JP2561948B2 - Busbar circuit board manufacturing method - Google Patents
Busbar circuit board manufacturing methodInfo
- Publication number
- JP2561948B2 JP2561948B2 JP63223497A JP22349788A JP2561948B2 JP 2561948 B2 JP2561948 B2 JP 2561948B2 JP 63223497 A JP63223497 A JP 63223497A JP 22349788 A JP22349788 A JP 22349788A JP 2561948 B2 JP2561948 B2 JP 2561948B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- bus bar
- tab
- busbar
- press
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/22—Bases, e.g. strip, block, panel
- H01R9/24—Terminal blocks
- H01R9/2458—Electrical interconnections between terminal blocks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connection Or Junction Boxes (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、自動車の電装回路の配線に用いられる電気
接続箱において、その内部回路を構成するブスバー回路
板の製造方法に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a busbar circuit board that constitutes an internal circuit of an electric connection box used for wiring an electric circuit of an automobile.
従来のブスバー回路板の製造方法は、第４図において
符号１で示される回路網板を、一枚の金属板から隣合う
ブスバー2a,2b…をつなぐ連結片３を残して一体的に打
抜いて形成し、絶縁基板４の上に配設したのち、基板に
設けた打抜き用穴５を利用して連結片３を切断分離し、
各ブスバー2a,2b…を独立させる方法をとっている。６
および６′は各ブスバーに連成したタブであって、起立
状のもの（６）と平面状のもの（６′）とがある。In the conventional method for manufacturing a bus bar circuit board, a circuit board shown by reference numeral 1 in FIG. 4 is integrally punched from a single metal plate, leaving a connecting piece 3 for connecting adjacent bus bars 2a, 2b. Formed, and arranged on the insulating substrate 4, the connecting piece 3 is cut and separated using the punching hole 5 provided in the substrate,
Each bus bar 2a, 2b ... is made independent. 6
Reference numerals 6'and 6'represent tabs connected to each bus bar, which are a standing one (6) and a flat one (6 ').
しかし、上記のようなブスバー回路板Ａは、絶縁基板
４を使用するために、積層時に重量が増加するほかに、
各基板４に下層から立上るタブ６の貫通孔を設ける必要
があり、組立に時間がかかりコストアップの原因とな
る。However, in the bus bar circuit board A as described above, since the insulating substrate 4 is used, in addition to the increase in weight during stacking,
Since it is necessary to provide a through hole for the tab 6 rising from the lower layer in each substrate 4, it takes time to assemble, which causes a cost increase.
そこで出願人は先に特開昭56−67981号公報におい
て、第５図に示すように、互に隣接するブスバー2a,2b
…の適宜箇所をゴム又は合成樹脂のモールド部材７によ
り成形固定することにより、各ブスバーを平面的に一体
に保持すると共に部材７に積層時における絶縁スペーサ
として機能させ、軽量化および製造コストの低減を図る
ようにしたものを提案した。Therefore, the applicant previously disclosed in JP-A-56-67981 that bus bars 2a and 2b adjacent to each other as shown in FIG.
By molding and fixing appropriate portions of the ... With a molding member 7 made of rubber or synthetic resin, each bus bar is planarly held integrally and also functions as an insulating spacer when laminated on the member 7, reducing weight and reducing manufacturing cost. I proposed something that was designed to achieve.
第4,5図のブスバー回路板はいずれも各ブスバーが剥
き出し状態であるために水が浸入し、リークしやすく、
とくに信号用配線の誤動作や作動不良を起こす欠点があ
る。また、タブ6,6′をブスバーに連成するために高密
度の配索が困難である。また、多層積層時に部分的なモ
ールド部材７では接触面積が少なく位置ずれが起きやす
く、自動車走行時における異音発生の原因となるほか、
タブ6,6′に合成樹脂が異物として付着するおそれがあ
り、外部回路との接続の信頼性に欠ける。In the bus bar circuit boards shown in Figs. 4 and 5, since each bus bar is in a bare state, water invades and easily leaks.
In particular, there is a drawback that the signal wiring may malfunction or malfunction. Further, since the tabs 6 and 6'are coupled to the bus bar, high-density wiring is difficult. In addition, a contact area is small in a partial mold member 7 during multi-layer lamination, which easily causes positional deviation, which causes abnormal noise when the vehicle is running.
Since the synthetic resin may adhere to the tabs 6 and 6'as foreign matter, the reliability of the connection with the external circuit is lacking.
本発明の課題は、上記の問題点を解消し、各ブスバー
の絶縁防水性が完璧で、高密度配索が可能なブスバー配
線板の製造方法を提供することにある。An object of the present invention is to solve the above problems and to provide a method for manufacturing a busbar wiring board in which each busbar has perfect insulation and waterproof properties and enables high-density wiring.
前記の課題を達成するため、本発明のブスバー回路板
の製造方法は、隣合うブスバー間に連結片を残して所望
の回路パターンを有する複数のブスバーを金属板から一
体に打抜いてブスバー回路網板を形成し、該回路網板を
合成樹脂絶縁体により一体にモールドした後、前記連結
片を切断除去すると共に、前記ブスバーの所望の位置に
タブ圧入孔を開孔し、該タブ圧入孔に外部接続用のタブ
を圧入固定することによりブスバー回路板を形成し、前
記連結片の切断除去により生じた切断分離部に接着性の
樹脂を注入充填して前記ブスバー回路板を積層固定する
ことを特徴とする。In order to achieve the above-mentioned object, a method for manufacturing a busbar circuit board according to the present invention includes a busbar circuit network in which a plurality of busbars having a desired circuit pattern are integrally punched from a metal plate while leaving a connecting piece between adjacent busbars. A plate is formed, the circuit board is integrally molded with a synthetic resin insulator, the connecting piece is cut and removed, and a tab press-fitting hole is opened at a desired position of the bus bar, and the tab press-fitting hole is formed. A bus bar circuit board is formed by press-fitting and fixing a tab for external connection, and an adhesive resin is injected and filled into a cutting / separating portion generated by cutting and removing the connecting piece to stack and fix the bus bar circuit board. Characterize.
以下、上記構成を実施例を示す図面を参照して具体的
に説明する。Hereinafter, the above configuration will be specifically described with reference to the drawings showing an embodiment.
第１図において、Ｂは電気接続箱であって、メインカ
バー10とアンダーカバー11内に複数のブスバー回路板12
1,122,123および124を積層、収容して構成され、メイン
カバー10には複数のヒューズ13、サーキットブレーカ14
およびリレー15などの電気部品が搭載されると共に、ア
ンダーカバー11と同様にワイヤーハーネスＷの端末のコ
ネクタ17に対するコネクタ挿着部16が設けられている。In FIG. 1, B is an electric junction box, and a plurality of bus bar circuit boards 12 are provided in a main cover 10 and an under cover 11.
1 1 , 12 2 , 12 3 and 12 4 are stacked and housed. The main cover 10 has a plurality of fuses 13 and a circuit breaker 14.
Further, electrical components such as a relay 15 and the like are mounted, and a connector insertion portion 16 for a connector 17 of a terminal of the wire harness W is provided as with the under cover 11.
第２図（ａ）〜（ｃ）は、ブスバー回路板121（122〜
124も同様である。）の製造過程を示す。2 (a) to (c) are bus bar circuit boards 12 1 (12 2 to
12 4 is also the same. ) Shows the manufacturing process.
第２図（ａ）は、第４図の従来例と同様に既知の装置
によって、所望の回路パターンを有する複数のブスバー
18a,18b…を互に連結片19を残して一枚の金属板から打
抜き形成したブスバー回路網板Ｍを合成樹脂絶縁体20に
より一体にモールドした状態を示す。この回路網板Ｍ
は、各ブスバー18a,18b…の表裏両面、連結片19および
各ブスバー間の間隙が合成樹脂絶縁体20により被覆充填
されており、各ブスバーは第４図に示すタブ6,6′をも
たない。FIG. 2 (a) shows a plurality of bus bars having a desired circuit pattern by a known device as in the conventional example of FIG.
The bus bar circuit board M formed by punching and forming a metal plate 18a, 18b, ... with the connecting piece 19 left therebetween is integrally molded with a synthetic resin insulator 20. This network board M
, The front and back surfaces of each bus bar 18a, 18b, the connecting piece 19 and the gap between each bus bar are covered and filled with the synthetic resin insulator 20, and each bus bar has tabs 6, 6'shown in FIG. Absent.
次いで、第２図（ｂ）のように、各ブスバー18a,18b
…の所望の位置にタブ圧入孔21を開孔すると共に、前記
連結片19を切断分離し、下層または上層からのタブに対
するタブ挿通孔22を開孔する。各孔21,22および連結片1
9の開孔切断は、図示しないプレス切断装置により同時
に行なわれる。また、合成樹脂絶縁体20のうち二点鎖線
で示される不要部分も同時に切断除去される。Then, as shown in FIG. 2 (b), each bus bar 18a, 18b
The tab press-fitting hole 21 is opened at a desired position, and the connecting piece 19 is cut and separated to open the tab insertion hole 22 for the tab from the lower layer or the upper layer. Each hole 21, 22 and connecting piece 1
The opening cutting of 9 is simultaneously performed by a press cutting device (not shown). Further, an unnecessary portion of the synthetic resin insulator 20 indicated by a chain double-dashed line is cut and removed at the same time.
最後に、第２図（ｃ）のように、各タブ圧入孔21に圧
入片23aを有するタブ23を圧入固定する。これにより、
各ブスバー18a,18b…が合成樹脂絶縁体20により一体に
モールドされ、かつタブ23群を圧入したブスバー回路板
121が製造される。Finally, as shown in FIG. 2 (c), the tab 23 having the press-fitting piece 23a is press-fitted and fixed in each tab press-fitting hole 21. This allows
The busbar circuit board in which the busbars 18a, 18b ... Are integrally molded by the synthetic resin insulator 20 and the tabs 23 are press-fitted.
12 1 are manufactured.
このブスバー回路板121は第３図に拡大して示すよう
に、連結片19の切断分離により生じた打抜き穴19′をも
ち、切断面19aが露出している。この打抜き穴19′を利
用して接着性の樹脂20′を充填することによりブスバー
回路板の層間接着および切断面19aの絶縁被覆が同時に
達成される。The bus bar circuit board 121, as shown enlarged in FIG. 3, has a punched hole 19 'produced by cutting and separating connecting piece 19, the cut surface 19a is exposed. By filling the adhesive resin 20 'using the punched holes 19', the interlayer adhesion of the bus bar circuit board and the insulating coating of the cut surface 19a are simultaneously achieved.
すなわち、第１図におけるブスバー回路板124,123お
よび122は、アンダーカバー11に順次積層しながら、上
記打抜き穴19′に樹脂20′を注入し、各層間を接着固定
したものである。That is, the bus bar circuit board 12 4, 12 3 and 12 2 in the first figure, while sequentially laminated on the under cover 11, injected 'resin 20' the perforations 19, in which the respective layers were adhered and fixed .
第２図（ａ）におけるブスバー回路網板Ｍのモールド
は、インサート成形、射出成形、上下ロールによる転写
成形など既知の手段で行うことができ、熱可塑性樹脂、
熱硬化性樹脂のいずれも用いられる。The bus bar circuit board M in FIG. 2 (a) can be molded by known means such as insert molding, injection molding, and transfer molding with upper and lower rolls.
Any of the thermosetting resins can be used.
ブスバー回路板121（122,123…）は、各ブスバー18a,
18b…が合成樹脂絶縁体20の一体モールドによって個別
に被覆絶縁され、電気接続箱内に水が浸入してもリーク
するおそれがない。Bus bar circuit board 12 1 (12 2 , 12 3 …) is connected to each bus bar 18a,
18b ... are individually covered and insulated by the integral molding of the synthetic resin insulator 20, and there is no risk of leakage even if water enters the electric junction box.
そして、タブ23は各ブスバーとは別部品であるから、
回路網板Ｍの設計製作時にその折り曲げ用展開部6a（第
４図参照）を設ける必要がなく、ブスバーの取廻しが容
易となり、打抜きおよび配索密度を大きくすることがで
きる。また、タブ23はタブ圧入孔21を開孔することによ
り、ブスバーの任意の位置に圧入接続することができ、
合成樹脂絶縁体20が異物として付着し、相手端子と導通
不良を起こすおそれもない。Since the tab 23 is a separate part from each bus bar,
When designing and manufacturing the circuit board M, it is not necessary to provide the bending expansion portion 6a (see FIG. 4), the bus bar can be easily handled, and the punching and routing density can be increased. Further, the tab 23 can be press-fitted and connected to any position of the bus bar by opening the tab press-fitting hole 21.
There is no possibility that the synthetic resin insulator 20 will adhere as a foreign substance and cause a conduction failure with the mating terminal.
さらに、各ブスバーをつなぐ連結片19の切断分離によ
って生じる打抜き穴19′を利用することによって、ブス
バー回路板121,122…を互に積層固定し、あるいはメイ
ンカバー10またはアンダーカバー11に接着固定すること
ができ、上下層間のリークも完璧に防止される。また、
積層を要しない場合には樹脂20′で封止することによ
り、切断面19aは絶縁被覆され、リークや水がたまるお
それもない。Further, by utilizing the punching holes 19 'formed by cutting and separating the connecting pieces 19 connecting the bus bars, the bus bar circuit boards 12 1 , 12 2 ... are laminated and fixed to each other or bonded to the main cover 10 or the under cover 11. It can be fixed and leakage between upper and lower layers is completely prevented. Also,
When the lamination is not required, the cut surface 19a is covered with an insulating material by sealing with the resin 20 ', and there is no possibility that leaks or water will accumulate.
また、ブスバー回路板121のもう一つの大きな利点
は、各ブスバー18a,18b…の回路パターンが同一であっ
ても、圧入固定するタブ23の圧入位置および本数を変え
ることにより、実質的に回路パターンが変化する。従っ
て、電気接続箱Ｂを使用する車種やグレードが異なって
も回路網板Ｍの打抜金型を変えずに汎用的に使用するこ
とが可能となる。It is another great advantage of the bus bar circuit board 121, each bus bar 18a, also 18b ... circuit pattern is the same, by varying the press-fitting position and number of the tabs 23 to be press-fitted, substantially circuit The pattern changes. Therefore, it is possible to use the electric connection box B for general purpose without changing the punching die of the circuit board M even if the vehicle type and grade using the electric connection box B are different.
以上説明したように、本発明のブスバー回路板の製造
方法は、隣合うブスバー間に連結片を残して所望の回路
パターンを有する複数のブスバーを金属板から一体に打
抜いてブスバー回路網板を形成し、該回路網板を合成樹
脂絶縁体により一体にモールドした後、前記連結片を切
断除去すると共に、前記ブスバーの所望の位置にタブ圧
入孔を開孔し、該タブ圧入孔に外部接続用のタブを圧入
固定することによりブスバー回路板を形成し、前記連結
片の切断除去により生じた切断分離部に接着性の樹脂を
注入充填して前記ブスバー回路板を積層固定する構成を
採用したから、各ブスバーが完全にモールドされ、従っ
て同一層内はもちろん上下層間のリークも完全に防止さ
れたブスバー回路板を製造することができる。そして、
外部接続用のタブを従来のようにブスバーに連成せず
に、タブを圧入固定する方法を採用したことにより、回
路パターンの設計が容易で、高密度の配索および汎用化
も可能であり、ブスバー回路板を低コストで製造するこ
とができる。さらに、本発明方法により得られるブスバ
ー回路板は、タブとブスバーとが別体であるから、タブ
に絶縁体が異物として付着することもなく、外部入出力
のための接触部の信頼性が向上する。As described above, the method for manufacturing a busbar circuit board of the present invention is a busbar circuit board obtained by integrally punching a plurality of busbars having a desired circuit pattern while leaving a connecting piece between adjacent busbars to form a busbar circuit board. After forming and integrally molding the circuit board with a synthetic resin insulator, the connecting piece is cut and removed, and a tab press-fitting hole is opened at a desired position of the bus bar, and an external connection is made to the tab press-fitting hole. The bus bar circuit board is formed by press-fitting and fixing the tabs for use, and the cutting and separating portion formed by cutting and removing the connecting piece is injected and filled with an adhesive resin to stack and fix the bus bar circuit board. As a result, it is possible to manufacture a busbar circuit board in which each busbar is completely molded, and therefore leakage between the upper and lower layers as well as in the same layer is completely prevented. And
By adopting the method of press-fitting and fixing the tab without connecting the external connection tab to the bus bar as in the past, it is easy to design the circuit pattern, and high-density wiring and generalization are also possible, The busbar circuit board can be manufactured at low cost. Further, in the bus bar circuit board obtained by the method of the present invention, since the tab and the bus bar are separate bodies, the insulator does not adhere to the tab as a foreign substance, and the reliability of the contact portion for external input / output is improved. To do.
第１図は本発明に係るブスバー回路板を用いた電気接続
箱の分解斜視図、 第２図（ａ）〜（ｃ）はそれぞれ同上のブスバー回路板
の製造方法を示す説明図、 第３図は同上のブスバー回路板の要部の拡大斜視図、 第４図および第５図はそれぞれ従来のブスバー回路板の
説明図である。 Ｂ……電気接続箱、Ｍ……ブスバー回路網板、10……メ
インカバー、11……アンダーカバー、121,122〜124……
ブスバー回路板、18a,18b……ブスバー、19……連結
片、19′……打抜き穴、20……合成樹脂絶縁体、21……
タブ圧入孔、23……タブ。FIG. 1 is an exploded perspective view of an electric connection box using a bus bar circuit board according to the present invention, FIGS. 2 (a) to 2 (c) are explanatory views showing a method for manufacturing the bus bar circuit board, respectively, and FIG. FIG. 4 is an enlarged perspective view of an essential part of the busbar circuit board, and FIGS. 4 and 5 are explanatory views of a conventional busbar circuit board. B ... Electric junction box, M ... Bus bar circuit board, 10 ... Main cover, 11 ... Under cover, 12 1 , 12 2 to 12 4 ......
Busbar circuit board, 18a, 18b ... Busbar, 19 ... Coupling piece, 19 '... Punch hole, 20 ... Synthetic resin insulator, 21 ...
Tab press-fitting hole, 23 ... Tab.
フロントページの続き (56)参考文献 特開 昭62−296710（ＪＰ，Ａ) 特開 昭54−135379（ＪＰ，Ａ) 実開 昭55−3888（ＪＰ，Ｕ)Continuation of the front page (56) Reference JP 62-296710 (JP, A) JP 54-135379 (JP, A) Actually opened 55-3888 (JP, U)
Claims (1)
回路パターンを有する複数のブスバーを金属板から一体
に打抜いてブスバー回路網板を形成し、該回路網板を合
成樹脂絶縁体により一体にモールドした後、前記連結片
を切断除去すると共に、前記ブスバーの所望の位置にタ
ブ圧入孔を開孔し、該タブ圧入孔に外部接続用のタブを
圧入固定することによりブスバー回路板を形成し、前記
連結片の切断除去により生じた切断分離部に接着性の樹
脂を注入充填して前記ブスバー回路板を積層固定するこ
とを特徴とするブスバー回路板の製造方法。1. A busbar circuit board is formed by integrally punching a plurality of busbars having a desired circuit pattern from a metal plate, leaving a connecting piece between adjacent busbars, and forming the busbar circuit board with a synthetic resin insulator. After being integrally molded with the bus bar circuit board by cutting and removing the connecting piece, a tab press-fitting hole is opened at a desired position of the bus bar, and a tab for external connection is press-fitted and fixed in the tab press-fitting hole. And a busbar circuit board is laminated and fixed by injecting and filling an adhesive resin into a cutting and separating portion formed by cutting and removing the connecting piece, and stacking and fixing the busbar circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63223497A JP2561948B2 (en) | 1988-09-08 | 1988-09-08 | Busbar circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63223497A JP2561948B2 (en) | 1988-09-08 | 1988-09-08 | Busbar circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0274114A JPH0274114A (en) | 1990-03-14 |
| JP2561948B2 true JP2561948B2 (en) | 1996-12-11 |
Family
ID=16799069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63223497A Expired - Fee Related JP2561948B2 (en) | 1988-09-08 | 1988-09-08 | Busbar circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2561948B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113660817A (en) * | 2020-05-12 | 2021-11-16 | 奥特斯奥地利科技与系统技术有限公司 | Component carrier, component carrier assembly and method for producing the same |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2586540Y2 (en) * | 1992-05-29 | 1998-12-09 | 住友電装株式会社 | Busbar structure of branch junction box |
| DE4244064C2 (en) * | 1992-12-24 | 1996-02-29 | Stribel Gmbh | Device for a vehicle |
| JP3495939B2 (en) | 1999-02-26 | 2004-02-09 | 矢崎総業株式会社 | Electrical junction box |
| JP3498668B2 (en) * | 2000-03-02 | 2004-02-16 | 住友電装株式会社 | Wiring board of electrical junction box |
| JP4495107B2 (en) * | 2006-03-28 | 2010-06-30 | 古河電気工業株式会社 | Rotating connector |
| JP5132425B2 (en) * | 2008-05-26 | 2013-01-30 | 矢崎総業株式会社 | Processing method of electrical connection parts |
| JP5332562B2 (en) * | 2008-12-03 | 2013-11-06 | 株式会社オートネットワーク技術研究所 | Circuit structure, method for manufacturing circuit structure, and electrical junction box |
| JP5464153B2 (en) * | 2011-02-04 | 2014-04-09 | 株式会社デンソー | Wiring unit |
| JP2017201596A (en) * | 2016-05-06 | 2017-11-09 | Smk株式会社 | Electrical connector and method of manufacturing the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5944847B2 (en) * | 1978-04-13 | 1984-11-01 | 矢崎総業株式会社 | Automotive wiring unit |
| JPS553888U (en) * | 1978-06-24 | 1980-01-11 | ||
| JPS62296710A (en) * | 1986-06-13 | 1987-12-24 | 矢崎総業株式会社 | Method of moisture-proof sealing of laminated bus-bar wiringboard |
-
1988
- 1988-09-08 JP JP63223497A patent/JP2561948B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113660817A (en) * | 2020-05-12 | 2021-11-16 | 奥特斯奥地利科技与系统技术有限公司 | Component carrier, component carrier assembly and method for producing the same |
| US11612064B2 (en) | 2020-05-12 | 2023-03-21 | AT&SAustria Technologie & Systemtechnik AG | Component carrier with a solid body protecting a component carrier hole from foreign material ingression |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0274114A (en) | 1990-03-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |