JP2544146Y2 - フラットパッケージ型半導体製品用の樹脂封止成形装置 - Google Patents
フラットパッケージ型半導体製品用の樹脂封止成形装置Info
- Publication number
- JP2544146Y2 JP2544146Y2 JP1988057969U JP5796988U JP2544146Y2 JP 2544146 Y2 JP2544146 Y2 JP 2544146Y2 JP 1988057969 U JP1988057969 U JP 1988057969U JP 5796988 U JP5796988 U JP 5796988U JP 2544146 Y2 JP2544146 Y2 JP 2544146Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- deformation preventing
- plate
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 title claims description 41
- 239000011347 resin Substances 0.000 title claims description 41
- 239000004065 semiconductor Substances 0.000 title claims description 38
- 238000000465 moulding Methods 0.000 title claims description 30
- 238000005538 encapsulation Methods 0.000 title description 4
- 238000007789 sealing Methods 0.000 claims description 14
- 230000002457 bidirectional effect Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988057969U JP2544146Y2 (ja) | 1988-04-28 | 1988-04-28 | フラットパッケージ型半導体製品用の樹脂封止成形装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988057969U JP2544146Y2 (ja) | 1988-04-28 | 1988-04-28 | フラットパッケージ型半導体製品用の樹脂封止成形装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01161329U JPH01161329U (en, 2012) | 1989-11-09 |
| JP2544146Y2 true JP2544146Y2 (ja) | 1997-08-13 |
Family
ID=31283807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988057969U Expired - Lifetime JP2544146Y2 (ja) | 1988-04-28 | 1988-04-28 | フラットパッケージ型半導体製品用の樹脂封止成形装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2544146Y2 (en, 2012) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279632A (ja) * | 1985-10-03 | 1987-04-13 | Mitsubishi Electric Corp | 樹脂封止装置 |
-
1988
- 1988-04-28 JP JP1988057969U patent/JP2544146Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01161329U (en, 2012) | 1989-11-09 |
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