JPH0233857Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a circulating fluid filtration device for removing air bubbles and particulates from the circulating fluid in a set link tank (liquid storage tank) used in a high-speed plating device or the like.

Conventionally, in high-speed plating, etc., most of the plating liquid is stored in a set link tank (liquid storage tank) to control the liquid temperature, and a portion of this liquid is sent to the plating tank for plating. A method in which high-speed plating is performed using discharge jets, etc. in a tank, and then the plating liquid is returned to the set link tank, and in this way the plating liquid is circulated between the set link tank and the plating tank. As is well known, it has recently become very popular. However, the following problems arose in implementing this method. That is, (a) In order to improve plating quality, it is necessary to constantly remove floating impurities in the plating solution (oils and fats brought in, dust, particulates due to equipment wear, organic and inorganic impurities generated by electrolysis, etc.). For this reason, an overflow system is usually adopted in the plating tank, but because the amount of circulating plating solution is large, the plating solution traps air bubbles during jet flow, overflow, and reflux, causing the plating solution to set. The air bubbles flow into the link tank, and before they escape into the atmosphere, they are sucked into the circulation pump again and ejected into the plating tank, where they directly hit the items to be plated, resulting in poor plating. Problem (b) Normally, a filter is installed to continuously filter the plating liquid in the set link tank 11, but in this case, the filter sucks in the liquid containing air bubbles, which causes air to flow inside the filter. (3) Particulates flowing in from the plating tank (for example, dust entering from the surroundings, fine particles from the rubber belt of the conveyor, etc.) are not filtered in the set link tank. Then, the plating liquid flows into the plating tank again (the amount of circulating liquid is several times larger than the amount of filtrate, and the turbulence of the plating liquid in the set link tank is extremely large, making it difficult to perform filtration satisfactorily). This causes problems such as clogging the jet holes or hitting the item to be plated, resulting in poor plating. The device of the present invention solves the above-mentioned problems. This will be explained in detail below using figures.

FIG. 1 is a perspective view of the receiving tank section of the device of the present invention. A receiving tank 1 is divided into two by a partition plate 2. The upper edge of the partition plate 2 is appropriately lower than the upper edge of the receiving tank 1. It is more effective to divide it in the longitudinal direction of the receiving tank 1. One of the two halves is used as an inflow liquid receiving part 3, and the other part is used as an overflow liquid receiving part 4. A liquid outlet 5 in the form of a slit or the like is provided in the lower part of the side surface of the receiving tank 1 on the opposite side of the partition plate 2 in the overflow liquid receiving part 4 in a range as long as possible in the horizontal direction.
If necessary, an overflow notch 7 is provided at the top of this side surface. This is because when the temperature of the plating liquid remaining in the filter medium 8 decreases when the operation is stopped, crystals etc. are formed and the passage of the liquid deteriorates. The warm plating liquid is circulated and poured onto the filter medium 8, which serves to overflow until the crystals and the like are dissolved and the liquid becomes permeable again. However, when the operation is stopped and the temperature of the liquid drops, such as with nickel plating liquid, the boric acid in the liquid crystallizes and significantly obstructs the flow of the liquid, and it may not be easy to dissolve it again. For such a case, it is optional to provide in advance drain holes 6, 6, .

FIG. 2 is a conceptual diagram of a flow sheet of an embodiment of the present invention. The receiving tank 1 is set at an appropriate position in the upper part of the set link tank 11. In this position, it is preferable that the upper edge of the receiving tank 1 is slightly lower than the upper edge of the set link tank 11 as a countermeasure against overflow. The outlet of the plating liquid return pipe 16 from the plating tank 15 is connected to the inflow liquid receiving part 3.
Installed within or above it. A filter medium 8 is set in the overflow liquid receiving part 4 lower than the upper edge of the partition plate 2. It is desirable that the filter medium 8 is slightly larger in planar size. In this way, the liquid hardly bypasses around the filter medium 8.
If necessary, an overflow guide plate 9 is placed from the upper edge of the partition plate 2 to the filter medium 8. Also, receiving tank 1
When the bottom surface of the plate is higher than the plating liquid level in the set link tank 11, an inflow liquid guide plate 10 that reaches the liquid level is suspended from the liquid outlet 5.

The movement of the plating liquid in FIG. 2 will be explained as follows. The plating liquid in the set link tank 11 is sucked in from the circulation pump piping suction port 12 by the operation of the circulation pump 13, and passes through the circulation pump 13 to the circulation pump piping discharge port 14 in the plating tank 15. The plating liquid flows out from the plating tank 15 and flows into the inflow liquid receiving portion 3 in the receiving tank 1 through the plating liquid return pipe 16. The above-mentioned set link tank 11, circulation pump piping suction port 12, circulation pump 13, circulation pump discharge port 14, plating tank 1
5 and the plating liquid return pipe 16 are those normally provided in recent liquid circulation type high-speed plating apparatuses. Further, in this case, consideration is given to providing a transverse section in the middle of the plating liquid return pipe 16 so that the inflow speed is slowed down. The plating liquid fills the inflow liquid receiving part 3, overflows gently from the entire upper edge of the partition plate 2, and is quietly poured onto the filter medium 8 set in the overflow liquid receiving part 4. Next, the plating liquid passes through the filter medium and quietly flows back into the set link tank 11 from the liquid outlet 5.

As described above, the present invention has the following effects.

(b) The device of the present invention can be easily installed without major modification of the existing set-link tank.

(b) Most of the air bubbles contained in the reflux liquid are released into the atmosphere at the inflow liquid receiving part 3, and most of the remaining air bubbles are separated and released when passing through the filter medium 8, and the liquid is gently set. Since it flows into the tank 11,
Air bubbles are almost never sucked into the circulation pump 13 and the filter.

(c) Most of the particles, except for ultrafine particles, are captured by the filter medium 8 and do not flow into the set link tank 11. Therefore, even if a filter for ultrafine particles is used, the filter medium in the filter does not become clogged in a short period of time as in the conventional case, and the replacement cycle of the filter medium in the filter can be extended.

(d) The filter medium 8 used in the device of the present invention is easy to replace, and the time for replacement can be determined visually.

Due to the above-mentioned effects, the device of the present invention is particularly suitable for high-speed plating of electronic parts requiring precision plating.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of the receiving tank of the present invention, and Fig. 2 is a conceptual diagram of the flow sheet of the embodiment of the present invention, and the symbols in the figure are respectively 1: receiving tank, 2: partition plate, 3: inflow liquid receiving part. ,
4: Overflow liquid receiving part, 5: Liquid outlet,
6, 6...: Drain hole, 7: Overflow notch, 8:
Filter medium, 9: Overflow guide plate, 10: Influent guide plate, 11: Set link tank, 12: Circulation pump piping suction port, 13: Circulation pump, 14: Circulation pump piping discharge port, 15: Plating tank, 16: The plating liquid reflux piping is shown in each figure.

Claims (1)

[Scope of utility model registration request] A receiving tank 1 is divided into two parts by a partition plate 2, and one part is made into an inflow liquid receiving part 3 and the other part is made into an overflow liquid receiving part 4. A liquid outlet 5 is provided at the lower side of the receiving tank 1 on the opposite side of the partition plate 2 in the overflow liquid receiving part 4. A circulating liquid characterized in that a receiving tank 1 is set in the upper part of the set link tank 11, an outlet of the plating liquid return pipe 16 is provided in the inflow liquid receiving part 3, and a filter medium 8 is set in the overflow liquid receiving part 4. Filtration device.