JP2575755B2 - Brazing filler metal for ceramics - Google Patents
Brazing filler metal for ceramicsInfo
- Publication number
- JP2575755B2 JP2575755B2 JP62298374A JP29837487A JP2575755B2 JP 2575755 B2 JP2575755 B2 JP 2575755B2 JP 62298374 A JP62298374 A JP 62298374A JP 29837487 A JP29837487 A JP 29837487A JP 2575755 B2 JP2575755 B2 JP 2575755B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramics
- brazing
- filler metal
- brazing filler
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Ceramic Products (AREA)
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は、電子管用外囲器、圧電素子、センサー、そ
の他構造材料等に広く用いられているセラミックスの接
合に用いるろう材の改良に関する。Description: TECHNICAL FIELD The present invention relates to an improvement in a brazing material used for joining ceramics widely used for an envelope for an electron tube, a piezoelectric element, a sensor, and other structural materials.
(従来の技術とその問題点) 従来より上記セラミックスの接合にはAg−Cuの共晶合
金をベースとし、そこへさらに少量のTiを含むAg−Cu−
Ti合金より成るろう材が広く用いられているが、このろ
う材は、セラミックスとの濡れ性が悪く、接合面の端部
に粒状のろう材のはみ出しが生じ、ろう付け強度が低く
不安定であった。特にカーボンを含む非酸化物系セラミ
ックス(SiC、TiC、B4C、WC)の場合は、カーボンとの
親和力が弱い為、ろう付け強度が低く不安定であった。
また筒状のろう付け品では濡れ性が悪い為、周方向の一
部に隙間ができてシール性が悪く、真空中では使用不可
能であった。(Conventional technology and its problems) Conventionally, the joining of the above ceramics is based on a eutectic alloy of Ag-Cu, and Ag-Cu- containing a small amount of Ti.
A brazing filler metal made of Ti alloy is widely used, but this brazing filler metal has poor wettability with ceramics, and granular brazing filler metal protrudes at the end of the joint surface, resulting in low brazing strength and instability. there were. In particular, in the case of non-oxide ceramics containing carbon (SiC, TiC, B 4 C, WC), the brazing strength was low and unstable due to weak affinity with carbon.
In addition, since the tubular brazed article has poor wettability, a gap is formed in a part of the circumferential direction, and the sealing property is poor, so that it cannot be used in a vacuum.
(発明の目的) 本発明は、上記問題点を解決すべくなされたものであ
り、セラミックスとの濡れ性を向上させ、セラミックス
のろう付け強度を高く安定させることのできるセラミッ
クス接合用ろう材を提供することを目的とするものであ
る。(Object of the Invention) The present invention has been made to solve the above problems, and provides a brazing material for ceramics joining which can improve the wettability with ceramics and stabilize the brazing strength of ceramics with high stability. It is intended to do so.
(問題点を解決するための手段) 上記問題点を解決するための本発明のセラミックス接
合用ろう材は、Ag−Cuの共晶合金をベースとし、そこへ
さらに少量のTiを含むAg−Cu−Ti合金より成るセラミッ
クス接合用ろう材に於いて、さらにMn0.1wt%以上15wt
%未満、Si、Geが各々2wt%以上15wt%以下、Liが0.05w
t%以上5wt%以下のうち少なくともいずれか1種を添加
して成ることを特徴とするものである。(Means for Solving the Problems) The brazing filler metal for ceramics of the present invention for solving the above problems is based on a eutectic alloy of Ag-Cu and further contains Ag-Cu containing a small amount of Ti. -In ceramic brazing filler metal made of Ti alloy, Mn 0.1wt% or more and 15wt%
%, Si and Ge are each 2 wt% or more and 15 wt% or less, and Li is 0.05 w
It is characterized by adding at least one of t% or more and 5 wt% or less.
本発明のセラミックス接合用ろう材に於いて、Mn0.1w
t%以上15wt%未満とした理由は、0.1wt%未満ではセラ
ミックスとの濡れ性が向上せず、セラミックスとのろう
付け強度が低く、15wt%以上だと加工性が悪くなり、ろ
う付け強度が低下してくるからである。Si、Geを2wt%
以上15wt%以下とした理由は、2wt%未満ではセラミッ
クスとの濡れ性が向上せず、セラミックスとのろう付け
強度が低く、15wt%を超えると加工性が悪くなり、ろう
付け強度が低下してくるからである。Li0.05wt%以上0.
5wt%未満とした理由は、0.05wt%未満ではセラミック
スとの濡れ性が向上せず、セラミックスとのろう付け強
度が低く、5wt%を超えると蒸発量が多くなり、セラミ
ックスのろう付け時に炉を汚損したり、セラミックス製
品に付着して汚損するからである。In the brazing material for ceramic joining of the present invention, Mn0.1w
The reason for setting it to t% or more and less than 15 wt% is that if it is less than 0.1 wt%, the wettability with ceramics is not improved, and the brazing strength with ceramics is low. This is because it will decrease. 2 wt% of Si and Ge
If the content is less than 15 wt%, the wettability with ceramics will not improve if less than 2 wt%, and the brazing strength with ceramics will be low. If it exceeds 15 wt%, the workability will deteriorate and the brazing strength will decrease. Because it comes. Li0.05wt% or more
The reason for setting the content to less than 5 wt% is that if the content is less than 0.05 wt%, the wettability with the ceramic is not improved, and the brazing strength with the ceramic is low. This is because they are contaminated or adhere to ceramic products and become contaminated.
(作用) 上記成分組成の本発明のセラミックス接合用ろう材
は、Mn、Si、Geを添加したものにあっては特にSiC、Ti
C、B4C、WC等のカーボンを含む非酸化物系セラミックス
のろう付けに於いて、カーボンとの親和力が大きく、C
+Ti+Mn、C+Ti+Si、C+Ti+Ge等の化合物を作るの
で、セラミックスとのろう付け強度が著しく高くなる。
またLiを添加したものにあっては、Tiの活性よりもLiの
活性機能が強いので、セラミックスのろう付けに於い
て、Tiの酸化物を還元し、セラミックスの主元素との化
合物を作り易くなり、なじみ、濡れ性が向上し、セラミ
ックスとのろう付け強度が高くなる。しかもAg−Cu−Ti
合金中のCu−Tiの化合物の析出物を微細に分散するの
で、セラミックスとの濡れ性が向上し、ろう付け強度が
著しく高くなる。(Function) The brazing filler metal for ceramics of the present invention having the above-mentioned component composition is, in particular, the one containing Mn, Si, and Ge, in particular, SiC, Ti.
In brazing non-oxide ceramics containing carbon such as C, B 4 C, WC, etc.
Since compounds such as + Ti + Mn, C + Ti + Si, and C + Ti + Ge are made, the brazing strength with ceramics is significantly increased.
In addition, in the case of adding Li, since the activity of Li is stronger than that of Ti, in the brazing of ceramics, it is easy to reduce the oxide of Ti and form a compound with the main element of ceramics. In addition, conformability and wettability are improved, and brazing strength with ceramics is increased. Moreover, Ag-Cu-Ti
Since the precipitates of the Cu-Ti compound in the alloy are finely dispersed, the wettability with ceramics is improved, and the brazing strength is significantly increased.
(実施例) 本発明によるセラミックス接合用ろう材の実施例を従
来例と共に説明する。(Example) An example of the brazing filler metal for ceramics according to the present invention will be described together with a conventional example.
下記の表の左欄に示す成分組成の実施例及び従来例の
セラミックス接合用ろう材を用いて、下記の表の中央欄
に示す直径7mm、長さ30mmのセラミックスの線材同志及
びセラミックス線材と金属線材を真空(10-5mmHg)炉中
で各100本ろう付けし、このろう付けした線材を標点間
隔30mmにてJIS4点曲げ試験を行って、ろう付け強度を測
定した処、下記の表の右欄に示すような結果を得た。Using the example of the component composition shown in the left column of the table below and the brazing filler metal for ceramics of the conventional example, a ceramic wire rod having a diameter of 7 mm and a length of 30 mm and a ceramic wire rod and a metal shown in the center column of the table below 100 wires were brazed in a vacuum ( 10-5 mmHg) furnace, and the brazed wire was subjected to a JIS 4-point bending test at a gauge spacing of 30 mm to measure the brazing strength. The results as shown in the right column were obtained.
上記の表で明らかなように実施例のセラミックス接合
用ろう材でろう付けしたセラミックスの線材同志及びセ
ラミックス線材と金属線材のろう付け強度は、従来例の
セラミックス接合用ろう材でろう付けしたもののろう付
け強度よりも遥かに高く安定していることが判る。これ
はひとえに実施例のセラミックス接合用ろう材が、セラ
ミックスとの濡れ性に優れているからに他ならない。 As is clear from the above table, the brazing strength of the ceramic wire and the brazing strength of the ceramic wire and the metal wire brazed with the brazing filler metal of the example of the embodiment are the same as those of the brazing filler metal of the conventional example. It turns out that it is much higher than the attachment strength and is stable. This is exactly because the brazing filler metal for ceramics of the embodiment has excellent wettability with ceramics.
(発明の効果) 以上の説明で判るように本発明のセラミックス接合用
ろう材は、セラミックスとの濡れ性に優れているので、
セラミックスのろう付け強度を高く安定させることがで
きるという効果がある。(Effects of the Invention) As can be seen from the above description, the brazing filler metal for ceramics of the present invention has excellent wettability with ceramics.
There is an effect that the brazing strength of ceramics can be made high and stable.
Claims (1)
らに少量のTiを含むAg−Cu−Ti合金より成るセラミック
ス接合用ろう材に於いて、さらにMn0.1wt%以上15wt%
未満、Si、Geが各々2wt%以上15wt%以下、Liが0.05wt
%以上5wt%以下のうち少なくともいずれか1種を添加
して成ることを特徴とするセラミックス接合用ろう材。1. A ceramic brazing material comprising an Ag-Cu eutectic alloy based on an Ag-Cu-Ti alloy further containing a small amount of Ti, wherein Mn is 0.1 wt% or more and 15 wt% or more.
Less than, each of Si and Ge 2wt% or more and 15wt% or less, Li 0.05wt
% Or more, and at least one of 5 wt% or less is added.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62298374A JP2575755B2 (en) | 1987-11-26 | 1987-11-26 | Brazing filler metal for ceramics |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62298374A JP2575755B2 (en) | 1987-11-26 | 1987-11-26 | Brazing filler metal for ceramics |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01138086A JPH01138086A (en) | 1989-05-30 |
JP2575755B2 true JP2575755B2 (en) | 1997-01-29 |
Family
ID=17858861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62298374A Expired - Fee Related JP2575755B2 (en) | 1987-11-26 | 1987-11-26 | Brazing filler metal for ceramics |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2575755B2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102699572A (en) * | 2012-06-21 | 2012-10-03 | 哈尔滨工业大学 | Nano particle reinforced Ag-base composite brazing filler metal and preparation method thereof |
CN102699574B (en) * | 2012-06-28 | 2015-02-11 | 哈尔滨工业大学 | Si3N4 and 42CrMo steel connecting solder and brazing connection method |
TWI634220B (en) * | 2017-08-15 | 2018-09-01 | 行政院原子能委員會核能硏究所 | Brazing material composition and manufacturing method thereof |
CN108555476B (en) * | 2018-04-25 | 2020-02-07 | 哈尔滨工业大学 | Composite brazing filler metal for brazing quartz fiber reinforced composite ceramic and Invar alloy and preparation method and brazing method thereof |
CN114315403B (en) * | 2021-12-22 | 2023-02-24 | 北京科技大学 | Wire-implanted reinforced brazing connection method for C/C and C/SiC composite materials and metal |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5843005B2 (en) * | 1978-10-07 | 1983-09-24 | 松下電工株式会社 | Decorative veneer manufacturing method |
-
1987
- 1987-11-26 JP JP62298374A patent/JP2575755B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH01138086A (en) | 1989-05-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |