JP2549768Y2 - Package for storing solid-state image sensor - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a package for accommodating a solid-state image sensor for accommodating a solid-state image sensor.

[0002]

2. Description of the Related Art Conventionally, a solid-state image sensing device housing package for housing a solid-state image sensing device is usually made of an electrically insulating material such as alumina ceramics, and is provided at a substantially central portion of an upper surface thereof for housing the solid-state image sensing device. Tungsten (W) derived from the concave portion and the periphery of the concave portion to the bottom surface,
A rectangular insulating base having a metallized wiring layer made of a high melting point metal powder such as molybdenum (Mo); and a brazing material such as silver braze for the metallized wiring layer for electrically connecting the solid-state imaging device to an external electric circuit. And a lid made of a light-transmissive material such as sapphire, glass, etc., and a solid-state image sensor is bonded to the bottom of the concave portion of the insulating base via an adhesive. The solid-state imaging device is fixed and each input / output electrode of the solid-state imaging device is connected to a metallized wiring layer via a bonding wire. An image pickup device is obtained by hermetically sealing the element inside.

In the conventional package for storing a solid-state image pickup device, after the solid-state image pickup device is stored in the package,
The solid-state imaging device is connected to the external electric circuit by connecting the external input / output terminal to the external electric circuit, and the optical image reduced by the external lens member is connected to the solid-state imaging device via the transparent cover. It functions as an imaging device such as a video camera by causing an image to be generated and causing the solid-state imaging device to perform photoelectric conversion.

Recently, however, the solid-state image pickup device has been diversified, so that a single solid-state image pickup device, such as a frame transfer type solid-state image pickup device, has a conversion region for photoelectrically converting an optical image into an electric image signal. And a memory area for temporarily storing the electric image signal converted in the area and outputting the temporarily stored electric image signal to an external electric circuit. When the solid-state imaging device is housed in the rectangular insulating base of the device housing package, the input / output electrodes of the solid-state imaging device are formed only in the memory area, so that each of the input / output electrodes is connected to the metallized wiring layer provided on the insulating base. Is performed only on one side of the insulating base, and at the same time, the external input / output terminals that connect each input / output electrode of the solid-state imaging device to an external electric circuit are also connected to the electrical resistance of the metallized wiring layer. It will be formed by offset to one side of the rectangular insulating base from the relationship. Therefore, when the solid-state image sensor is housed in this solid-state image sensor housing package to form an imaging device and then mounted on an external electric circuit board, the solid-state image sensor housing package has an external input / output terminal on one side of the insulating base. There is a high risk that the solid-state image sensor is mounted on the external electric circuit board in a tilted manner due to the uneven mounting. The optical axis with an external lens member that forms an optical image on the image sensor is not perpendicular, and as a result, an accurate optical image cannot be formed on the solid-state image sensor and an accurate electrical image signal Cannot be obtained.

[0005]

The present invention comprises a rectangular insulating base having a plurality of external input / output terminals and a lid, wherein the plurality of external input / output terminals are offset toward one side of the rectangular insulating base. In the attached solid-state imaging device housing package, a dummy terminal is attached to a side of the rectangular insulating base opposite to a side to which external input / output terminals are attached.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the embodiments shown in the accompanying drawings. FIG. 1 is a sectional view showing an embodiment of a package for accommodating a solid-state imaging device according to the present invention, wherein 1 is a rectangular insulating base, 2 is a lid, 3 is an external input / output terminal, and 4 is a dummy terminal.

The rectangular insulating substrate 1 is made of an electrically insulating material such as alumina ceramics, and has a concave portion for accommodating the solid-state image pickup device 5 at the center of the upper surface thereof. It is attached and fixed via an adhesive such as resin.

When the rectangular insulating substrate 1 is made of, for example, alumina ceramics, an organic solvent suitable for a raw material powder such as alumina (Al ₂ O ₃ ), silica (CaO), magnesia (MgO), calcia (CaO), A solvent is added and mixed to form a slurry, which is then formed into a ceramic green sheet (ceramic green sheet) by employing a doctor blade method.After that, the ceramic green sheet is subjected to appropriate punching and a plurality of sheets are formed. Laminated,
It is obtained by firing at a high temperature (about 1600 ° C).

A metallized wiring layer 6 is led out from the periphery of the concave portion of the rectangular insulating base 1 to the bottom surface of the insulating base 1 and is offset to one side.
Reference numeral 6 serves to connect the output electrode of the solid-state imaging device 5 to the external input / output terminal 3.Around the concave portion of the metallized wiring layer 5, a bonding wire 7 connected to the output electrode of the solid-state imaging device 5 is provided. External input / output terminals
3 is attached via a brazing material such as silver brazing.

The metallized wiring layer 6 is made of tungsten,
A metal paste made of a high melting point metal powder such as molybdenum, manganese or the like and obtained by adding an appropriate organic solvent or solvent to the high melting point metal powder such as tungsten is mixed with a ceramic green sheet serving as the rectangular insulating substrate 1. The ceramic green sheet is printed and applied by a known screen printing method or the like, and when the ceramic green sheet is formed into the insulating substrate 1, the insulating substrate 1 is simultaneously formed.

An external input / output terminal 3 attached to the metallized wiring layer 6 attached to the rectangular insulating base 1 connects each input / output electrode of the solid-state imaging device 5 housed therein to an external electric circuit. A rod made of a metal such as Kovar metal or 42 alloy is used.

The rectangular insulating substrate 1 has a dummy terminal 4 attached to the bottom surface thereof on the side opposite to the side where the external input / output terminals 3 are attached.

When the package for storing the solid-state image pickup device is mounted on an external electric circuit board, the dummy terminal 4 is mounted on the external electric circuit board because the external input / output terminal 3 is attached to one side of the insulating base 1 so as to be offset. The image pickup device housing package is mounted with an inclination on the side of the insulating base opposite to the side where the external input / output terminals 3 are attached, and acts so as to be mounted horizontally. The top surface of the solid-state imaging device 5 housed inside the imaging device housing package is perpendicular to the optical axis of an external lens member (not shown), and the solid-state imaging device 5 displays an optical image reduced by the external lens member. An image can always be formed accurately, and at the same time, a solid-state image sensor
5) It is possible to accurately perform photoelectric conversion from an optical image to an electric image signal.

The dummy terminal 4 is made of a metal such as Kovar metal or 42 alloy. The metallized metal layer 8 made of a refractory metal powder such as tungsten or molybdenum, which has been previously adhered to the bottom surface of the insulating base 1, has a silver solder. It is attached to the bottom surface of the insulating base 1 by brazing through a brazing material such as.

The external input / output terminal 3, the dummy terminal 4
If the metallized wiring layer 6 is coated with a metal having excellent corrosion resistance such as nickel and gold and a good conductivity to a thickness of 1.0 to 20.0 μm by plating on the exposed outer surface, the external input / output terminals 3 and Oxidative corrosion of the dummy terminal 4 and the metallized wiring layer 6 is effectively prevented, and the external input / output terminals 3
The connection to the external electric circuit and the bonding of the bonding wire 7 to the metallized wiring layer 6 become extremely good. Therefore, the external input / output terminal 3, the dummy terminal 4, and the metallized wiring layer 6 are plated with a metal having excellent corrosion resistance such as nickel and gold and good conductivity by plating on the exposed outer surface.
It is preferable to coat the layer to a thickness of 0.0 μm.

A cover 2 is attached to the upper surface of the rectangular insulating base 1 via a sealing material such as glass, resin, etc., so that the inside of the package for accommodating the solid-state imaging device is completely airtightly sealed. Is done.

The lid 2 is made of a light-transmitting material such as sapphire or glass, and a solid-state image pickup device in which an optical image reduced by an external lens member (not shown) is accommodated in a package.
5 Acts to form an incident image on the top.

When the light-transmitting lid 2 is made of, for example, glass, the glass component powder such as silica (CaO), alumina (Al ₂ O ₃ ), calcia (CaO), barium oxide (BaO) is melted. It is obtained by cooling and forming into a flat plate.

Thus, according to the package for accommodating the semiconductor device of the present invention, the solid-state image pickup device 5 is fixed to the bottom surface of the concave portion of the rectangular insulating base 1, and each input / output electrode of the solid-state image pickup device 5 is connected via the bonding wire 7. By connecting to the metallized wiring layer 6 and attaching the lid 2 to the upper surface of the rectangular insulating base 1 via a sealing material, an imaging device as a final product is obtained.

[0020]

According to the present invention, the present invention comprises a rectangular insulating base having a plurality of external input / output terminals and a lid, wherein the plurality of external input / output terminals are attached to one side of the rectangular insulating base in a biased manner. In the package for storing the solid-state imaging device, the dummy terminal is mounted on the side of the rectangular insulating substrate opposite to the side on which the external input / output terminal is mounted, so that the solid-state imaging device is housed inside the package. Then, when this is mounted on an external electric circuit board, the solid-state image sensor storage package can be mounted horizontally on the external electric circuit board, and as a result, the surface of the solid-state image sensor is aligned with the optical axis of the external lens member. It is possible to accurately form an optical image reduced by an external lens member on a solid-state imaging device, and to make the solid-state imaging device accurately perform photoelectric conversion of an optical image into an electrical image signal. It is possible.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an embodiment of a package for storing a solid-state imaging device according to the present invention.

FIG. 2 is a sectional view of a conventional package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating base 2 ... Lid 3 ... External input / output terminal 4 ... Dummy terminal

Claims (1)

(57) [Scope of request for utility model registration] 1. A solid-state imaging device housing comprising a rectangular insulating base having a plurality of external input / output terminals and a lid, wherein the plurality of external input / output terminals are attached to one side of the rectangular insulating base. A package for solid-state imaging devices, wherein a dummy terminal is attached to a side of the rectangular insulating substrate opposite to a side to which external input / output terminals are attached.