JP2581197Y2 - Pneumatically operated block valve for semiconductor devices - Google Patents

Description

Description: BACKGROUND OF THE INVENTION The present invention relates to a semiconductor manufacturing apparatus in which a gas necessary for forming a film of a semiconductor is released to the semiconductor or not to the semiconductor. More specifically, the present invention relates to an air-operated block valve that reduces gas accumulation and enables instantaneous gas switching. 2. Description of the Related Art In the manufacture of semiconductor devices, a plurality of types of flammable and super-toxic gas fluids (hereinafter abbreviated as gases) are used as a material for forming a film. Conventionally, as shown in the valve system diagram of FIG. 3, a single air valve 1, 1 #, 2,
2 ‥‥ is replaced with a plurality of pipes 3 and 3
And a plurality of joints 4 and 4 are installed and connected, and gas inlets 5 and 5 are connected, and the gas passage is selectively controlled by air valves 1, 1 and 2 While doing. However, in the conventional configuration, the number of locations where the joints 4 and 4 # are used increases, and the number of connection locations increases accordingly. Gas leakage may occur from the joints, and the leak amount at one location is small, but many joints are used. Therefore, there is a problem that air or water vapor is mixed in the joints 4 and 4%, thereby lowering the purity of the gas, etc., which has a disadvantage of adversely affecting the characteristics of the semiconductor product obtained. In addition, a compact pipe cannot be formed, so that gas switching cannot be performed instantaneously, resulting in a disadvantage that gas selectivity is reduced. SUMMARY OF THE INVENTION The present invention has been made in view of such a point, and it is possible to prevent the occurrence of gas leakage by drastically reducing the number of connection points, and to reduce the gas generated at the joint. The gas can be switched instantly without any accumulation,
It is an object of the present invention to provide a composite air valve for a semiconductor device, which is easy in piping work and easy to incorporate into a semiconductor device. According to the present invention, there is provided a gas supply passage for discharging a gas to a semiconductor side in a valve body formed of a multi-faced block, and the gas supply passage is provided in the valve body. A plurality of sets of air drive units having V-shaped air valves for introducing and exhausting air are provided along the gas supply passage, and one of the V-shaped air valves is provided with one of the air valves. The air valve is connected to a gas supply passage, and a gas introduction unit or a gas exhaust unit that exhausts the gas without sending the gas to the semiconductor side is connected to the air valve. Is controlled. [0006] As the air valve used in the present invention, an air-driven automatic valve generally used is preferably used. This air valve is arranged in a V-shape by two air valves, but at least one of the air valves needs to be used for introducing gas into the gas supply passage. The gas introduction unit and the gas exhaust unit are connected to a gas introduction air valve and a gas exhaust air valve, respectively. When a valve fixing surface is formed on one surface of the multi-faced block, and a set of air valves is disposed in a V-shape in a direction perpendicular to the valve fixing surface, the gas introduction portion and the gas exhaust portion are arranged on Since it is possible to apply in a parallel or vertical direction, it is possible to assemble a well-organized piping system in the apparatus. It is particularly preferable that the angle of the V-shape is around 90 ° in view of the configuration of the block valve. Next, a preferred embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a front view of the present invention, and FIG.
FIG. 4 is a partially cutaway side view of the present invention. The valve body 11 is
It is composed of a columnar block formed in a multifaceted shape, and a gas supply passage 12 is formed in the center of the block in the longitudinal direction. The cross section of the valve body 11 is a trapezoidal pentagonal shape as viewed in FIG.
Is formed on the valve fixing surface, a gas introduction air valve 13 is provided on the oblique side 11b toward the gas supply passage 12, and the other oblique side 11c of the valve body 11 is toward the gas supply passage 12. Gas exhaust air valve 14
Are arranged. The gas introducing air valve 13 and the gas exhausting air valve 14 are connected via a passage 15 in an orthogonal relationship. Also, an air valve 1 for gas introduction
3 is connected to the gas supply passage 12 via the passage 16. A set of air drive units is formed by the gas introduction air valve 13 and the gas exhaust air valve 14.
A plurality of these are arranged in parallel along the gas supply passage 12. A gas inlet 31 is connected to the chamber 25 on the gas introduction air valve 13 side via a passage 30 formed in the valve body 11, and the chamber 25 on the gas exhaust air valve 14 side is connected via a passage 32. The gas exhaust unit 33 is connected. The gas introduction part 31 and the gas exhaust part 33 are arranged in parallel to the valve fixing surface 11a. As a set of the gas introduction section 31 and the gas exhaust section 33, a plurality of sets are arranged in parallel in the longitudinal direction of the valve body 11, like the gas introduction air valve 13 and the gas exhaust air valve 14. Different types of gases are supplied to each gas inlet 31 by pressure. At one end of the gas supply passage 12 formed in the valve body 11, a carrier gas introduction part 34 is provided, and at the other end, a discharge part 3 is provided.
5 are connected to each other, and the carrier gas introduction section 34
Thereafter, a carrier gas, for example, a hydrogen gas is always sent to the discharge unit 35 side through the gas supply passage 12. Next, the operation of the present invention configured as described above will be described. Now, when the gas is to flow from the gas introduction unit 31 into the gas supply passage 12, the gas introduction air valve 1
The introduction of air is controlled to the side 3 and the disk 27 is pulled by the action of the bellows 24 on the side of the gas introduction air valve 13 to open the passage 16. In this state, the passage 30 on the gas introduction unit 31 side communicates with the gas supply passage 12.
On the other hand, air is sent to the gas exhaust air valve 14 side through the air introduction part 29, and presses a piston (not shown) to cause a spring (not shown) to repel the stem (not shown). The disk 27 moves toward the gas supply passage 12 while extending the nozzle, and the disk 27 closes the passage 15. The passage 32 on the gas exhaust part 33 side is
The gas is blocked from communicating with the chamber 2 on the side of the gas introduction air valve 13 through the passage 30 from the gas introduction section 31.
Even if it enters from 5 to the passage 15, the flow passage is closed there. In this state, if gas flows from the gas introduction unit 31, the gas flows to the discharge unit 35 through the gas supply passage 12. Another gas introduction unit 3 in which different kinds of gas are arranged in parallel
When flowing from 1, the corresponding gas introduction air valve 13 and gas exhaust air valve 14 operate in the same manner as described above. In order to shut off the flow of the gas to the gas supply passage 12 and exhaust the gas to the gas exhaust portion 33, the air is supplied only to the gas introduction air valve 13 side and the stem (shown in FIG. (Omitted) is moved in the direction of the gas supply passage 12, the passage 16 is closed by the disk 27, the air is controlled to the gas exhaust air valve 14 side, and the disk 27 is pulled by the action of the bellows 24 to draw the passage 1
When the valve 5 is opened, the passage 30, the passage 15, and the passage 32 communicate with each other via the chamber 25, and the gas flows from the gas introduction unit 31 to the gas exhaust unit 33. As described above, according to the present invention, since the gas supply passage is disposed in the blocked valve body,
The use of joints can be minimized, and unnecessary piping can be omitted.This greatly reduces the number of connection points, eliminates gas accumulation at joints, and reduces piping Since the length is extremely reduced, the gas can be switched instantaneously. In addition, if the air valve is arranged in a V-shape with respect to the valve fixing surface, the gas introduction portion and the gas exhaust portion can be provided in a direction parallel or perpendicular to the valve fixing surface. Since the dimensions and processing of the pipe connected to the exhaust section are simplified, it is possible to assemble a well-organized piping system in the equipment, and the gas accumulation is very small, so the gas is switched instantaneously. be able to. [0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view of a block valve for a semiconductor device according to the present invention. FIG. 2 is a partially cutaway side view of FIG. FIG. 3 is a valve system diagram of a conventional composite air valve. [Description of Signs] 11 Valve body 11a Valve fixing surface 12 Gas supply passage 13 Gas introduction air valve 14 Gas exhaust air valve 15, 16, 30, 32 Passage 25 Chamber 29 Air introduction part 31 Gas introduction part 33 Gas exhaust part

Claims (1)

(57) [Rules for requesting registration of utility model] A set of air drive units in which a gas supply passage for discharging gas to the semiconductor side is provided in a valve body formed of a multi-faced block, and an air valve for introducing and exhausting gas to and from the valve body is provided in a V-shape. Are arranged along the gas supply passage, one of the V-shaped air valves is connected to the gas supply passage, and the air valve sends a gas introduction portion or gas to the semiconductor side. An air-operated block valve for a semiconductor device, wherein a gas exhaust unit for exhausting gas is connected, and a flow direction and a type of gas are selectively controlled by air pressure from the air drive unit. 2. The set of air driving units includes a gas introduction air valve and a gas exhaust air valve, and the gas introduction air valve is connected to the gas introduction unit, and the gas exhaust air valve is connected to the gas exhaust unit. The block valve according to claim 1, wherein: 3. The block valve according to claim 1, wherein a valve fixing surface is formed on one surface of the multi-sided block, and the air valve is disposed in a V-shape in a direction perpendicular to the valve fixing surface. 4. The block valve according to claim 1, wherein the gas introduction unit and the gas exhaust unit are arranged in a direction parallel or perpendicular to the valve fixing surface. 5. The block valve according to claim 3, wherein the V-shaped angle is approximately 90 °. 6. 2. The block valve according to claim 1, wherein the gas introduction unit and the gas introduction air valve, and the gas exhaust unit and the gas exhaust air valve are obliquely provided so as to intersect at an acute angle. 7. 2. The block valve according to claim 1, wherein a carrier gas introduction part is formed at one end of the gas supply passage, and a carrier gas discharge part is formed at the other end. 8. The gas introduction Eabaru blanking is coupled to the gas supply passage via a passage, the Eabaru blanking gas exhaust,
Perpendicular to the gas introduction air valve through a passage
The block valve according to claim 2, wherein the block valve is connected to the block valve. 9. 2. The block valve according to claim 1, wherein the air driving unit is configured to be able to pump different types of gas for each set. 3.