JP2590319B2 - Surface treatment system - Google Patents

Surface treatment system

Info

Publication number
JP2590319B2
JP2590319B2 JP61136792A JP13679286A JP2590319B2 JP 2590319 B2 JP2590319 B2 JP 2590319B2 JP 61136792 A JP61136792 A JP 61136792A JP 13679286 A JP13679286 A JP 13679286A JP 2590319 B2 JP2590319 B2 JP 2590319B2
Authority
JP
Japan
Prior art keywords
surface treatment
treatment liquid
tank
inlet
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP61136792A
Other languages
Japanese (ja)
Other versions
JPS62294182A (en
Inventor
正夫 岡村
敏之 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PURANTETSUKUSU KK
Seiko Epson Corp
Original Assignee
PURANTETSUKUSU KK
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PURANTETSUKUSU KK, Seiko Epson Corp filed Critical PURANTETSUKUSU KK
Priority to JP61136792A priority Critical patent/JP2590319B2/en
Publication of JPS62294182A publication Critical patent/JPS62294182A/en
Application granted granted Critical
Publication of JP2590319B2 publication Critical patent/JP2590319B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1675Process conditions
    • C23C18/1676Heating of the solution
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1617Purification and regeneration of coating baths
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1675Process conditions
    • C23C18/168Control of temperature, e.g. temperature of bath, substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • ing And Chemical Polishing (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はメッキ、洗浄等表面処理に用いる表面処理装
置システムに関する。
The present invention relates to a surface treatment apparatus system used for surface treatment such as plating and cleaning.

〔従来の技術〕[Conventional technology]

従来の表面処理装置は第2図断面図に示すように槽本
体4の底板19の中央に表面処理液2の導入口1を設け、
導入口1の前面に小孔を設けた多孔板3を置き、槽本体
4の開口部6の周囲にオーバーフロー部5を設ける。更
にオーバーフロー部5の下部端にオーバーフロー戻り管
17を取り付け、他の一端を加熱タンク15に接続する。加
熱タンク15の中には熱交換器16が表面処理液2中に浸漬
され、側面からパイプ20が引出されポンプA11、フィル
ター10、導入管9、導入口1に連なる。
The conventional surface treatment apparatus is provided with an inlet 1 for the surface treatment liquid 2 at the center of the bottom plate 19 of the tank body 4 as shown in the sectional view of FIG.
A perforated plate 3 having a small hole is placed in front of the inlet 1, and an overflow portion 5 is provided around an opening 6 of the tank body 4. Further, an overflow return pipe is provided at a lower end of the overflow section 5.
Attach 17 and connect the other end to the heating tank 15. A heat exchanger 16 is immersed in the surface treatment liquid 2 in the heating tank 15, and a pipe 20 is drawn out from the side surface, and is connected to the pump A 11, the filter 10, the inlet pipe 9, and the inlet 1.

このような構成においてまず導入口1から導入された
表面処理液2は多孔板3の小孔を通過して更に上昇し開
口部6に達する。更に導入口1から導入される表面処理
液2の増加により開口部6から溢れ出た表面処理液2は
開口部6の周囲に設けられたオーバーフロー部5に流れ
落ちるとともにオーバーフロー戻り管17を伝わって加熱
タンク15に戻り熱交換器16により温度調整された後ポン
プA11によりパイプ20から吸引された表面処理力2はフ
ィルター10を経て導入管9、更に導入口1から槽本体4
の中へ導入される。
In such a configuration, first, the surface treatment liquid 2 introduced from the inlet 1 passes through the small holes of the perforated plate 3 and further rises to reach the opening 6. Further, the surface treatment liquid 2 which has overflowed from the opening 6 due to an increase in the surface treatment liquid 2 introduced from the inlet 1 flows down to the overflow section 5 provided around the opening 6 and is transmitted through the overflow return pipe 17 for heating. After returning to the tank 15 and adjusting the temperature by the heat exchanger 16, the surface treatment force 2 sucked from the pipe 20 by the pump A11 passes through the filter 10 to the inlet pipe 9, and further from the inlet 1 to the tank body 4
It is introduced into.

前記の状態において被表面処理物7は治具8に引掛け
られて多孔板3と開口部6の間に投入、浸漬、引き上げ
られることにより表面処理が行なわれることが知られて
いる。
It is known that in the above-mentioned state, the surface-treated object 7 is hooked on a jig 8, thrown between the perforated plate 3 and the opening 6, immersed, and pulled up to perform surface treatment.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

しかし従来の表面処理装置は被表面処理物7に対する
表面処理液2は表面処理液流18に示す通りまず導入口1
から導入された表面処理液2は多孔板3のために導入口
1の真正面ばかりでなく多孔板3全体に広がり、更に多
孔板3の小孔を通過し上昇するが、槽本体4に近い外周
部分な壁面流と言われているように槽本体4の壁面に添
って表面処理液流18は順調に上昇するものの槽本体4の
中央部分の表面処理液流18は開口部6付近で外側から中
央部分へ入り込むこととなり、下降流となって多孔板3
の近くへ戻り、再度槽本体4の壁面に添って上昇する回
遊流となる。また導入口1からの導入量を増加、減少さ
せた場合は多孔板3の小孔から噴出する表面処理液2の
スピードが速く又は遅くなるため前記の様な壁面流、中
央部分での下降流は著しく混乱した状態となり表面処理
液流18は安定したパターンにならず槽本体4の中の表面
処理液2の流速、液温は一定にならない。このため表面
処理液2として無電解メッキ液、エッチング液、洗浄の
ための酸、アルカリ液等の場合は被表面処理物7の表面
との通過速度が即品質に影響を与えるため、メッキ厚
み、エッチング深さ、洗浄程度のバラツキが大きくなっ
てしまう。更に前記の様な表面処理液流18の上昇流、下
降流、回遊流のために被表面処理物7、治具8、または
開口部6から表面処理液2中へ持ち込まれた微細なゴ
ミ、チリ等は速やかにオーバーフロー部5へ排出されず
槽本体4の中を回遊し被表面処理物7へ付着するため、
表面処理液2として無電解メッキ液を用いた場合は被表
面処理物7の表面に凸物が成形され、エッチング液の場
合はエッチング残り、洗浄液の場合は異物の付着となっ
て顕在化し、安定した表面処理品質が得られない。更に
表面処理液2として無電解メッキ液を用いた場合は無電
解メッキ液中の微細なゴミ、チリ、微粒子金属等は各々
を核として金属の析出が始まり、当初は無電解メッキ液
中を浮遊しているが徐々に重量を増すために析出物の下
降が始まり多孔板3の上面、または多孔板3の小孔を通
過して底板19上にたい積し、無電解メッキ液の寿命を著
しく短かくする等の問題点があった。
However, in the conventional surface treatment apparatus, the surface treatment liquid 2 for the surface treatment object 7 is first introduced into the inlet 1 as shown in the surface treatment liquid flow 18.
The surface treatment liquid 2 introduced from above spreads not only in front of the inlet 1 but also throughout the perforated plate 3 because of the perforated plate 3 and further rises through small holes in the perforated plate 3, but rises near the tank body 4. Although the surface treatment liquid flow 18 rises smoothly along the wall surface of the tank body 4 as it is said to be a partial wall flow, the surface treatment liquid flow 18 in the central part of the tank body 4 is close to the opening 6 from the outside. The perforated plate 3 enters the central part and becomes a downward flow.
, And becomes a migrating flow that rises again along the wall surface of the tank body 4. In addition, when the amount of introduction from the introduction port 1 is increased or decreased, the speed of the surface treatment liquid 2 ejected from the small holes of the perforated plate 3 becomes faster or slower, so that the above-described wall flow and the downward flow at the central portion Is extremely confused, and the surface treatment liquid flow 18 does not have a stable pattern, and the flow rate and the liquid temperature of the surface treatment liquid 2 in the tank body 4 are not constant. For this reason, when the surface treatment solution 2 is an electroless plating solution, an etching solution, an acid for cleaning, an alkali solution, or the like, the passing speed with the surface of the workpiece 7 immediately affects the quality. Variations in the etching depth and the degree of cleaning increase. Further, fine dust introduced into the surface treatment liquid 2 from the surface treatment object 7, the jig 8, or the opening 6 for the upward flow, the downward flow, and the migrating flow of the surface treatment liquid flow 18 as described above; The dust and the like are not immediately discharged to the overflow section 5 but migrate in the tank body 4 and adhere to the surface-treated material 7.
When an electroless plating solution is used as the surface treatment liquid 2, a convex is formed on the surface of the object to be treated 7; when the etching liquid is used, the etching remains; Surface treatment quality cannot be obtained. Further, when an electroless plating solution is used as the surface treatment solution 2, fine dust, dust, fine-particle metals, etc. in the electroless plating solution begin to deposit metal with each nucleus as a nucleus, and initially float in the electroless plating solution. However, since the weight gradually increases, the precipitation of the precipitate begins to fall and deposits on the bottom plate 19 through the upper surface of the perforated plate 3 or the small holes of the perforated plate 3, thereby significantly shortening the life of the electroless plating solution. There were problems such as hiding.

そこで本発明は従来のこのような問題点を解決するた
め少なくとも被表面処理物を浸漬する範囲内の表面処理
液流速、流れ方向を一定にし回遊流を無くすとともに析
出金属、微細なゴミ、チリ等を速やかに槽本体外に排出
することを目的とする。
Therefore, the present invention solves such a conventional problem by making the surface treatment liquid flow rate and flow direction constant at least within a range in which the object to be treated is immersed to eliminate the migrating flow, and to prevent precipitation metal, fine dust, dust, etc. The purpose of this is to quickly discharge out of the tank body.

〔問題点を解決するための手段〕[Means for solving the problem]

上記問題点を解決するために本発明の表面処理装置処
理装置は、槽中に充填された表面処理液、槽の開口部に
設けられた表面処理液のオーバーフロー部、槽の下部に
設けられた複数の孔を有する多孔板、前記槽の開口部の
近傍で且つ前記オーバーフロー部の下方に設けられた表
面処理液の第1の導入口、及び槽の底部に設けられた第
1の吸引口を具備してなる第1の槽、 槽中に充填された表面処理液、槽の側壁に設けられた
第2の導入口、第3の導入口、及び第2の吸引口を具備
してなる第2の槽、 前記第1の吸引口と前記第2の導入口は配管で結ばれ
てなり且つ配管途中には第1のポンプが配置されてな
り、 前記オーバーフロー部と前記第3の導入口は配管で結
ばれてなり、 前記第2の吸引口と前記第1の導入口は配管で結ばれ
てなり且つ配管途中には第2のポンプが配置されてな
り、 前記第2のポンプの吐出量は前記第1のポンプの吐出
量と前記オーバーフロー部のオーバーフロー量と等しく
かつ各々の値が正の値である条件で、前記第1の槽と第
2の槽間で表面処理液を循環させることを特徴とする。
In order to solve the above problems, the surface treatment apparatus of the present invention is provided with a surface treatment liquid filled in a tank, an overflow section of the surface treatment liquid provided in an opening of the tank, and a lower part of the tank. A perforated plate having a plurality of holes, a first inlet for the surface treatment liquid provided near the opening of the tank and below the overflow section, and a first suction port provided at the bottom of the tank. A first tank comprising a surface treatment liquid filled in the tank, a second inlet, a third inlet, and a second suction port provided on a side wall of the tank. The second tank, the first suction port and the second inlet are connected by a pipe, and a first pump is disposed in the middle of the pipe, and the overflow part and the third inlet are The second suction port and the first introduction port are connected by a pipe, and A second pump is arranged in the middle of one pipe, and the discharge amount of the second pump is equal to the discharge amount of the first pump and the overflow amount of the overflow section, and each value is a positive value. Under certain conditions, the surface treatment liquid is circulated between the first tank and the second tank.

〔作 用〕(Operation)

上記のように構成された表面処理装置の導入口から表
面処理液を導入すると多孔板の小孔から吸引される量よ
り導入量の方が多いために表面処理液は開口部からオー
バーフローが始まり、表面処理液中の多孔板の小孔から
の吸引とオーバフローが同時に行なわれる状態となる。
したがって開口部から持ち込まれる微細なゴミ、チリ等
はオーバーフローにより槽外へ排出され清浄な表面処理
液の維持が、また多孔板の小孔から常に一定の表面処理
液が吸引、槽外へ持ち出されるために一定の下降流、均
一な液温の確保ができる他、析出金属等は下降流により
速やかに槽外に排出することができるのである。
When the surface treatment liquid is introduced from the introduction port of the surface treatment apparatus configured as described above, since the introduction amount is larger than the amount sucked from the small holes of the perforated plate, the surface treatment liquid starts overflowing from the opening, A state in which the suction from the small holes of the perforated plate and the overflow in the surface treatment liquid are performed at the same time.
Therefore, fine dust, dust and the like brought in from the opening are discharged to the outside of the tank by overflow to maintain a clean surface treatment liquid, and a constant surface treatment liquid is always sucked out of the small holes of the perforated plate and taken out of the tank. Therefore, a constant downward flow and a uniform liquid temperature can be ensured, and the deposited metal and the like can be quickly discharged out of the tank by the downward flow.

〔実施例〕〔Example〕

以下に本発明の実施例を図面にもとづいて説明する。
第1図断面図のように槽本体4の上部に開口部6を設
け、その周囲にオーバーフロー部5を取りつける。開口
部6の下には槽本体4の周囲に均等の間隔で導入口1を
設ける。更に槽本体4の下部には小孔を多数設けた多孔
板3を置き、最下部の底板19の中心部分から吸引管A1
2、ポンプB13、戻り管14の順に接続され戻り管14の先端
は加熱槽15に開口する。前記と同様にオーバーフロー部
5の一部分に取り付けられたオーバーフロー戻り管17は
加熱槽15に開口する。一方加熱槽15から引出されたパイ
プ20は、ポンプA11、フィルター10、導入管9を経て槽
本体4の導入口1へ接続する。加熱槽15の中へは熱交換
器16を投入する。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
An opening 6 is provided in the upper part of the tank body 4 as shown in the sectional view of FIG. 1, and an overflow part 5 is attached around the opening. Under the opening 6, the inlets 1 are provided around the tank body 4 at equal intervals. Further, a perforated plate 3 having a large number of small holes is placed in the lower part of the tank body 4, and the suction pipe A 1 is inserted from the center of the lowermost bottom plate 19.
2. The pump B13 and the return pipe 14 are connected in this order, and the end of the return pipe 14 opens to the heating tank 15. As described above, the overflow return pipe 17 attached to a part of the overflow section 5 opens to the heating tank 15. On the other hand, the pipe 20 drawn from the heating tank 15 is connected to the inlet 1 of the tank body 4 via the pump A11, the filter 10, and the inlet pipe 9. The heat exchanger 16 is put into the heating tank 15.

上記のような構成において加熱槽15に投入された表面
処理液2は熱交換器16で調温されパイプ20を通りポンプ
A11に入る。ポンプA11に入った表面処理液は加圧吐出さ
れフィルター10に入り微細なゴミ、チリ等の粒子を補集
した後導入管9通って導入口1から槽本体4内へ吐出さ
れ、大部分は下降流となって槽本体4の下方にある多孔
板3の小孔を通過しポンプB13の吸引口に接続された吸
引管A12から吸引され戻り管14から加熱槽15へ戻る。一
方導入口1から導入された表面処理液の一部は開口部6
に上昇しオーバーフローした後オーバーフロー部5から
オーバーフロー戻り管17を通り加熱槽15へ戻る。このよ
うに導入口1から調温された表面処理液2が導入され下
降流となってポンプB13を経由して加熱槽15へ、他方上
昇流となって開口部6からオーバーフローしオーバーフ
ロー戻り管17から加熱槽15へ戻る状態が表面処理加工が
可能となった通常稼働時で、その時の表面処理液2の流
れは表面処理液流18に示す通りとなる。まず導入口1か
ら導入された表面処理液2はそのまま導入口1の延長線
上を進むこととなるが、多孔板3を通過して吸引される
表面処理液2と見合う量が下方向に下降を始める。この
場合多孔板3の小孔が多孔板3の平面に均等に分散して
あるため表面処理液2はどの部分でも均一な吸引が行な
われる。この結果導入口1から導入された表面処理液2
は導入口1をやや下がった位置から多孔板3までの間を
殆んど流速の差の無い整然とした下降流となる。一方導
入口1から導入された表面処理液2の中で下降流となら
なかった分は開口部6に向けて上昇し、やがてオーバー
フローすることによりオーバーフロー部5に流れ落ち
る。この様な状態を造り出すための条件としてはポンプ
A11吐出量=ポンプB13吸引量+オーバーフロー量が必要
で各々の値は正の値でなければならない他表面処理液2
の下降流、上昇流の調整は各々ポンプA11、ポンプB13の
吐出または吸引量を調整することにより行なうことがで
きる。
In the above configuration, the surface treatment liquid 2 charged into the heating tank 15 is temperature-controlled by the heat exchanger 16 and is pumped through the pipe 20.
Enter A11. The surface treatment liquid entering the pump A11 is discharged under pressure, enters the filter 10, collects fine dust, dust and the like, and is discharged through the introduction pipe 9 from the introduction port 1 into the tank body 4, and most of the liquid is collected. As a descending flow, it passes through the small hole of the perforated plate 3 below the tank body 4, is sucked from the suction pipe A 12 connected to the suction port of the pump B 13, and returns to the heating tank 15 from the return pipe 14. On the other hand, part of the surface treatment liquid introduced from the inlet 1
After overflowing, the flow returns from the overflow section 5 to the heating tank 15 through the overflow return pipe 17. In this way, the surface treatment liquid 2 whose temperature has been adjusted is introduced from the inlet 1 and forms a downward flow to the heating tank 15 via the pump B13, and an upward flow to overflow from the opening 6 and the overflow return pipe 17 Is returned to the heating tank 15 during normal operation when the surface treatment can be performed, and the flow of the surface treatment liquid 2 at that time is as shown by the surface treatment liquid flow 18. First, the surface treatment liquid 2 introduced from the introduction port 1 proceeds on the extension of the introduction port 1 as it is, but an amount corresponding to the surface treatment liquid 2 sucked through the perforated plate 3 descends downward. start. In this case, since the small holes of the perforated plate 3 are evenly distributed on the plane of the perforated plate 3, the surface treatment liquid 2 is uniformly suctioned at any portion. As a result, the surface treatment liquid 2 introduced from the inlet 1
Is an orderly descending flow from the position slightly lower than the inlet 1 to the perforated plate 3 with almost no difference in flow velocity. On the other hand, the part of the surface treatment liquid 2 introduced from the inlet 1 that has not become a downward flow rises toward the opening 6 and eventually overflows to the overflow part 5 due to overflow. The condition for creating such a state is a pump
A11 discharge amount = pump B13 suction amount + overflow amount is required, and each value must be a positive value. Other surface treatment liquid 2
The downward flow and the upward flow can be adjusted by adjusting the discharge or suction amounts of the pumps A11 and B13, respectively.

前記のような稼働状態の中へ治具8に引掛けられた被
表面処理物7を開口部6から投入し、導入口1よりやや
下がった所から多孔板3の直近までの間に浸漬し表面処
理加工を行なう。治具8及び表面処理物7が表面処理液
2中に浸漬された時の表面処理液流は治具8、被表面処
理物7が投入される前の状態と殆んど差がなく、前記表
面処理液流18そのものの状態を維持することとなる。以
上の実施例において導入口1と被表面処理物7までの上
下方向の距離を大きくとることは被表面処理物7の表面
を通過する下降流の速度、方向をより安定した均一なも
のとするために有効な方法で、その場合にはオーバーフ
ロー部5の位置を下方向へ下げ、導入口1を上方向へ上
げる。即ちオーバーフロー部5の中に導入口1を設ける
ことにより容易に実現できるほか、導入口1を槽本体4
の側面に設けるかわりに、開口部6内周部へ上方向から
パイプを突き入れることにより行なうことができる。
The surface-treated object 7 hooked on the jig 8 is put into the operating state as described above through the opening 6, and is immersed between a position slightly lower than the inlet 1 and immediately near the perforated plate 3. Perform surface treatment. The flow of the surface treatment liquid when the jig 8 and the surface treatment object 7 are immersed in the surface treatment liquid 2 is almost the same as the state before the jig 8 and the surface treatment object 7 are introduced. The state of the surface treatment liquid flow 18 itself is maintained. In the above embodiment, increasing the vertical distance between the inlet 1 and the surface-treated object 7 makes the velocity and direction of the downward flow passing through the surface of the surface-treated object 7 more stable and uniform. In this case, the position of the overflow section 5 is lowered downward, and the inlet 1 is raised upward. That is, it can be easily realized by providing the inlet 1 in the overflow part 5, and the inlet 1 is connected to the tank body 4
Can be performed by inserting a pipe into the inner peripheral portion of the opening 6 from above in place of the side surface.

〔発明の効果〕〔The invention's effect〕

本発明は以上説明したように開口部直近に導入口を設
け、開口部から表面処理液をオーバーフローするととも
に多孔板小孔から吸引するという構造により被表面処理
物を浸漬する範囲の表面処理液の流速、流れ方向を均一
に、しかも多孔板3部分から吸引する下降流により表面
処理液中の析出金属粒等を槽本体外に搬出する、さらに
オーバーフローにより微細なゴミ、ケバ等を槽外に速や
かに排出することにより被表面処理物の表面品質の向
上、表面処理液の寿命の向上等著しい効果がある。
The present invention provides an inlet near the opening as described above, and a surface treatment liquid in a range where the surface treatment liquid is immersed by a structure in which the surface treatment liquid overflows from the opening and is sucked from the small holes of the perforated plate. The flow velocity and flow direction are made uniform, and the deposited metal particles in the surface treatment liquid are carried out of the tank body by the downward flow sucked from the perforated plate 3 portion. Further, fine dust and fluff are quickly discharged out of the tank by overflow. By discharging to the surface, there are remarkable effects such as improvement of the surface quality of the object to be treated and improvement of the service life of the surface treatment liquid.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明にかかる表面処理装置の断面図。 第2図は従来の表面処理装置の断面図である。 1……導入口 2……表面処理液 3……多孔板 4……槽本体 6……開口部 7……被表面処理物 18……表面処理液流 FIG. 1 is a sectional view of a surface treatment apparatus according to the present invention. FIG. 2 is a sectional view of a conventional surface treatment apparatus. DESCRIPTION OF SYMBOLS 1 ... Inlet 2 ... Surface treatment liquid 3 ... Perforated plate 4 ... Tank body 6 ... Opening 7 ... Surface treatment object 18 ... Surface treatment liquid flow

フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H05K 3/42 6921−4E H05K 3/42 Z Continued on the front page (51) Int.Cl. 6 Identification number Agency reference number FI Technical display location H05K 3/42 6921-4E H05K 3/42 Z

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】槽中に充填された表面処理液、槽の開口部
に設けられた表面処理液のオーバーフロー部、槽の下部
に設けられた複数の孔を有する多孔板、前記槽の開口部
の近傍で且つ前記オーバーフロー部の下方に設けられた
表面処理液の第1の導入口、及び槽の底部に設けられた
第1の吸引口を具備してなる第1の槽、 槽中に充填された表面処理液、槽の側壁に設けられた第
2の導入口、第3の導入口、及び第2の吸引口を具備し
てなる第2の槽、 前記第1の吸引口と前記第2の導入口は配管で結ばれて
なり且つ配管途中には第1のポンプが配置されてなり、 前記オーバーフロー部と前記第3の導入口は配管で結ば
れてなり、 前記第2の吸引口と前記第1の導入口は配管で結ばれて
なり且つ配管途中には第2のポンプが配置されてなり、 前記第2のポンプの吐出量は前記第1のポンプの吐出量
と前記オーバーフロー部のオーバーフロー量と等しくか
つ各々の値が正の値である条件で、前記第1の槽と第2
の槽間で表面処理液を循環させることを特徴とする表面
処理装置システム。
1. A surface treatment liquid filled in a tank, an overflow section of the surface treatment liquid provided in an opening of the tank, a perforated plate having a plurality of holes provided in a lower part of the tank, and an opening of the tank. A first tank provided with a first inlet for the surface treatment liquid provided in the vicinity of and below the overflow section, and a first suction port provided at the bottom of the tank; Surface treatment liquid, a second tank provided with a second inlet, a third inlet, and a second suction port provided in a side wall of the tank, the first suction port and the second suction port. The second inlet is connected by a pipe and a first pump is arranged in the middle of the pipe, the overflow section and the third inlet are connected by a pipe, and the second suction port is provided. And the first inlet is connected by a pipe, and a second pump is disposed in the middle of the pipe, In serial condition discharge amount of the second pump overflow amount and equal and the value of each of the discharge amount and the overflow portion of the first pump is a positive value, the first tank and the second
A surface treatment liquid circulating between the tanks.
JP61136792A 1986-06-12 1986-06-12 Surface treatment system Expired - Fee Related JP2590319B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61136792A JP2590319B2 (en) 1986-06-12 1986-06-12 Surface treatment system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61136792A JP2590319B2 (en) 1986-06-12 1986-06-12 Surface treatment system

Publications (2)

Publication Number Publication Date
JPS62294182A JPS62294182A (en) 1987-12-21
JP2590319B2 true JP2590319B2 (en) 1997-03-12

Family

ID=15183623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61136792A Expired - Fee Related JP2590319B2 (en) 1986-06-12 1986-06-12 Surface treatment system

Country Status (1)

Country Link
JP (1) JP2590319B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011256444A (en) * 2010-06-10 2011-12-22 Sumitomo Bakelite Co Ltd Substrate treating method and substrate treating apparatus
JP2012046770A (en) * 2010-08-24 2012-03-08 Sumitomo Bakelite Co Ltd Apparatus and method for processing substrate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62290875A (en) * 1986-06-09 1987-12-17 Seiko Epson Corp Surface treatment device

Also Published As

Publication number Publication date
JPS62294182A (en) 1987-12-21

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