JP2557998Y2 - Heat tunnel heating structure of cap seal device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat tunnel heating structure of a cap sealing device for sealing a flat package with a cap.

[0002]

2. Description of the Related Art Conventionally, a cap seal device is used to seal a flat package on which a chip is mounted in a semiconductor device manufacturing process. Such a cap sealing device includes a heat tunnel 1 as shown in FIG. 2, for example.

That is, the heat tunnel 1 is composed of a heat block 2 extending in the work transfer direction, and an upper cover 3 covering an upper portion of the heat block 2. The upper cover 3 includes peripheral wall portions 3 a, 3 a forming walls along both sides facing each other on the upper portion of the heat block 2,
It is a member having a U-shaped cross-section that connects the upper ends of the peripheral wall portions 3a and 3a and has a ceiling portion 3b that forms the ceiling of the heat tunnel 1. A work window (not shown) for supplying a cap is opened at an upper part of the work point located at the position.

On the other hand, inside the heat block 2,
A pair of heaters 4 and 4 parallel to each other are buried so as to extend in the direction of transporting the work. A plurality of inert gas outlets (not shown) are provided at the boundary between the both sides of the heat block 2 and the peripheral walls 3a, 3a of the upper cover 3.
Openings are provided at appropriate intervals along the work transfer direction. In the heat tunnel 1, an atmosphere for preventing oxidation is formed by an inert gas which is blown out from the outlet and flows through the heater tunnel 1 and flows out of the window (not shown). .

On the other hand, inside the heat tunnel 1, a flat package 11 as a work is placed in a heat block 2.
The carrier tape 21 extends to the upper part of the workpiece and moves in the direction of transporting the workpiece with the operation of the cap sealing device.
It is supported by. The flat package 11 is an upper opening-shaped container body in which external leads 12 extend around and a chip (not shown) is mounted inside the flat package 11, and a solder material such as gold is previously formed on the upper opening edge. 13 have been deposited.

In the cap sealing device provided with the heat tunnel 1, the carrier tape 2
1 transports the flat package 11 to the work point of the heat tunnel 1 and, at the time of this transport, heats the flat package 11 by the transfer and conduction heat from the heaters 4 and 4 to deposit the solder material on the upper opening edge thereof. 1
3 is melted. At this time, since the above-described atmosphere is formed in the heat tunnel 1, the molten solder material 13 is prevented from being oxidized. Thereafter, a cap (not shown) supplied through the work window (not shown) is placed on the flat package 11 transported to the work point.
And the flat package 11 is sealed by fixing the flat package 11 with the solder material 13.

[0007]

However, in such a conventional heat tunnel 1, after an inert gas which forms an atmosphere for preventing oxidation therein flows through the inside of the heat tunnel 1. Since the solder material 13 flows out of the work window (not shown) to the outside, the solder material 13 is hardly heated, and the molten solder material 13 at the time of the above-described transportation is deprived of the heat transmitted from the heat block 2 by the inert gas. . For this reason, a very thin layer in which the solder material 13 is not melted, that is, a so-called “film” is easily formed on the surface of the solder material 13 by being cooled by the inert gas. In addition to causing sealing failure, it has also been a factor of deteriorating the quality of the product.

[0008] That is, FIG.
Is a diagram showing a state in which the above-mentioned film is formed on the solder material 13 at the upper opening edge 11a of FIG. In such a state, when the cap is placed during the above-described sealing operation, the film is broken, and the melted solder material 13 flows out of or outside the flat package 11 from the broken portion. Therefore, when it flows outward (indicated by an arrow in the figure), the appearance quality of the product is impaired,
If it flows out (indicated by an arrow B in the figure), an electric leak occurs inside the flat package 11.

Of course, in order to avoid such a problem, it is conceivable to set the temperatures of the heaters 4 and 4 so high that the temperature of the inert gas rises to such an extent that the film cannot be formed on the surface of the solder material 13. However, in that case, a new problem such as deterioration of the quality of the chip mounted on the flat package due to heat occurs, which is impossible to realize.

The present invention has been made in view of such a conventional problem, and has as its object to provide a heat tunnel heating structure of a cap seal device which prevents the formation of a film on a molten solder material and stabilizes the quality of a product. Aim.

[0011]

According to the present invention, an inert gas is supplied into a heat tunnel formed by a heat block and a cover covering the heat block. In a cap sealing device for forming an atmosphere for preventing oxidation, while transporting a flat package on which a chip is mounted inside the heat tunnel while heating the flat package with the heat block, and sealing the upper portion of the flat package with a cap, The upper cover is provided with an upper heater extending in a transport direction of the flat package.

[0012]

In the above configuration, the inert gas supplied into the heat tunnel is heated from above and below by the heat block and the upper heater provided on the upper cover, and is heated.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. That is, FIG. 1 shows a heat tunnel 1 of a cap sealing device according to an embodiment of the present invention. As is clear from the drawing, the heat tunnel 1 has substantially the same configuration as that shown in the conventional example. Hereinafter, similar parts are denoted by the same reference numerals as in FIG. 2 and description thereof is omitted. . That is, in the heat tunnel 1 of the present invention, the ceiling portion 3b of the upper cover 3 that covers the upper side of the heat block 2 and forms the ceiling of the heat tunnel 1.
The upper heater 5 is buried at the bottom. The upper heater 5 extends in the direction of transport of the flat package 11 in the ceiling portion 3b, and is provided with a temperature control provided outside the drawing so that the temperature can be controlled independently of the heaters 4 and 4 of the heat block 2. Connected to the container.

In such a configuration, when the flat package 11 is conveyed to the work point and sealed while being heated inside the heat tunnel 1, an inert gas forming an atmosphere inside the heat tunnel 1 is heated by the inert gas of the heat tunnel 1. After being blown out from an air outlet (not shown) opened to the inside and flowing through the inside of the heat tunnel 1 while being heated while being heated from above and below by a heat block and an upper heater provided in an upper cover, It flows out through a work window that opens at the top of the work site.

Therefore, the solder material 1 melted during transport
3, the surface of the solder material 13 is not cooled by the inert gas, and the formation of a film on the surface of the solder material 13 can be prevented. Therefore, the flat package 11
And the quality of the product can be stabilized. In addition,
Since the inert gas is heated from above and below the heaters 4 and 4 and the upper heater 5 of the heat block 2,
It is not necessary to set the heaters 4 and 4 at a particularly high temperature, and the flat package 11 (chip) is hardly affected by the heat of the upper heater 5, so that there is no fear that the quality of the product is reduced by heat.

In this embodiment, the upper heater 5
Is buried in the ceiling 3b of the upper cover 3, but the present invention is not limited to this, and the upper heater 5 may be provided on the lower surface of the ceiling 3b constituting the ceiling of the heat tunnel 1.

[0017]

[Effect of the Invention] As described above, in the present invention,
In addition to forming the heat tunnel, the upper cover that covers the upper side of the heat block is provided with an upper heater that extends in the transport direction of the flat package, so that the heat is supplied to form an atmosphere for preventing oxidation inside the heat tunnel. The inert gas is heated from above and below by the heat block and the upper heater and is heated. For this reason, the solder material of the flat package that melts during transportation is not cooled by the inert gas, and the formation of a film on the surface thereof can be prevented. Therefore, the quality of the product can be stabilized.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view of a flat package according to an embodiment of the present invention, which is perpendicular to the transport direction of a flat package.

FIG. 2 is a schematic plan view showing a conventional example, which is perpendicular to the transport direction of a flat package.

FIG. 3 is an explanatory diagram showing an example of a film formed on a molten solder material.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat tunnel 2 Heat block 3 Upper cover 3a Peripheral wall 3b Ceiling 5 Upper heater 11 Flat package 11a Upper opening edge (of flat package) 13 Solder material

Claims (1)

(57) [Scope of request for utility model registration] An inert gas is supplied into a heat tunnel formed by a heat block and a cover covering the heat block to form an atmosphere for preventing oxidation, and a chip is formed inside the heat tunnel. In a cap sealing device that transports the mounted flat package while heating it with the heat block and then seals an upper portion of the flat package with a cap, the upper cover is provided with an upper heater extending in a transport direction of the flat package. A heat tunnel heating structure for a cap seal device, characterized in that: