JP2549988Y2 - Optical semiconductor device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an optical semiconductor device.

[0002]

2. Description of the Related Art FIGS. 4 and 5 show the structure and manufacturing method of a conventional side-view type optical semiconductor device.

[0003] As shown in FIG. 4, an optical semiconductor element (light emitting element or light receiving element) 1 is mounted on a mounting lead terminal 3 of a lead frame 2, and is electrically connected to a connection lead terminal 5 of the lead frame 2 by a bonding wire 4. After the electrical connection, as shown in FIG. 5, the outer periphery of the optical semiconductor element 1 is covered and molded with a transparent resin to form an envelope 6. Further, the tie bar 7 and the cradle 8 are cut at the cutting positions A and B in such a manner that the respective lead terminals 2 and 3 are independent, thereby completing the optical semiconductor device.

When a light emitting element is used in the optical semiconductor device, light emitted from the light emitting element 1 is condensed by the effect of the condenser lens 6a as shown in FIG.
Directional characteristics.

[0005]

Generally, the amount of light incident on the light-receiving element of the optical semiconductor device and the direction of the light emitted from the light-emitting element are determined by the shape of the condenser lens formed on the package. Is done.

In a conventional optical semiconductor device, since there is only one kind of condensing lens of a package, only one kind of light receiving amount and light emitting direction, that is, directivity, can be obtained in one package. Therefore, in order to meet the demands of various directional characteristics in the market, a large number of molding dies and the like are required.

SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide an optical semiconductor device capable of selecting two types of directional characteristics using the same members and equipment as before.

[0008]

Problem solving means according to the present invention according to claim 1 Means for Solving the Problems], as shown in FIG. 1, the lead frame 2 Rights
Shall apply to the optical semiconductor element 1 is selectively mounted on either the front or back of the surface with a mold and an optical semiconductor device comprising, a condenser lens 10 having different directional characteristics in the surface and back of the envelope 6 , 11 are provided.

[0009]

[0010]

According to the first aspect of the present invention, condensing lenses 10 and 11 having different directivity characteristics are provided on the front surface and the back surface of the envelope 6, respectively. With this structure, the optical semiconductor element 1 is mounted on the flat portion of the lead frame 2 on the required lens side, so that two types of packages can be formed in one package using the same members and equipment as before. The directional characteristics can be selected.

The directional characteristics of the optical semiconductor device 1
When a light emitting element is used for
In the case where a light receiving element is used, this is the amount of incident light.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a diagram showing a completed state of a mold in an optical semiconductor device according to an embodiment of the present invention, and FIG. 1-A is a completed state of a mold when a condenser lens on the front side of an envelope is used. FIG. 1-B is a side view of FIG. 1-A,
FIG. 1-C is a plan view showing a mold completed state when a condenser lens on the back side of the envelope is used, and FIG.
FIG.

FIG. 2 is a view showing a completed state of wire bonding, FIG. 2A is a plan view showing a completed state of wire bonding corresponding to FIGS. 1A and 1B, and FIG. 2-C is a plan view showing a completed state of wire bonding corresponding to FIGS. 1-C and D, and FIG. 2-D is a side view of FIG. 2-C.

FIG. 3A is a ray diagram showing a light emitting state of the optical semiconductor device corresponding to FIGS. 1A and 1B, FIG. 3B is a diagram showing the directional characteristics thereof, and FIG. 3D is a ray diagram showing a light emitting state of the optical semiconductor device corresponding to D, and FIG.

The same functional parts as those in the prior art shown in FIGS.

As shown in the figure, the optical semiconductor device of this embodiment is
1. A side-view type optical semiconductor device in which an optical semiconductor element 1 is molded with a translucent resin, wherein a first condensing lens 10 having high directivity is provided on a surface of an envelope 6, and a first condensing lens 10 is provided on a rear surface. A second condenser lens 11 having lower directivity than one condenser lens 10 is provided.

The optical semiconductor element 1 is a light emitting element (LE)
D) is used, and as shown in FIG.
It is installed in.

The lead frame 2 is composed of the optical semiconductor device 1
And a tie bar 7 connecting the lead terminals 3 to each other at an intermediate position between the lead terminals 3 and 5, a connection lead terminal 5 internally connected to the optical semiconductor element 1 via a bonding wire 4, And a cradle 8 for supporting each of the lead terminals 3 and 5 in a cantilever manner. And
A mounting piece 3a to which the optical semiconductor element 1 is die-bonded is provided at the tip of the mounting lead terminal 3, and a connecting piece 5a to be internally connected to the optical semiconductor element 1 is provided at a tip of the connecting lead terminal 5. ing.

As shown in FIG. 1, the envelope 6 is formed of a light-transmitting resin in a rectangular shape, and has a concave portion on its back surface for preventing the second condenser lens 11 from projecting from the envelope 6. 20 are provided. The recess 20 is formed in a circular shape slightly larger than the diameter of the second condenser lens 11, as shown in FIG. 1-C.

The condenser lenses 10 and 11 are hemispherical lenses, and are formed integrally with the envelope 6.

Next, a method for manufacturing the optical semiconductor device will be described.

First, the optical semiconductor device 1 is connected to the lead frame 2.
Is mounted on the mounting piece 3a, and the optical semiconductor element 1 and the connection piece 5a of the lead frame 2 are electrically connected by the bonding wire 4.

Thereafter, the mold W is set, and the outer periphery of the optical semiconductor element 1 is molded with a transparent resin (FIG. 1).
-B, D). Then, since the mold W is provided with the hemispherical concave portions 30 and 31 having different curvatures, the envelope 6 having the condensing lenses 10 and 11 having different directivity characteristics on the front and back surfaces is formed.

Further, the optical semiconductor device is completed by cutting the tie bar 7 and the cradle 8 at the cutting positions A and B (see FIG. 1) so that the respective lead terminals 3 and 5 are independent.

At this time, when the first condenser lens 10 provided on the surface of the envelope 6 is used, the optical semiconductor element 1 is attached to the first piece 3a of the mounting piece 3a as shown in FIGS. Condensing lens 1
If it is mounted on the 0 side, that is, the surface, and molded,
The optical semiconductor device shown in FIGS.

Thus, the optical semiconductor device (light emitting device) 1
As shown in FIG. 3A, the light emitting state of the lens becomes high due to the lens effect of the first condenser lens 10,
The directional characteristics shown in FIG.

On the other hand, when the second condenser lens 11 provided on the back surface of the envelope 6 is used, as shown in FIGS. Optical lens 11
If it is mounted and molded on the side, that is, the back side, FIG.
The optical semiconductor device shown in FIG.

Thus, the optical semiconductor device (light emitting device) 1
3C has a lens effect of the second condenser lens 11 as shown in FIG. 3C, but the light density is lower than that of the optical semiconductor device of FIGS. 1A and 1B, and the directional characteristic of FIG. Get.

Further, since the concave portion 20 is formed on the back surface of the envelope 6, the second condenser lens 11 does not protrude from the envelope 6, so that the flat surface of the envelope 6 can be secured. it can. For this reason, the workability of assembling to a substrate, a holder or the like is improved.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that many modifications and changes can be made to the above-described embodiment within the scope of the present invention.

In the above embodiment, the case where a light emitting element is used as the optical semiconductor element 1 has been described, but a light receiving element may be used.

Further, the arrangement of the first condenser lens and the second condenser lens may be reversed, and the concave portion may be provided on the front surface or both front and rear surfaces.

[0034]

As is apparent from the above description, according to the first aspect of the present invention, lenses having different directional characteristics are provided on the front and back surfaces of the envelope, and two kinds of lenses are provided by one envelope. With a structure having a lens, the optical semiconductor element can be mounted on the flat part of the lead frame on the required lens side, so that the same member and equipment as those in the related art can be used and a single envelope can be used. Different directional characteristics can be selected.

[0035]

[Brief description of the drawings]

FIG. 1 is a view showing a completed state of an optical semiconductor device according to an embodiment of the present invention; FIG. 1A is a view showing completion of molding when a condenser lens on the front side of an envelope is used; 1B is a side view of FIG. 1A, FIG.
FIG. 1C is a plan view showing a completed mold state when a condenser lens on the back side of the envelope is used, and FIG. 1D is a side view of FIG. 1C.

FIG. 2 is a view showing a state where wire bonding is completed, FIG. 2A is a plan view showing a state where wire bonding is completed corresponding to FIGS. 1A and 1B, and FIG. A is a side view, FIG. 2-C is a plan view showing a completed state of wire bonding corresponding to FIGS. 1-C and D, and FIG. 2-D is a side view of FIG. 2-C.

FIG. 3A is a ray diagram showing a light emitting state of the optical semiconductor device corresponding to FIGS. 1A and 1B, FIG. 3B is a diagram showing the directional characteristics thereof, and FIG. FIG. 3D is a ray diagram showing a light emitting state of the optical semiconductor device corresponding to C and D, and FIG.

FIG. 4 is a view showing a completed state of wire bonding in the conventional optical semiconductor device, FIG. 4-A is a plan view, and FIG.
-B is a side view.

5 is a view showing a completed state of the mold, FIG. 5A is a plan view, and FIG. 5B is a side view.

FIG. 6A is a ray diagram showing a light emitting state of a conventional optical semiconductor device, and FIG. 6B is a diagram showing directional characteristics.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Optical semiconductor element 2 Lead frame 6 Envelope 10, 11 Condensing lens 20 Depression

Claims (1)

(57) [Scope of request for utility model registration] 1. A surface or a flat portion of a lead frame.
Is an optical semiconductor device formed by molding an optical semiconductor element selectively mounted on one of the back surfaces, wherein condensing lenses having different directional characteristics are provided on the front surface and the back surface of the envelope. Optical semiconductor device.