JP2584532B2 - Burn-in board - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a burn-in board used when performing burn-in on a semiconductor device.

[Conventional technology]

FIG. 2 is a plan view showing a conventional burn-in system, in which 2 is a burn-in board, 3 is a driver on a driver board provided in the burn-in apparatus,
Reference numeral 4 denotes a connector for connecting the burn-in board 2 and the driver board during burn-in, reference numeral 5 denotes a pattern signal line, and reference numeral 6 denotes a semiconductor device (Device und) to be tested.
This is a DUT socket that can be attached and detached.

 Next, the operation will be described.

When the burn-in of the semiconductor device is performed, the input signal waveform generated from one driver 3 on the driver board in the burn-in apparatus is transmitted through the connector 4 connecting the burn-in board 2 and the driver board.
The signal enters the pattern signal line 5 on the burn-in board 2, is transmitted to a plurality of DUT sockets 6 of the burn-in board 2, and is sent to the semiconductor device mounted in the DUT socket 6.

[Problems to be solved by the invention]

Since the conventional burn-in board is configured as described above, if it is used as it is during a characteristic test such as after burn-in of a semiconductor device, an input signal generated from one driver 3 on the driver board is When driving a plurality of DUT sockets 6, a phenomenon in which Tr / Tf (rise time / fall time) of a signal waveform is reduced due to the load capacitance of the DUT socket 6, the pattern signal line 5, and the semiconductor device itself. Occurs. That is, it takes time for the input signal to rise or fall to a certain voltage, and the slope of the rising or falling portion of the rectangular wave as the input signal becomes gentle.

As a result, it has been extremely difficult to perform a characteristic test of inputting an input signal to the semiconductor device in the DUT socket 6 and observing the output with high timing accuracy.

Here, in order to reduce such rounding of the input signal waveform, it is necessary to reduce the number of semiconductor devices to be tested at one time. Therefore, when performing a test, the semiconductor devices must be transferred to a different board. There was a problem that it did not.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is a burn-in board that can be used without any problems such as delays of rising and falling of input signals and rounding of waveforms even at the time of characteristic tests of individual semiconductor devices. The purpose is to obtain.

[Means for solving the problem]

The burn-in board according to the present invention is divided into a plurality of small boards so that the small boards can be connected and disconnected from each other.

[Action]

The burn-in board according to the present invention reduces the number of DUT sockets driven by one driver of the burn-in apparatus by separating the burn-in board and performing a test for each small board during a characteristic test of the semiconductor device, thereby reducing the input generated from the driver. Tr / T in signal waveform
The rounding of f is small, and the process of the characteristic test can be measured with high timing accuracy.

〔Example〕

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a burn-in board according to an embodiment of the present invention. In the drawing, reference numeral 1 denotes a small board used in a characteristic test of a semiconductor device, 2 denotes a burn-in board in which a plurality of small boards 1 are connected, Reference numeral 3 denotes a driver on a driver board provided in the burn-in device, 4 denotes a connector for connecting the burn-in board 2 and the driver board during burn-in, or a connector for connecting the small boards 1 to each other, 5 denotes a pattern signal line, Reference numeral 6 denotes a DUT socket to which a semiconductor device can be attached and detached.

When conducting a characteristic test of a semiconductor device using the burn-in board 2, first, the connector 4 is cut off, the burn-in board 2 is divided into small boards 1, and the small board is used as a unit to mount a semiconductor device. This is connected to a driver board in a test apparatus to perform a test.

In this state, the driver 3 of the burn-in device
Since the number of driving DUT sockets per one of the semiconductor devices is reduced, the load capacitances of the DUT sockets 6, the pattern signal lines 5, and the semiconductor device itself are also reduced, and the input signal waveform generated from the driver 3 when testing the semiconductor device. Is improved, that is, Tr / Tf rounding is reduced, and it is possible to obtain an input signal waveform capable of measuring a test process with high timing accuracy.

When the burn-in of the semiconductor device is performed, the small boards 1 are connected to each other at the connector 4 to form the burn-in board 2, so that one driver 3 can drive many DUT sockets 6.

As described above, in this embodiment, the connectors provided on the plurality of small boards that constitute the burn-in board allow the small boards to be connected and disconnected from each other, so that the input signal waveform that can be measured with high timing accuracy is obtained. At the time of the required semiconductor device characteristic test, the burn-in board is separated and the test is performed for each small board.
Burn-in boards can be used for both burn-in and characteristic tests, such as connecting small boards when burning in many semiconductor devices at once.
In this case, it is not necessary to transfer the semiconductor device each time.

〔The invention's effect〕

As described above, according to the present invention, the small boards can be connected and disconnected from each other by the connector provided on each of the small boards constituting the burn-in board. Thus, the burn-in board can be used together, and there is an effect that the trouble of transferring the semiconductor device every time is eliminated.

[Brief description of the drawings]

FIG. 1 is a plan view showing a burn-in board according to an embodiment of the present invention, and FIG. 2 is a plan view showing a conventional burn-in board. In the figure, 1 is a small board, 2 is a burn-in board, 3
Is a driver, 4 is a connector, 5 is a pattern signal line, 6
Is a DUT socket. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (1)

(57) [Claims] 1. A burn-in board used for performing burn-in on a semiconductor device, wherein the burn-in board can be connected to and disconnected from at least two or more small boards, and the small boards supply signals to the semiconductor devices on the board. A burn-in board characterized by being able to do so.