JPH01161329U - - Google Patents
Info
- Publication number
- JPH01161329U JPH01161329U JP5796988U JP5796988U JPH01161329U JP H01161329 U JPH01161329 U JP H01161329U JP 5796988 U JP5796988 U JP 5796988U JP 5796988 U JP5796988 U JP 5796988U JP H01161329 U JPH01161329 U JP H01161329U
- Authority
- JP
- Japan
- Prior art keywords
- fixed
- lead
- movable
- mold plates
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 230000002265 prevention Effects 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 4
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988057969U JP2544146Y2 (ja) | 1988-04-28 | 1988-04-28 | フラットパッケージ型半導体製品用の樹脂封止成形装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988057969U JP2544146Y2 (ja) | 1988-04-28 | 1988-04-28 | フラットパッケージ型半導体製品用の樹脂封止成形装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01161329U true JPH01161329U (en, 2012) | 1989-11-09 |
| JP2544146Y2 JP2544146Y2 (ja) | 1997-08-13 |
Family
ID=31283807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988057969U Expired - Lifetime JP2544146Y2 (ja) | 1988-04-28 | 1988-04-28 | フラットパッケージ型半導体製品用の樹脂封止成形装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2544146Y2 (en, 2012) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279632A (ja) * | 1985-10-03 | 1987-04-13 | Mitsubishi Electric Corp | 樹脂封止装置 |
-
1988
- 1988-04-28 JP JP1988057969U patent/JP2544146Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279632A (ja) * | 1985-10-03 | 1987-04-13 | Mitsubishi Electric Corp | 樹脂封止装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2544146Y2 (ja) | 1997-08-13 |