JP2583809Y2 - 発光ダイオードランプ - Google Patents

発光ダイオードランプ

Info

Publication number
JP2583809Y2
JP2583809Y2 JP10171490U JP10171490U JP2583809Y2 JP 2583809 Y2 JP2583809 Y2 JP 2583809Y2 JP 10171490 U JP10171490 U JP 10171490U JP 10171490 U JP10171490 U JP 10171490U JP 2583809 Y2 JP2583809 Y2 JP 2583809Y2
Authority
JP
Japan
Prior art keywords
stem
light
light emitting
emitting diode
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP10171490U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0459168U (US20080293856A1-20081127-C00150.png
Inventor
邦彦 博田
方紀 道盛
堅太郎 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP10171490U priority Critical patent/JP2583809Y2/ja
Publication of JPH0459168U publication Critical patent/JPH0459168U/ja
Application granted granted Critical
Publication of JP2583809Y2 publication Critical patent/JP2583809Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP10171490U 1990-09-27 1990-09-27 発光ダイオードランプ Expired - Lifetime JP2583809Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10171490U JP2583809Y2 (ja) 1990-09-27 1990-09-27 発光ダイオードランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10171490U JP2583809Y2 (ja) 1990-09-27 1990-09-27 発光ダイオードランプ

Publications (2)

Publication Number Publication Date
JPH0459168U JPH0459168U (US20080293856A1-20081127-C00150.png) 1992-05-21
JP2583809Y2 true JP2583809Y2 (ja) 1998-10-27

Family

ID=31845407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10171490U Expired - Lifetime JP2583809Y2 (ja) 1990-09-27 1990-09-27 発光ダイオードランプ

Country Status (1)

Country Link
JP (1) JP2583809Y2 (US20080293856A1-20081127-C00150.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4928784B2 (ja) 2004-01-30 2012-05-09 シーシーエス株式会社 Ｌｅｄ及びｌｅｄの取付構造

Also Published As

Publication number Publication date
JPH0459168U (US20080293856A1-20081127-C00150.png) 1992-05-21

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