JPH0274114A - Bus bar circuit board and manufacture thereof - Google Patents
Bus bar circuit board and manufacture thereofInfo
- Publication number
- JPH0274114A JPH0274114A JP63223497A JP22349788A JPH0274114A JP H0274114 A JPH0274114 A JP H0274114A JP 63223497 A JP63223497 A JP 63223497A JP 22349788 A JP22349788 A JP 22349788A JP H0274114 A JPH0274114 A JP H0274114A
- Authority
- JP
- Japan
- Prior art keywords
- tab
- bus bar
- busbar
- press
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000012212 insulator Substances 0.000 claims abstract description 16
- 238000004080 punching Methods 0.000 claims abstract description 9
- 238000000465 moulding Methods 0.000 claims abstract description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 14
- 239000000057 synthetic resin Substances 0.000 claims description 14
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000004840 adhesive resin Substances 0.000 claims description 4
- 229920006223 adhesive resin Polymers 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 abstract description 4
- 238000003780 insertion Methods 0.000 abstract description 3
- 230000037431 insertion Effects 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 abstract 4
- 238000010168 coupling process Methods 0.000 abstract 4
- 238000005859 coupling reaction Methods 0.000 abstract 4
- 239000010410 layer Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/22—Bases, e.g. strip, block, panel
- H01R9/24—Terminal blocks
- H01R9/2458—Electrical interconnections between terminal blocks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、自動車の電装回路の配線に用いられる電気接
続箱において、その内部回路を構成するブスバー回路板
およびその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a busbar circuit board constituting an internal circuit in an electrical junction box used for wiring an electrical circuit of an automobile, and a method for manufacturing the same.
従来のブスバー回路板の製造方法は、第４図において符
号１で示される回路網板を、−枚の金属板から隣合うブ
スバー２ａ、’ｌｂ・・・をつなぐ連結片３を残して一
体的に打抜いて形成し、絶縁基板４の上に配設したのち
、基板に設けた打抜き用穴５を利用して連結片３を切断
分離し、各ブスバー２ａ、２ｂ・・・を独立させる方法
をとっている。６および６′は各ブスバーに連成したタ
ブであって、起立状のもの（６ンと平面状のもの（６′
）とがある。The conventional method of manufacturing a busbar circuit board is to integrally form a circuit network board indicated by reference numeral 1 in FIG. A method of punching out and forming the connecting pieces 3, disposing them on the insulating substrate 4, and then cutting and separating the connecting pieces 3 using the punching holes 5 provided in the substrate to make each bus bar 2a, 2b, etc. independent. is taking. 6 and 6' are tabs connected to each bus bar, and there are two tabs: an upright tab (6') and a flat tab (6').
).
しかし、上記のようなブスバー回路板Ａは、絶縁基ｉｆ
ｆ ４を使用するために、積層時に重量が増加するほか
に、各基板４に下層から立上るタブ６の貫通孔を設ける
必要があり、組立に時間がかかりコストアップの原因と
なる。However, the busbar circuit board A as described above has an insulating base if
In order to use f4, not only does the weight increase during stacking, but also it is necessary to provide a through hole in each substrate 4 for the tab 6 rising from the lower layer, which takes time for assembly and causes an increase in cost.
そこで出願人は先に特開昭５６−６７９８１号公報にお
いて、第５図に示すように、互に隣接するブスバー２ａ
、２ｂ・・・の適宜箇所をゴム又は合成樹脂のモールド
部材７により成形固定することにより、各ブスバーを平
面的に一体に保持すると共に部材７に積層時における絶
縁スペーサとして機能させ、軽量化および製造コストの
低減を図るようにしたものを提案した。Therefore, the applicant previously proposed in Japanese Patent Application Laid-Open No. 56-67981, as shown in FIG.
, 2b, . . . by molding and fixing appropriate parts with a molded member 7 made of rubber or synthetic resin, each bus bar is held together in a planar manner, and the member 7 is made to function as an insulating spacer during lamination, thereby reducing weight and We proposed a method that aims to reduce manufacturing costs.
第４．５図のブスバー回路板はいずれも各ブスバーが剥
き出し状態であるために水が浸入し、リークしやすく、
とくに信号用配線の誤動作や作動不良を起こす欠点があ
る。また、タブ６．６′をブスバーに達成するために高
密度の配索が困難である。また、多層積層時に部分的な
モールド部材７では接触面積が少なく位置ずれが起きや
すく、自動車走行時における異音発生の原因となるほか
、タブ６．６′に合成樹脂が異物として付着するおそれ
があり、外部回路との接続の信頼性に欠ける。In the busbar circuit board shown in Figure 4.5, each busbar is exposed, making it easy for water to enter and leak.
In particular, it has the disadvantage of causing malfunctions and malfunctions in signal wiring. Furthermore, it is difficult to arrange the tabs 6, 6' in a high density in order to form the bus bar. In addition, when laminating multiple layers, the contact area of the mold member 7 in parts is small and misalignment is likely to occur, which may cause abnormal noise when the car is running, and there is a risk that synthetic resin may adhere as foreign matter to the tabs 6 and 6'. Yes, and the connection with external circuits is unreliable.
本発明の課題は、上記の問題点を解消し、各ブスバーの
絶縁防水性が完璧で、高密度配索が可能なブスバー配線
板およびその製造方法を提供することにある。An object of the present invention is to solve the above-mentioned problems and provide a busbar wiring board in which each busbar has perfect insulation and waterproof properties and allows high-density wiring, and a method for manufacturing the same.
前記の課題を達成するため、本発明のブスバー回路板は
、所望の回路パターンを有する複数のブスバーが合成樹
脂絶縁体により平面状で一体にモールドされ、前記各ブ
スバーの打抜き形成時における隣合うブスバーをつなぐ
連結片が切断分離されると共に、該連結片の切断分離に
より生じた打抜き穴が封止されていることを特徴とする
。In order to achieve the above-mentioned object, the busbar circuit board of the present invention has a plurality of busbars having a desired circuit pattern integrally molded in a planar shape with a synthetic resin insulator, and the adjacent busbars when forming each busbar by punching. It is characterized in that the connecting pieces connecting the two are cut and separated, and the punched holes created by cutting and separating the connecting pieces are sealed.
また、その製造方法は、隣合うブスバー間に連結片を残
して所望の回路パターンを有する複数のブスバーを金属
板から一体に打抜いてブスバー回路網板を形成し、該回
路網板を合成樹脂絶縁体により一体にモールドした後、
前記連結片を切断除去すると共に、前記ブスバーの所望
の位置にタブ圧入孔を開孔し、該タブ圧入孔に外部接続
用のタブを正大固定することを特徴とする。In addition, the manufacturing method includes forming a busbar circuit network board by punching out a plurality of busbars having a desired circuit pattern integrally from a metal plate, leaving connection pieces between adjacent busbars, and forming the circuit network board using synthetic resin. After integrally molded with an insulator,
The connecting piece is cut and removed, a tab press-fit hole is opened at a desired position of the bus bar, and a tab for external connection is fixed to the tab press-fit hole in the correct size.
以下、上記構成を実施例を示す図面を参照して具体的に
説明する。The above configuration will be specifically described below with reference to drawings showing examples.
第１図において、Ｂは電気接続箱であって、メインカバ
ー１０とアンダーカバー１１内に複数のブスバー回路Ｆ
ｉ１２．，１２□、１２：ｌおよび１２４を積層、収容
して構成され、メインカバー１０には複数のヒユーズ１
３、サーキットブレーカＩ４およびリレー１５などの電
気部品が搭載されると共に、アンダーカバーｌｌ止同様
にワイヤーハーネスＷの端末のコネクタ１７に対するコ
ネクタ挿着部１６が設けられている。In FIG. 1, B is an electrical connection box, and a plurality of busbar circuits F are installed in the main cover 10 and under cover 11.
i12. , 12□, 12:l and 124 are stacked and housed, and the main cover 10 has a plurality of fuses 1.
3. Electrical components such as a circuit breaker I4 and a relay 15 are mounted, and a connector insertion portion 16 for the connector 17 at the terminal of the wire harness W is provided in the same manner as the undercover 11 stop.
第２図（ａ） 〜（ｅ）は、ブスバー回路板１２．（１
２２〜１２４も同様である。）の製造過程を示す。FIGS. 2(a) to 2(e) show the busbar circuit board 12. (1
The same applies to 22 to 124. ) manufacturing process is shown.
第２図（ａ）は、第４図の従来例と同様に既知の装置に
よって、所望の回路パターンを有する複数のブスバー１
８ａ、１８ｂ・・・を互に連結片１９を残して一枚の金
属板から打抜き形成したブスバー回路網板Ｍを合成樹脂
絶縁体２０により一体にモールドした状態を示す。この
回路網板Ｍは、各ブスバー１８ａ、１８ｂ・・・の表裏
両面、連結片１９および各ブスバー間の間隙が合成樹脂
絶縁体２０により被覆充填されており、各ブスバーは第
４図に示すタブ６．６′をもたない。FIG. 2(a) shows a plurality of busbars 1 having a desired circuit pattern formed by using a known device similar to the conventional example shown in FIG.
8a, 18b, . . . are punched out from a single metal plate, leaving connection pieces 19, and a busbar circuit network board M is integrally molded with a synthetic resin insulator 20. In this circuit network board M, both the front and back sides of each bus bar 18a, 18b..., the connecting piece 19, and the gap between each bus bar are covered and filled with a synthetic resin insulator 20, and each bus bar has a tab shown in FIG. 6. Does not have 6'.
次いで、第２図（ｂ）のように、各ブスバー１８ａ。Next, as shown in FIG. 2(b), each bus bar 18a.
１８ｂ・・・の所望の位置にタブ圧入孔２１を開孔する
と共に、前記連結片１９を切断分離し、下層または上層
からのタブに対するタブ挿通孔２２を開孔する。答礼２
１，２２および連結片１９の開孔切断は、図示しないプ
レス切断装置により同時に行なわれる。また、合成樹脂
絶縁体２０のうち二点ｔｉ￥線で示される不要部分も同
時に切断除去される。At the same time, the tab press-fit holes 21 are opened at desired positions of the tabs 18b, . Reply 2
1, 22 and the connecting piece 19 are simultaneously cut by a press cutting device (not shown). Further, an unnecessary portion of the synthetic resin insulator 20 indicated by the two-point ti\ line is also cut and removed at the same time.
最後に、第２図（Ｃ）のように、各タブ圧入孔２１に圧
入片２３ａを有するタブ２３を圧入固定する。Finally, as shown in FIG. 2(C), the tabs 23 having the press-fit pieces 23a are press-fitted into each tab press-fit hole 21 and fixed.
これにより、各ブスバー１８ａ、１８ｂ・・・が合成樹
脂絶縁体２０により一体にモールドされ、かつタブ２３
群を圧入したブスバー回路板１２．が製造される。As a result, each bus bar 18a, 18b... is integrally molded with the synthetic resin insulator 20, and the tab 23
Busbar circuit board with press-fitted group 12. is manufactured.
このブスバー回路板１２１は第３図に拡大して示すよう
に、連結片１９の切断分離により生じた打抜き穴１９′
をもち、切断面１９ａが露出している。この打抜き穴１
９′を利用して接着性の樹脂２０′を充填することによ
りブスバー回路板の層間接着および切断面１９ａの絶縁
被覆が同時に達成される。As shown in an enlarged view in FIG. 3, this bus bar circuit board 121 has a punched hole 19' formed by cutting and separating the connecting piece 19.
The cut surface 19a is exposed. This punched hole 1
By filling adhesive resin 20' using adhesive resin 9', interlayer adhesion of the bus bar circuit board and insulation coating of cut surface 19a are simultaneously achieved.
すなわち、第１図におけるブスバー回路板１２＝、１２
ｉおよび１２２は、アンダーカバー１１に順次積層しな
がら、上記打抜き穴１９’に樹脂２０′を注入し、各層
間を接着固定したものである。That is, busbar circuit board 12=, 12 in FIG.
i and 122 are formed by injecting resin 20' into the punched holes 19' while sequentially laminating the undercover 11 and fixing the layers with adhesive.
第２図（ａｌにおけるブスバー回路網板Ｍのモールドは
、インサート成形、射出成形、上下ロールによる転写成
形など既知の手段で行うことができ、熱可塑性樹脂、熱
硬化性樹脂のいずれも用いられる。The busbar circuit network board M in FIG. 2 (al) can be molded by known means such as insert molding, injection molding, and transfer molding using upper and lower rolls, and either thermoplastic resin or thermosetting resin can be used.
ブスバー回路板１２．（１２□、１２３・・・）は、各
ブスバー１８ａ、１８ｂ・・・が合成樹脂絶縁体２０の
一体モールドによって個別に被覆絶縁され、電気接続箱
内に水が浸入してもリークするおそれがない。Busbar circuit board 12. (12□, 123...), each bus bar 18a, 18b... is individually coated and insulated by integral molding of synthetic resin insulator 20, and there is no risk of leakage even if water enters the electrical connection box. do not have.
そして、タブ２３は各ブスバーとは別部品であるから、
回路網板Ｍの設計製作時にその折り曲げ用展開部６ａ（
第４図参照）を設ける必要がなく、ブスバーの取廻しが
容易となり、打抜きおよび配索密度を大きくすることが
できる。また、タブ２３はタブ圧入孔２１を開孔するこ
とにより、ブスバーの任意の位置に圧入接続することが
でき、合成樹脂絶縁体２０が異物として付着し、相手端
子と導通不良を起こすおそれもない。And since the tab 23 is a separate part from each bus bar,
When designing and manufacturing the circuit network board M, the unfolded part 6a for bending (
(see FIG. 4), the bus bar can be easily handled, and the density of punching and wiring can be increased. In addition, the tab 23 can be press-fitted to any position on the bus bar by opening the tab press-fit hole 21, and there is no risk of the synthetic resin insulator 20 adhering as a foreign substance and causing poor continuity with the mating terminal. .
さらに、各ブスバーをつなぐ連続片１９の切断分離によ
って生じる打抜き穴１９′を利用することによって、ブ
スバー回路板１２．．１２□・・・を互に積層固定し、
あるいはメインカバーｌＯまたはアンダーカバー１１に
接着固定することができ、上下層間のリークも完璧に防
止される。また、積層を要しない場合には樹脂２０′で
封止することにより、切断面１９ａは絶縁被覆され、リ
ークや水がたまるおそれもない。Furthermore, the bus bar circuit board 12. ．． 12□... are stacked and fixed together,
Alternatively, it can be adhesively fixed to the main cover IO or the undercover 11, completely preventing leakage between the upper and lower layers. Further, when lamination is not required, the cut surface 19a is covered with insulation by sealing with resin 20', and there is no risk of leakage or water accumulation.
また、ブスバー回路板１２．のもう一つの大きな利点は
、各ブスバー１８ａ、１８ｂ・・・の回路パターンが同
一であっても、圧入固定するタブ２３の圧入位置および
本数を変えることにより、実質的に回路パターンが変化
する。従って、電気接続箱Ｂを使用する車種やグレード
が異なっても回路網板Ｍの打抜金型を変えずに汎用的に
使用することが可能となる。In addition, the busbar circuit board 12. Another great advantage is that even if the circuit pattern of each bus bar 18a, 18b, . Therefore, even if the types and grades of vehicles using the electrical connection box B are different, it is possible to use the electrical connection box B universally without changing the punching die for the circuit network board M.
以上説明したように、本発明のブスバー回路板は、各ブ
スバーが完全にモールドされるから１．同一層内はもち
ろん上下層間のリークも完全に防止される。そして、タ
ブを圧入固定する方式をとることにより、回路パターン
の設計が容易で、高密度の配索および汎用化も可能とな
る。また、タブとブスバーとが別体であるために、タブ
に絶縁体が異物として付着することもなく、外部入出力
のための接触部の信転性が向上する。As explained above, in the busbar circuit board of the present invention, each busbar is completely molded, so 1. Leakage not only within the same layer but also between upper and lower layers is completely prevented. By employing a method in which the tabs are press-fitted and fixed, it is easy to design the circuit pattern, and high-density wiring and general use are also possible. Further, since the tab and the bus bar are separate bodies, there is no possibility that insulators will adhere to the tab as foreign matter, and reliability of the contact portion for external input/output is improved.
第１図は本発明に係るブスバー回路板を用いた電気接続
箱の分解斜視図、
第２図（ａ）〜ｆｃ）はそれぞれ同上のブスバー回路板
の製造方法を示す説明図、
第３図は同上のブスバー回路板の要部の拡大斜視図、
第４図および第５図はそれぞれ従来のブスバー回路板の
説明図である。
Ｂ・・・電気接続箱、Ｍ・・・ブスバー回路網板、１０
・・・メインカバー １１・・・アンダーカバー １２
１゜１２２〜１２４・・・ブスバー回路板、１８ａ、１
８ｂ・・・ブスバー、１９・・・連結片、１９′・・・
打抜き穴、２０・・・合成樹脂絶縁体、２１・・・タブ
圧入孔、２３・・・タブ。
特許出願人 矢崎総業株式会社
第FIG. 1 is an exploded perspective view of an electrical junction box using the busbar circuit board according to the present invention, FIGS. The enlarged perspective view of the main parts of the busbar circuit board same as above, and FIGS. 4 and 5 are explanatory diagrams of the conventional busbar circuit board, respectively. B... Electrical connection box, M... Busbar circuit network board, 10
... Main cover 11 ... Under cover 12
1゜122~124...Busbar circuit board, 18a, 1
8b... Bus bar, 19... Connection piece, 19'...
Punched hole, 20...Synthetic resin insulator, 21...Tab press-fit hole, 23...Tab. Patent applicant: Yazaki Sogyo Co., Ltd.
Claims (5)
成樹脂絶縁体により平面状に一体にモールドされ、前記
各ブスバーの打抜き形成時における隣合うブスバーをつ
なぐ連結片が切断分離されると共に、該連結片の切断分
離により生じた打抜き穴が封止されていることを特徴と
するブスバー回路板。(1) A plurality of busbars having a desired circuit pattern are integrally molded in a planar shape using a synthetic resin insulator, and when each busbar is punched and formed, the connecting pieces connecting adjacent busbars are cut and separated, and the connecting pieces are cut and separated. A busbar circuit board characterized in that punched holes formed by cutting and separating the pieces are sealed.
り上下層間のブスバー回路板が積層固定されている構造
をもつ請求項（１）のブスバー回路板。(2) The busbar circuit board according to claim 1, having a structure in which the busbar circuit boards between the upper and lower layers are stacked and fixed by filling the punched holes with an adhesive resin.
該タブ圧入孔に外部接続用のタブを圧入固定して成る請
求項（１）または（２）のブスバー回路板。(3) providing a tab press-fit hole at a desired position of the bus bar;
2. The busbar circuit board according to claim 1, wherein a tab for external connection is press-fitted and fixed in said tab press-fit hole.
ターンを有する複数のブスバーを金属板から一体に打抜
いてブスバー回路網板を形成し、該回路網板を合成樹脂
絶縁体により一体にモールドした後、前記連結片を切断
除去すると共に、前記ブスバーの所望の位置にタブ圧入
孔を開孔し、該タブ圧入孔に外部接続用のタブを圧入固
定することを特徴とするブスバー回路板の製造方法。(4) A busbar circuit network board is formed by punching out a plurality of busbars having a desired circuit pattern from a metal plate, leaving connecting pieces between adjacent busbars, and the circuit network board is integrated with a synthetic resin insulator. After molding, the connecting piece is cut and removed, a tab press-fit hole is formed at a desired position of the bus bar, and a tab for external connection is press-fitted and fixed in the tab press-fit hole. Method of manufacturing the board.
ターンを有する複数のブスバーを金属板から一体に打抜
いてブスバー回路網板を形成し、該回路網板を合成樹脂
絶縁体により一体にモールドした後、前記連結片を切断
除去すると共に、前記ブスバーの所望の位置にタブ圧入
孔を開孔し、該タブ圧入孔に外部接続用のタブを圧入固
定することによりブスバー回路板を形成し、前記連結片
の切断除去により生じた打抜き穴に接着性の樹脂を注入
充填して前記ブスバー回路板を積層固定することを特徴
とする積層ブスバー回路板の製造方法。(5) A busbar circuit network board is formed by punching out a plurality of busbars having a desired circuit pattern from a metal plate, leaving connecting pieces between adjacent busbars, and the circuit network board is integrated with a synthetic resin insulator. After molding, the connecting piece is cut and removed, a tab press-fit hole is formed at a desired position of the bus bar, and a tab for external connection is press-fitted into the tab press-fit hole, thereby forming a bus bar circuit board. A method for manufacturing a laminated busbar circuit board, characterized in that the punched holes formed by cutting and removing the connecting pieces are injected and filled with an adhesive resin to laminate and fix the busbar circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63223497A JP2561948B2 (en) | 1988-09-08 | 1988-09-08 | Busbar circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63223497A JP2561948B2 (en) | 1988-09-08 | 1988-09-08 | Busbar circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0274114A true JPH0274114A (en) | 1990-03-14 |
| JP2561948B2 JP2561948B2 (en) | 1996-12-11 |
Family
ID=16799069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63223497A Expired - Fee Related JP2561948B2 (en) | 1988-09-08 | 1988-09-08 | Busbar circuit board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2561948B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2267237A (en) * | 1992-05-29 | 1993-12-01 | Sumitomo Wall Systems Ltd | Bus bar of branch joint box. |
| US5513077A (en) * | 1992-12-24 | 1996-04-30 | Stribe Gmbh | Power distribution center for motor vehicle, provided with printed circuit boards, printed circuit webs and intermediate insulations arranged in layers |
| US6270360B1 (en) | 1999-02-26 | 2001-08-07 | Yazaki Corporation | Electric junction box with a relay |
| JP2001251734A (en) * | 2000-03-02 | 2001-09-14 | Sumitomo Wiring Syst Ltd | Wiring board for electric junction box |
| JP2007265795A (en) * | 2006-03-28 | 2007-10-11 | Furukawa Electric Co Ltd:The | Rotating connector |
| JP2009284724A (en) * | 2008-05-26 | 2009-12-03 | Yazaki Corp | Method of processing electrical connection component |
| JP2010136496A (en) * | 2008-12-03 | 2010-06-17 | Autonetworks Technologies Ltd | Circuit forming body, method for manufacturing circuit forming body, and electrical junction box |
| JP2012164447A (en) * | 2011-02-04 | 2012-08-30 | Denso Corp | Wiring unit |
| WO2017191689A1 (en) * | 2016-05-06 | 2017-11-09 | Smk株式会社 | Electric connector and method for manufacturing electric connector |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3911132A1 (en) | 2020-05-12 | 2021-11-17 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with a solid body protecting a component carrier hole from foreign material ingression |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54135379A (en) * | 1978-04-13 | 1979-10-20 | Yazaki Corp | Circuit unit for cars |
| JPS553888U (en) * | 1978-06-24 | 1980-01-11 | ||
| JPS62296710A (en) * | 1986-06-13 | 1987-12-24 | 矢崎総業株式会社 | Method of moisture-proof sealing of laminated bus-bar wiringboard |
-
1988
- 1988-09-08 JP JP63223497A patent/JP2561948B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54135379A (en) * | 1978-04-13 | 1979-10-20 | Yazaki Corp | Circuit unit for cars |
| JPS553888U (en) * | 1978-06-24 | 1980-01-11 | ||
| JPS62296710A (en) * | 1986-06-13 | 1987-12-24 | 矢崎総業株式会社 | Method of moisture-proof sealing of laminated bus-bar wiringboard |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2267237A (en) * | 1992-05-29 | 1993-12-01 | Sumitomo Wall Systems Ltd | Bus bar of branch joint box. |
| GB2267237B (en) * | 1992-05-29 | 1996-01-03 | Sumitomo Wall Systems Ltd | Bus bar of branch joint box |
| US5525758A (en) * | 1992-05-29 | 1996-06-11 | Sumitomo Wiring Systems, Ltd. | Bus bar of branch joint box |
| US5513077A (en) * | 1992-12-24 | 1996-04-30 | Stribe Gmbh | Power distribution center for motor vehicle, provided with printed circuit boards, printed circuit webs and intermediate insulations arranged in layers |
| DE10008366B4 (en) * | 1999-02-26 | 2006-04-20 | Yazaki Corp. | Electrical connection box |
| US6270360B1 (en) | 1999-02-26 | 2001-08-07 | Yazaki Corporation | Electric junction box with a relay |
| JP2001251734A (en) * | 2000-03-02 | 2001-09-14 | Sumitomo Wiring Syst Ltd | Wiring board for electric junction box |
| JP2007265795A (en) * | 2006-03-28 | 2007-10-11 | Furukawa Electric Co Ltd:The | Rotating connector |
| JP4495107B2 (en) * | 2006-03-28 | 2010-06-30 | 古河電気工業株式会社 | Rotating connector |
| JP2009284724A (en) * | 2008-05-26 | 2009-12-03 | Yazaki Corp | Method of processing electrical connection component |
| JP2010136496A (en) * | 2008-12-03 | 2010-06-17 | Autonetworks Technologies Ltd | Circuit forming body, method for manufacturing circuit forming body, and electrical junction box |
| JP2012164447A (en) * | 2011-02-04 | 2012-08-30 | Denso Corp | Wiring unit |
| WO2017191689A1 (en) * | 2016-05-06 | 2017-11-09 | Smk株式会社 | Electric connector and method for manufacturing electric connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2561948B2 (en) | 1996-12-11 |
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