JP2552597Y2 - Cutting blade for dicing equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting blade of a dicing apparatus, and more particularly to a cutting blade of a dicing apparatus for cutting a semiconductor wafer into dice along a predetermined path.

[0002]

2. Description of the Related Art Conventionally, a cutting blade of a dicing apparatus of this type has a donut-shaped hub having a blade formed with a cutting blade made of diamond abrasive grains formed in a predetermined range of a peripheral edge thereof, and is fixed by being fitted into a spindle. ing. This cutting blade is dressed in advance with a dress board in a process before cutting the wafer, but if the center with respect to the outer peripheral circle of the blade does not coincide with the spindle center, or if there is play due to fitting tolerance, the cutting blade is The dress board abuts on the outer peripheral blade portion farthest from the center of the eccentric spindle, and that portion is dressed and used. Then, at the time of wafer cutting, the semiconductor wafer (hereinafter, referred to as “work”) adsorbed on the cutting table of the dicing apparatus is cut into a dice along a predetermined path by the cutting blade.

[0003]

However, when the cutting blade of the conventional dicing apparatus has a play due to the tolerance of fitting between the hub and the spindle, when the hub is inserted into the spindle, the center of the hub is caused by the weight of the hub. It is fixed at a position lowered with respect to the center axis of the spindle. That is, in this case, the center of the blade outer peripheral circle does not coincide with the center of the spindle shaft and is eccentric, and when the cutting blade is located below the spindle, the cutting blade is surely dressed. When a portion other than the cutting blade is located, the cutting blade is not dressed. When the work is cut with a cutting blade that is not dressed, there is a disadvantage that the cut surface of the work meanders and chipping and cracks are generated in the work. When the center of the outer peripheral blade of the hub blade and the center of the hub fitted to the spindle do not coincide with each other and are eccentric, the blade portion farthest from the center of the spindle first comes into contact with the work, and the above-described problem occurs.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a cutting tooth of a dicing apparatus which can surely dress a cutting blade of a blade.

[0005]

According to the present invention, in order to achieve the above object, a hub having a blade in which a cutting blade made of diamond abrasive grains is formed in a predetermined range of a peripheral edge thereof is fixed to a spindle. In a cutting blade of a dicing apparatus that cuts a wafer along a predetermined path by a cutting blade of the blade by rotating the hub, a mark indicating a forming position of the cutting blade is provided on the blade or the hub. It is characterized by being attached.

[0006]

According to the present invention, a mark indicating a cutting blade forming position is attached to a blade or a hub, and the hub is fixed to the spindle so that the cutting blade is positioned below the spindle according to the mark. Thus, the cutting blade can be positioned at the bottom dead center of the hub, so that the cutting blade can be surely dressed.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the cutting blade of the dicing apparatus according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a perspective view of a dicing apparatus 10 to which the cutting blade of the dicing apparatus according to the present invention is applied. The dicing apparatus 10 performs fine alignment of the work 16 sucked via the sheet 14 to the cutting table 12 shown in FIG. The work 16 is cut into die-shaped chips along a predetermined path. At the time of cutting, the cutting water injection nozzle 20 (see FIG. 1),
Cutting water jetted from the washing water jet nozzles 22, 22,
Cooling and cleaning of the cutting section 18 are performed by the cleaning water.

As shown in FIG. 2, in the dicing apparatus 10, a spindle 26 having a tapered surface 26a is connected to a driving motor 24. The tapered surface 26a is connected to an inner peripheral tapered surface 28a of a flange 28. Is fitted, and the flange 28 is attached. The flange 28 is screwed into a flange fixing nut 30 screwed to the tip of the spindle 26 so that the spindle 2 can rotate.
6 is fixed.

The cutting portion mounting portion 28b of the flange 28 includes
The cutting portion 18 is fitted and attached. The cutting portion 18 is configured such that a blade 34 is fixed to an outer peripheral portion of a hub 32 formed in a donut shape. The blade 34 is in contact with a support surface 28c of the flange 28, and the hub 32 is formed by screwing a hub fixing nut 36 into a female screw 28d of the flange 28.
It is fixed to.

On the other hand, in the manufacturing process, it is difficult to make the hub mounting center coincide with the center of the circumference of the outer peripheral blade, so that some eccentricity must be prepared. When the blade is shipped as a product, it is pre-dressed at the factory to form a cutting blade and then shipped, but as described above, the outer blade of the hub blade and the center of the hub fitted to the spindle are not aligned and are eccentric. In such a case, the product is shipped with the blade formed only on a part of the circumference furthest from the center of the spindle. At this time, a mark (●) 40 indicating the forming position of the cutting blade 38 is formed on the hub 32 side, and the mark 40 is formed at the center of the forming position of the cutting blade 38. Note that point P in FIG. 3 is an example in which the center of the hub 32 is located above the center of the circumference of the outer peripheral blade.

Next, in order to attach the cut portion 18 of the dicing apparatus 12 configured as described above to the flange 28,
The cut portion 18 is connected to the flange 28 so that the mark 40 formed on the hub 32 is located directly below the spindle 26.
And the hub fixing nut 36
Fix with. Accordingly, since the diamond abrasive grain forming portion of the cutting blade 38 is located at the farthest position with respect to the center of the spindle 26, the cutting blade is surely dressed when the cutting blade 38 is dressed.

Therefore, in this embodiment, the cutting portion 18 is attached according to the mark 40 as described above,
It is possible to prevent meandering and chipping of the work 18 and cracking of the work 18 caused by poor dressing of the cutting blade 38. In this embodiment, the mark 40 is formed on the hub 32, but may be formed on the blade 34. Further, the mark 40 may be formed at a position where the formation position of the cutting blade 38 can be grasped, for example, on the opposite side of the cutting blade 38 or the like.

[0013]

As described above, according to the cutting blade of the dicing apparatus according to the present invention, a mark indicating the forming position of the cutting blade is attached to the blade or hub, and the cutting blade is placed below the spindle according to the mark. Since the hub is fixed to the spindle so as to be positioned, the cutting blade can be reliably dressed, and the preliminary operation before regular cutting can be significantly shortened, thereby improving productivity.

[Brief description of the drawings]

FIG. 1 is a perspective view of a dicing apparatus to which a cutting blade of a dicing apparatus according to the present invention is applied.

FIG. 2 is a cross-sectional view of the dicing apparatus with the cutting blade of the dicing apparatus according to the present invention.

FIG. 3 is a front view showing an embodiment of the cutting blade of the dicing apparatus according to the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Dicing apparatus 16 ... Work 18 ... Cutting part 26 ... Spindle 28 ... Flange 32 ... Hub 34 ... Blade 38 ... Cutting blade 40 ... Mark

Claims (1)

(57) [Scope of request for utility model registration] 1. A hub having a blade in which a cutting blade made of diamond abrasive grains is formed in a predetermined area of a peripheral edge thereof is fixed to a spindle, and the hub is rotated by the spindle, whereby a wafer is cut by the blade of the blade. A cutting blade of a dicing device for cutting along a predetermined path, wherein a mark indicating a forming position of the cutting blade is attached to the blade or the hub.