JP2544146Y2 - フラットパッケージ型半導体製品用の樹脂封止成形装置 - Google Patents

フラットパッケージ型半導体製品用の樹脂封止成形装置

Info

Publication number
JP2544146Y2
JP2544146Y2 JP1988057969U JP5796988U JP2544146Y2 JP 2544146 Y2 JP2544146 Y2 JP 2544146Y2 JP 1988057969 U JP1988057969 U JP 1988057969U JP 5796988 U JP5796988 U JP 5796988U JP 2544146 Y2 JP2544146 Y2 JP 2544146Y2
Authority
JP
Japan
Prior art keywords
mold
resin
deformation preventing
plate
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988057969U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01161329U (enExample
Inventor
道男 長田
Original Assignee
トーワ 株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by トーワ 株式会社 filed Critical トーワ 株式会社
Priority to JP1988057969U priority Critical patent/JP2544146Y2/ja
Publication of JPH01161329U publication Critical patent/JPH01161329U/ja
Application granted granted Critical
Publication of JP2544146Y2 publication Critical patent/JP2544146Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1988057969U 1988-04-28 1988-04-28 フラットパッケージ型半導体製品用の樹脂封止成形装置 Expired - Lifetime JP2544146Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988057969U JP2544146Y2 (ja) 1988-04-28 1988-04-28 フラットパッケージ型半導体製品用の樹脂封止成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988057969U JP2544146Y2 (ja) 1988-04-28 1988-04-28 フラットパッケージ型半導体製品用の樹脂封止成形装置

Publications (2)

Publication Number Publication Date
JPH01161329U JPH01161329U (enExample) 1989-11-09
JP2544146Y2 true JP2544146Y2 (ja) 1997-08-13

Family

ID=31283807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988057969U Expired - Lifetime JP2544146Y2 (ja) 1988-04-28 1988-04-28 フラットパッケージ型半導体製品用の樹脂封止成形装置

Country Status (1)

Country Link
JP (1) JP2544146Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6279632A (ja) * 1985-10-03 1987-04-13 Mitsubishi Electric Corp 樹脂封止装置

Also Published As

Publication number Publication date
JPH01161329U (enExample) 1989-11-09

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