JP2588461Y2 - Circuit board - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board in which a circuit component having a pair of electrodes having polarities is mounted on a board and the electrodes are conductively fixed to land electrodes formed on the board.

[0002]

2. Description of the Related Art A circuit component such as an electrolytic capacitor has a pair of electrodes having a polarity. When such a circuit component is mounted on a circuit board, it must be mounted in a predetermined direction. Must. FIG. 7A shows a conventional example in which the circuit component 1 having such a polarity is mounted on a circuit board. That is, the circuit component 1 has a pair of electrodes 2 and 3 from the opposite end surfaces to the bottom surface. In the case of FIG. 7A, the electrode 2 is an anode and the electrode 3 is a cathode. On the other hand, a pair of land electrodes 4, 5 for electrically fixing the electrodes 2, 3 by soldering or the like are formed on the substrate 8 so as to face each other.
A resistor 7 is connected to the land electrode 4 to which the electrode 3 is to be conductively fixed, and a transistor 6 is connected to the land electrode 5 to which the electrode 3 as the cathode of the circuit component 1 is to be conductively fixed. FIG. 8A shows a circuit diagram when the circuit is mounted as described above.

The electrodes 2 and 3 of this kind of conventional circuit component 1 are all formed in the same shape, and the land electrodes 4 and 5 on the substrate 1 are also formed in the same shape. Conventionally, the circuit component 1 having such a polarity is
In mounting on the upper side, the mounting direction was determined by visually observing a mark indicating the polarity attached to the upper surface of the circuit component 1.

[0004]

However, in the visual confirmation of the mark, an error in the mounting direction of the circuit component 1 sometimes occurs, and as shown in FIG. 7B, the circuit component 1 is mounted in the opposite direction. Sometimes. FIG. 8 (b) shows a circuit diagram when mounted as described above. By the way, when the circuit component is a semiconductor component such as a diode, a predetermined circuit operation cannot be obtained in the inspection of the electric circuit operation, so that it is easily found that the circuit component 1 is mounted in the opposite direction. However, in the case of electrolytic capacitors,
In the instantaneous circuit operation inspection, a predetermined circuit operation can be obtained. Therefore, such an electrical inspection often does not prove that the components are mounted in the opposite direction. Therefore, the circuit board may be shipped as a product while being mounted in the opposite direction.

As described above, when the circuit board is shipped and used while the circuit component 1 such as the electrolytic capacitor is mounted on the board 8 in the opposite direction, the circuit board 1 can withstand all use for a long time. Can not be destroyed. Further, the function of the circuit board stops. In view of such a conventional problem, the present invention provides a circuit board in which when a circuit component having polarity is erroneously mounted on a circuit board in an opposite direction, the error can be easily found in an electrical test. The purpose is to do.

[0006]

Means for Solving the Problems That is, in the present invention,
In order to achieve the above object, a substrate 20 having a circuit formed thereon is provided.
A circuit component 11 is mounted thereon, and a pair of land electrodes 14, 15 on a substrate 20 to which a circuit is connected are connected to a pair of electrodes 12, 13 having polarities formed on both ends of the bottom surface of the circuit component 11. In the circuit board, the electrodes 12 and 13 of the circuit component 11 are formed such that one of the electrodes 12 and 13 has a smaller length or width than the other, and the land electrodes 14 and 15 on the substrate 20 have the length of one of them. Alternatively, the width of the land electrode 15 is smaller than that of the
When the circuit component 11 is mounted on the substrate 20 in the correct direction, one large electrode 13 is mounted thereon, but when the circuit component 11 is mounted in the opposite direction, the other small electrode 12 is mounted.
Is provided at a position where it does not rest on the circuit board.

In this case, when the circuit component 11 is mounted in the correct direction on the side of the substrate 20 on which the small land electrodes 15 are arranged, the circuit component 11 is connected to the circuit corresponding to the location where the large electrode 13 is located. It is preferable that another land electrode 15 ′ which is not formed is insulated from the land electrode 15.

[0008]

In the circuit board according to the present invention, the circuit components 11
If the smaller electrode 12 is placed on the large land electrode 14 and fixedly conductive, and the other large electrode 13 of the circuit component 11 is placed on the smaller land electrode 15 and fixedly conductive, each electrode 12 of the circuit component 11 is fixed. , 13 can be connected to a circuit on the substrate 20.

On the other hand, when the circuit component 11 is mounted in the opposite direction, one of the small electrodes 12 does not rest on the small land electrode 15, so that the electrodes 12 and the land electrode 15 are not conductively fixed. For this reason, the same electrode 12
It is not connected to a circuit formed on the substrate 20. That is, the circuit is in an open state. Therefore, the circuit component 11
Are mounted in the opposite direction, a predetermined circuit operation cannot be obtained in an electrical circuit operation test due to the open state of the circuit. This makes it easy to determine that the circuit component 11 has been mounted in the opposite direction.

The small land electrode 1 on the substrate 20
When the circuit component 11 is mounted in the correct direction on the side on which the large electrode 13 is placed, the other land electrode 1 not connected to the circuit corresponds to the position where the large electrode 13 is located.
By forming 5 ', when the circuit component 11 is mounted in the correct orientation, the electrode 13 can be conductively fixed also to the land electrode 15'. The electrode land 15 ′ is a dummy electrode that is not connected to a circuit, so to speak, but is effective in reinforcing the conductive fixing strength of the electrode 13 by only the small land electrode 15 and obtaining a stronger conductive fixing strength. .

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows an arrangement of land electrodes 14, 15, 15 'on a circuit board 20 and a plan view of electrodes 12, 13 of a circuit component 11 mounted thereon. FIG. Is shown. Circuit component 1
1 is a cubic shape, and a pair of electrodes 12 and 13 are formed from the opposite end face to the bottom face. The length of one of the electrodes 12 and 13, for example, in the illustrated example, the length of the electrode 12 serving as an anode on the bottom surface of the circuit component 11 (refers to the dimension in the direction in which the electrodes 12 and 13 face each other).
Are formed considerably shorter than the other electrode 13.
Specifically, one electrode 12 is formed to be less than half the length of the other electrode 13.

On the other hand, these electrodes 12,
A pair of land electrodes 14 and 15 for conductively fixing 13 are formed. A land electrode 15 of the pair of land electrodes 14 and 15 to which the cathode 13 is to be conductively fixed.
Is formed to be considerably shorter in length than the other land electrode 14. Specifically, one land electrode 15 is formed to have a length that is less than half the length of the other land electrode 14. Moreover, the interval between the electrode lands 14 and 15 is set smaller than the interval between the electrodes 12 and 13 of the circuit component 11.
Therefore, as shown in FIG. 1C and FIG. 2B, the circuit component 11 is in the opposite direction and one of the electrodes 13
Is mounted on the substrate 20 so as to rest on the land electrode 14, one electrode 13 of the circuit component 11 is located at a position shifted inward from the other electrode 12 of the circuit component 11. Then, a resistor 17 which is one of the elements constituting the circuit formed on the substrate 20 is connected to the land electrode 14,
Further, the base of the transistor 6 is connected to the other small land electrode 15.

Further, outside the land electrode 15,
Another land electrode 15 ′ that is not connected to a circuit is formed so as to be insulated from the land electrode 15. As shown in FIGS. 1B and 2A, when the circuit component 11 is mounted on the substrate 20 in a correct direction, the outer portion of the large electrode 13 on the cathode side is placed on the land electrode 15 '. Formed at the location. That is, the electrode 13 serving as the cathode at this time is mounted on both of the two land electrodes 15 and 15 ′ arranged side by side, and is soldered over these land electrodes 15 and 15 ′. On the other hand, FIG. 1 (c) and FIG.
As shown in (b), when the circuit component 11 is mounted in the opposite direction, the electrode 12 of the circuit component 11 serving as an anode is
Of the layers 5 and 15 ', they are mounted only on the outer land electrode 15', and are soldered only to them. Since the other land electrode 14 is large, the electrode 12 or 13 is placed and soldered when the circuit component 11 is mounted correctly or when the circuit component 11 is mounted in the opposite direction.

As described above, FIGS. 1B and 2A
The circuit component 11 is placed on the substrate 20 in the direction shown by
The state in which the circuit components 2 and 13 are soldered is a case where the circuit component 11 is mounted in a correct direction. In this case, FIG.
As shown in FIG. 1A, both electrodes 12 and 13 of the circuit component 11 are connected to a resistor 17 and a transistor 16 as circuit elements via land electrodes 14 and 15, respectively.

On the other hand, FIGS. 1C and 2B
3B, when the circuit components 11 are mounted on the substrate 20 in the opposite direction and the electrodes 12 and 13 are soldered.
As shown by, the electrode 13 of the circuit component 11 is connected to the resistor 17 through the land electrode 14, while the other electrode 12
Are soldered only to the dummy land electrodes 15 '.
Therefore, the electrode 12 is not connected to the transistor 16 connected to the land electrode 15, and the circuit is in an open state. For this reason, when a circuit operation test is performed, a predetermined circuit operation cannot be obtained, and it is found that the circuit component 11 is mounted in the opposite direction.

Next, the embodiment shown in FIGS. 4 and 5 will be described. As shown in FIG. 4, in this embodiment, the land electrode 1
4, 15 and 15 'are formed to have a width which is about twice as large as that of the above-described embodiment, and two circuit components 11 can be mounted side by side thereon. Accordingly, if the circuit component 11a on the right side in FIG. 4 is erroneously mounted in the opposite direction, the error can be recovered by mounting the circuit component 11b in the correct direction next to the circuit component 11a. That is,
As shown in FIG. 5, the circuit component 11a mounted first in the opposite direction is substantially open as a circuit element because one electrode 12 is not connected to the circuit and is in an open state. I can't get it. On the other hand, the circuit component 11a mounted later in the correct orientation can function as a circuit element because both electrodes 12, 13 are connected to the circuit.

Next, the embodiment of FIG. 6 will be described. In this embodiment, of the electrodes 12 and 13 of the circuit component 11,
One electrode, for example, the electrode 12 serving as an anode in the illustrated example
The width at the bottom surface of the circuit component 11 (measured in a direction orthogonal to the direction in which the electrodes 12 and 13 are opposed to each other) is formed to be narrower than the other electrode 13 by about half. In addition, the electrode 12 is positioned with respect to the center of the circuit component 11 in FIG.
In (a), it is formed so as to be biased to the right.

On the other hand, of the pair of land electrodes 14 and 15 formed on the substrate 20, the land electrode 15 to which the cathode 13 is to be conductively fixed has a width equal to that of the other land electrode 1.
4 is formed to be about half as narrow as that of FIG. Further, the land electrode 15 is formed so as to be deviated rightward in FIG. 6A with respect to the center of the land electrode 14. Substrate 2
The point that a resistor 17 which is one of the elements constituting the circuit formed on the reference numeral 0 is connected to the land electrode 14 and the base of the transistor 6 is connected to the small land electrode 15 is the same as the above-described embodiment. It is.

Further, beside the land electrode 15, another land electrode 1 not connected to a circuit is provided beside the land electrode 15.
5 'is formed so as to be insulated from the land electrode 15. The land electrode 15 ′ is formed so as to be deviated leftward in FIG. 6A with respect to the center of the land electrode 14, and the overall width of the land electrodes 15, 15 ′ is substantially equal to that of the other land electrode 14. Is the same.

In this embodiment, as shown in FIG. 6A, when the circuit component 11 is mounted on the substrate 20 in a correct orientation, the electrode 13 serving as a cathode is replaced by two land electrodes 15 and 15 arranged side by side. ′ And soldered over these two land electrodes 15, 15 ′. The electrode 12 serving as the anode is soldered to the other land electrode 14. Therefore, both electrodes 12 and 13 of the circuit component 11 are connected to the resistor 17 and the transistor 16 which are circuit elements via the land electrodes 14 and 15, respectively.

On the other hand, as shown in FIG. 6B, when the circuit component 11 is mounted in the opposite direction,
The one electrode 12 is placed only on the dummy land electrode 15 ′ among the electrodes 15 and 15 ′, and is soldered to only that. Therefore, the electrode 12 is not connected to the transistor 16 connected to the land electrode 15, and the circuit is in an open state. Therefore, when a circuit operation test is performed,
The predetermined circuit operation was not obtained, and it was found that the circuit component 11 was mounted in the opposite direction. In the above-described embodiment, the cathode electrode 12 of the circuit component 11 is made smaller, and the anode land electrode 15 on the substrate 20 is made smaller.

[0022]

As described above, according to the present invention, when a circuit component having a polarity is erroneously mounted on a circuit board in an opposite direction, the circuit is in an open state. The error is easily found in the test. As a result, it is possible to prevent a situation in which the product is shipped while the circuit components are erroneously mounted on the circuit board, and the reliability of the product can be improved.

[Brief description of the drawings]

FIG. 1 shows a main part of a circuit board according to an embodiment of the present invention, a circuit component mounted thereon, a state in which the circuit component is mounted on a board in a correct direction, and a state in which the circuit component is mounted on a board in a reverse direction. It is a top view each showing a state.

FIG. 2 is a partially longitudinal side view showing a state where the circuit component is mounted on the board in a correct direction and a state where the circuit component is mounted on the board in a reverse direction in the circuit board according to the embodiment.

FIG. 3 is an equivalent circuit diagram showing a state where the circuit components are mounted on the substrate in a correct direction and a state where the circuit components are mounted on the substrate in a reverse direction in the circuit board according to the embodiment.

FIG. 4 is a plan view illustrating a circuit board according to another embodiment of the present invention;

FIG. 5 is an equivalent circuit diagram of the circuit board according to the embodiment.

FIG. 6 is a circuit board according to another embodiment of the present invention;
It is a top view which shows the state which mounted the circuit component on the board | substrate in the correct direction, and the state which mounted the circuit component on the board | substrate in the opposite direction, respectively.

FIG. 7 is a plan view showing a state in which circuit components are mounted on a board in a correct direction and a state in which circuit components are mounted on a board in a reverse direction in a conventional circuit board.

FIG. 8 is an equivalent circuit diagram showing a state in which circuit components are mounted on the substrate in a correct direction and a state in which circuit components are mounted on the substrate in an opposite direction in the circuit board according to the conventional example.

[Explanation of symbols]

 Reference Signs List 11 circuit component 12 electrode of circuit component 13 electrode of circuit component 14 land electrode of substrate 15 land electrode of substrate 15 'electrode of circuit component 20 substrate

Claims (2)

(57) [Scope of request for utility model registration] 1. A circuit component 11 is mounted on a substrate 20 on which a circuit is formed, and a pair of land electrodes 14 and 15 on the substrate 20 to which the circuit is connected are provided on both ends of a bottom surface of the circuit component 11. A pair of electrodes 12 having the formed polarity,
In the circuit board on which the conductive material 13 is fixed, one of the electrodes 12, 13 of the circuit component 11 is formed to have a length or width smaller than that of the other.
15 is formed such that one of the lengths or widths is smaller than the other, and the small land electrode 15 is configured such that when the circuit component 11 is mounted on the substrate 20 in a correct direction, one large electrode 13 Wherein the other small electrode 12 is arranged at a position where the other small electrode 12 is not placed thereon when the circuit component 11 is placed in the opposite direction. 2. In the above-mentioned claim 1, when the circuit component 11 is mounted in a correct direction on the side of the substrate 20 on which the small land electrodes 15 are arranged, corresponding to the location where the large electrode 13 is located, A circuit board on which another land electrode 15 ′ not connected to a circuit is formed so as to be insulated from the land electrode 15.