to be coated. Then, by rotating the rotating body, a film of the coating liquid having a predetermined thickness can be formed on the surface of the object to be coated. Further, since a temperature adjusting means for adjusting the temperature of the coating solution flowing through each nozzle by the same temperature adjusting fluid is provided, there is no need to switch the temperature adjusting mechanism, quick temperature adjustment is possible, and a pipe line through which the temperature adjusting fluid flows. The system is also simplified. Further, it is possible to form a uniform film thickness while keeping the viscosity of the coating liquid constant. In addition, since a means for keeping the tip of the nozzle in a solvent atmosphere of the coating liquid outside the object is also provided, it is possible to prevent the nozzle tip from drying and solidifying even when the nozzle is not used for a long time. For example, it is possible to immediately execute a coating process on the next object to be coated.

According to the application method of the second aspect, a nozzle for applying the application liquid is selected from the liquid supply unit in accordance with a predetermined program, and the selected nozzle is moved on the center of the object by the moving unit. Then, the coating liquid is discharged from the nozzle to the center of the object to be coated, and the coating liquid is spread on the surface of the object to be coated to form a film of the coating liquid, so that the nozzle can be switched at high speed. Moreover, the selected nozzle is moved to the center of the object to be coated by the moving means, and the coating liquid is applied from the nozzle to the center of the object to be coated. A film of the coating liquid can be formed on the object to be coated. In addition, since the nozzle that has discharged the coating liquid is retracted from the object to be coated and the tip of the nozzle is placed in the solvent atmosphere of the coating liquid, even if there is time between discharges of the next coating liquid. However, the tip of the nozzle does not dry and solidify.

(Embodiment) An embodiment in which the apparatus of the present invention is applied to a resist coating apparatus in a semiconductor manufacturing process will be described below with reference to the drawings.

First, the resist coating apparatus will be briefly described. The resist coating apparatus shown in the block diagram of FIG. 1 mounts and fixes a semiconductor wafer (W) by vacuum suction or the like and fixes the central part of an upper disk-shaped spin chuck (11) fixed to a rotating shaft of a motor (10). Discharge nozzle (1
2) is provided. When the dispensing from the discharge nozzle (12) is not executed for a predetermined time due to, for example, a cut in a rod or the like, the discharge nozzle (12) solidifies due to the resist liquid coming into contact with the space for a long time at the tip of the discharge nozzle (12). It is necessary to perform dummy dispensing because it may cause the ejection nozzle (12) to spin chuck (11).
Since it is necessary to retreat from the upper position to the outer position, it can be moved by the scanner (13).

In addition, a cup (1) serving as a processing container is used to prevent the resist solution from scattering outside the apparatus when the resist solution is applied.
4) is disposed so as to surround the periphery of the wafer (W). The cup (14) can be moved up and down so as to be lowered from a position shown in the figure when the wafer (W) is loaded and unloaded, and the chuck (11) is exposed to facilitate loading and unloading. A drain pipe, an exhaust pipe and the like (not shown) are connected to a lower portion of 14). The resist supply system (15), which is a resist liquid supply device for the discharge nozzle (12), will be described. A pump (18) for supplying a desired fixed amount of the resist liquid (17) stored in the resist storage container (16) For example, a bellows pump or the like, a valve (V1) that opens and closes in conjunction with a filter container (19) and a pump (18), a resist solution (17) is discharged from a discharge nozzle (12), and then a resist solution is discharged into the discharge nozzle (12). A suck-back valve (20) is provided for preventing the resist solution from dripping or solidifying.

Next, the discharge nozzle (1
2) will be described with reference to FIG. This discharge nozzle (1
2), a resist supply system (not shown) is connected by a resist supply pipe (100). The pipe (100) has a structure of a temperature control double pipe (21) so as to control the temperature of the resist solution flowing through the pipe (100). The outer pipe (22) of the temperature control double pipe (21) is an outer diameter path (22a) that is a flow path of the temperature control fluid. The temperature control double pipe (21) having such a configuration is welded to the cylindrical fitting block (24) at a plurality of, for example, two joints (23). The fitting block (24) integrally supports the two temperature control double tubes (21) and constitutes a flow path for the temperature control fluid. On the other hand, the inner diameter path (22b) of the temperature control double pipe (21) penetrates the fitting block (24) and connects to each discharge nozzle (1) through the connecting nozzle (25).
Connected to 2). The joint (23), the fitting block (24), and the connecting nozzle (25) constitute an adapter (26). The discharge nozzle (12) is a resist liquid (17)
Nozzle tip (27), which is a dropping port for the semiconductor wafer (W), and a tip holder (28) which passes through the nozzle tip (27) and is screwed to the adapter (26). The nozzle tip (27) is formed and fixed to be a flare type joint with the tip of the connection nozzle (25) of the adapter (26) that passes through the tip holder (28).

The material of the adapter (26) and the nozzle tip (27) is preferably a material having a low heat conductivity and a large heat capacity. Aluminum, SUS or copper, brass, nickel or the like, and Teflon are suitably used. The surface is preferably mirror-finished in order to maintain the above temperature and further improve the flow.

In this embodiment, since two discharge nozzles (12) are integrally provided by the fitting block (24), two kinds of resists having different viscosities and resist types can be discharged.
That is, a discharge nozzle desired to be discharged is selected by a predetermined program, and the selected discharge nozzle is moved to the center of the wafer (W) to discharge. The same applies to the case of discharging from the other discharging nozzle.

In addition, the temperature control of the resist solution (17) is performed by supplying a temperature control fluid to the outer path (22a) of the temperature control double pipe (21) with an arrow (2).
As shown in (9) and (30), the outer diameter path (22a) of one temperature control double pipe (21) passes through the fitting block (24) from the outer path (22a) of the other temperature control double pipe (21). To the inner diameter path (22
The temperature of the resist solution in b) can be adjusted. In other words, different supply pipes for the resist solution can be provided in the temperature control flow path, whereby the temperature can be controlled with the same temperature control fluid.

Further, the discharge nozzle can be applied to a case where a single line of resist supply system is branched into two pipes and a case where two lines of resist supply system are connected to two pipes respectively. In any case, when the two discharge nozzles are not used at the same time, the resist liquid may be kept in a non-dropping state by using a cap or the like for unnecessary discharge nozzles.

As a means for controlling the temperature of the resist solution, an inner diameter passage through which the resist solution circulates is formed at the center in a double tube structure. For example, the resist solution is configured as shown in FIGS. It is preferable to control the temperature. That is, a plurality of, for example, a plurality of temperature-adjusting double tubes (42) are provided in accordance with the number of types of the resist solution, in which the inner tube (41) is penetrated substantially in the center of the bellows-shaped outer tube (40). ing. One end of each of the inner pipes (41) is integrated and connected to a supply port (43) of a temperature control fluid such as a temperature control water, and one end of each of the outer pipes (40) is integrated and connected to a temperature control water. Outlet (44). The supply port (43) and the discharge port (44) are connected to a temperature controller (not shown), and the temperature-regulated water whose temperature has been regulated by the temperature controller flows into the supply port (43). It is supplied to the other end of the temperature-controlled double pipe (42) through the inside of the inner pipe (41a). Then, at the other end of the temperature control double pipe (42), the temperature flows from the inside of the inner pipe (41a) to the inside of the outer pipe (40a), and flows to the discharge port (44) through the inside of the outer pipe (40a). A flow path for water preparation is formed. By arranging the resist liquid supply pipe (45) in the temperature-adjusting double pipe (42) configured to be capable of adjusting the temperature, the temperature of the resist liquid can be adjusted. This resist liquid supply pipe (45)
Is provided in a coil shape around the outer circumference of the inner pipe (41). Since the resist solution supply pipe (45) is provided in a coil shape, a short temperature control double pipe (42) is provided.
However, the length of the resist solution supply pipe (45) can be made sufficiently long. Therefore, it is possible to adjust the resist liquid discharged at one time, for example, 5 cc at a time. A resist liquid supply source (not shown) is connected to one end of the resist liquid supply pipe (45), and a detachable nozzle (46) is attached to the other end. From the tip of the nozzle (46), the resist liquid fed by the resist liquid supply pipe (45) can be discharged. The temperature control double tube (42) having such a structure can be moved by a scanner (not shown) to a processing position above a central portion of an object to be coated, for example, a wafer, and to a special machine position. That is, the processing position is a position where the resist coating process is performed, and the standby position is a position where the resist liquid is kept on standby when the discharge of the resist liquid is not performed. At the standby position, a nozzle holder (47) for preventing the tip of the nozzle (46) from drying is provided. An opening is provided in the upper part of the nozzle holder (47), and the tip of the nozzle (46) can be inserted into the opening. By inserting the nozzle (46), the inside of the nozzle holder (47) can be inserted. Is almost sealed. Also, inside this nozzle holder (47),
A solvent tank (48) for storing a solvent such as a resist thinner is provided. The inside of the nozzle holder (47) is filled with a solvent atmosphere by the solvent stored in the solvent tank (48), whereby the resist at the tip of the nozzle (46) can be prevented from being dried and solidified. Further, a dummy dispensing for automatically discharging the resist deteriorated by leaving the nozzle (46) for a long period of time after a predetermined time is executed. A drain pipe (not shown) is provided at the bottom of the nozzle holder (47).

The resist discharge operation by the above-described resist supply means will be described. First, a wafer as an object to be coated is subjected to HMDS (hexa-methyl
Disilazane) treatment. This is performed by mounting the wafer on a mounting table and supplying the HMDS atmosphere in a state where the wafer is heated by a thermomodule composed of a constant temperature liquid or a Peltier effect element. By this processing, the adhesion between the resist and the wafer can be improved.
Then, the wafer is set in a state where it is positioned on a rotatable chuck (not shown), and a resist solution is supplied from the resist supply means to the central portion of the wafer. That is, a resist liquid is fed from a resist liquid supply source, and, for example, 5 cc of the resist liquid is discharged from the tip of the nozzle (46) onto the wafer surface through a resist liquid supply pipe (45). At this time, the temperature of the discharged resist solution is precisely controlled to a predetermined temperature, for example, room temperature, by the temperature control double pipe (42). When the temperature of the resist solution changes by 1 ° C., for example, the resist drying speed changes, the resist viscosity changes, and so on.
A difference of 10 ° occurs, and a desired film thickness cannot be obtained. for that reason,
It is necessary to precisely control the temperature of the resist solution. After the resist is discharged, the wafer is rotated by a predetermined rotation control, a resist film having a predetermined thickness is formed on the wafer surface, and the process is completed.

As described above, the same effect can be obtained by adjusting the temperature of the resist solution.

In the above embodiment, the example of adjusting the temperature of the resist solution has been described. However, the present invention is not limited to this. For example, the developing solution also has a high temperature dependency, and the line width of the developing degree changes with the temperature change. Similar effects can be obtained by adjusting the temperature of the developer.

Further, in the above embodiment, the example of the resist coating apparatus has been described. However, the present invention is not limited to this, and the type of the resist may be a positive resist liquid or a negative resist liquid, or may be a resist liquid having different temperatures, The desired operation of the operator can be performed by the different resist liquids.

〔The invention's effect〕

As described above, according to the first aspect of the present invention, a plurality of nozzles are provided integrally and one of the nozzles can be selected to discharge the application liquid, so that the nozzles can be switched at a high speed. . In addition, it is possible to form a coating liquid film with a predetermined thickness on the surface of the coating object. In addition, since the temperature adjusting means for adjusting the temperature with the same temperature adjusting fluid is provided, quick temperature adjustment is possible, and the pipe system through which the temperature adjusting fluid flows is simplified. Further, since the viscosity of the coating liquid can be kept constant by the temperature adjusting means, a uniform film thickness can be formed on the object to be coated. Moreover, even when the nozzle is not used for a long time, the tip of the nozzle can be prevented from being dried and solidified, so that the nozzle can always be kept in a standby state.

According to the second aspect of the present invention, the nozzle can be switched at a high speed, and a film of the coating liquid having a predetermined thickness can be formed on the object by rotating the object. In addition, the nozzle that has discharged the coating liquid is retracted from the object to be coated, and the tip of the nozzle is placed in the solvent atmosphere of the coating liquid. It does not dry solidify. Therefore, the coating process is immediately started when necessary.

[Brief description of the drawings]

FIG. 1 is a block diagram of a resist coating apparatus for explaining an embodiment of the apparatus of the present invention, FIG. 2 is an explanatory view of a discharge nozzle of FIG. 1, and FIGS. 3 and 4 are temperature adjustments of FIG. FIG. 5 is a cross-sectional view of a conventional discharge nozzle. 17 ... Resist liquid, 21 ... Temperature control double pipe 22a ... Outer path, 40 ... Outer pipe 41 ... Inner pipe, 45 ... Resist liquid supply pipe 46 ... Nozzle

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Osamu Hirakawa 2655 Tsukurei, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Inside Tel Kyushu Co., Ltd. (72) Yoshio Kimura 2655 Tsukurei, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Inside (72) Inventor Masami Atsumoto 2655 Tsukurei, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Inside Tel Kyushu Co., Ltd. (72) Inventor Noriyuki Anai 2655 Tsukurei, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Inside Tel Kyushu Corporation (56) References JP-A-62-221465 (JP, A) JP-A-62-214621 (JP, A) JP-A-61-125017 (JP, A) JP-A-63-111979 (JP, U)

Claims (2)

(57) [Claims] 1. A coating apparatus for supplying a coating liquid onto a member to be coated by a nozzle, wherein a liquid supply unit integrally provided with a plurality of nozzles; a rotator for rotating the member to be coated; Means for selecting one of the nozzles to discharge the coating liquid onto the object to be coated; and supplying the liquid so that the liquid discharged from the selected nozzle is positioned at the center of the object to be coated. Moving means for moving the portion above the object to be coated; temperature adjusting means for adjusting the temperature of the coating liquid flowing through each nozzle by the same temperature adjusting fluid; and means for placing the tip of the nozzle in a solvent atmosphere of the coating liquid. A coating device, comprising: 2. A coating method in which a coating liquid is supplied onto a member to be coated by a nozzle and the coating liquid is coated on a surface of the member to be coated, wherein a liquid supply part integrally provided with a plurality of nozzles; A rotating body for rotating the object to be coated, moving means for moving the liquid supply unit above the object to be coated placed on the rotating body, and one of the plurality of nozzles selected A first step of selecting a nozzle for discharging the coating liquid according to a predetermined program, using a coating apparatus having means for discharging the coating liquid onto the object to be coated, and A second step of moving the nozzle onto the center of the object by the moving means; and discharging the application liquid from the selected nozzle to the center of the object, and spreading the application liquid on the surface of the object. To form a coating liquid film A third step of forming, and a fourth step of retracting the nozzle from the object to be coated and placing the tip of the nozzle in a solvent atmosphere of the coating liquid.