JP2543461B2 - Ultra-thin metal foil plating equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus used for plating an ultrathin metal foil using a radial cell.

[0002]

2. Description of the Related Art When a metal plate (hereinafter referred to as a strip) is conventionally plated using a radial cell system, a plating solution rotates around the back side of the metal plate during immersion in a plating bath to a conductor roll (hereinafter referred to as CR). In order to prevent precipitation, a soft rubber is used as a part of the CR for the insulation part, and a high line tension is applied to the strip for CR.
Are pressed against. For example, Japanese Patent Publication No. 46-7162 discloses that Zn precipitation can be prevented by pressing a small diameter roll against the CR surface to control the thickness of the electrolyte solution film. Further, Japanese Patent Publication No. 59-15997 discloses that Zn deposition on CR can be prevented by pressing a strip against CR by using a jet of plating solution and a pressing roll together. However, when plating a very thin foil strip by using the conventional radial cell method, the strip tension required to prevent the backing of the plating solution cannot be applied because the plate thickness is thin. Further, the use of the press roll has a disadvantage that a pressing mark is generated due to a step at the boundary between the CR current-carrying part and the insulating part.

[0003]

SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, the object of the present invention is to apply a plating solution to the back side of a metal plate when plating a strip using a radial cell, and to plate the metal on the CR. An object of the present invention is to provide an ultrathin metal foil plating apparatus for preventing the precipitation of metal.

[0004]

In order to achieve the above object, the present invention has conducted extensive studies on an apparatus having a low strip tension and no backing of a plating solution for plating an ultrathin metal foil. Alumina ceramic that does not elastically deform like rubber was used as the material of the parts (both ends). In addition, the ringer roll is installed in front of the CR (refers to the strip entry side direction) to prevent the pretreatment liquid from being brought in, and by pressing the strip against the CR with the roll, plating is performed during immersion of the plating solution to the current band. It was possible to prevent the back of the liquid. Furthermore, on CR ((C
By placing a dam roll (in contact with the upper part of R) and accumulating the plating solution, it is possible to dissolve the plating metal such as Zn which is gradually deposited in the CR current-carrying part during continuous operation. It was possible to make the prevention measures against precipitation more complete. That is, the present invention provides a CR using a ceramic as an insulating material at both ends, a ringer roll installed in front of the CR to prevent the pretreatment liquid from being brought into the CR, and a CR in the radial cell plating apparatus. For an ultra-thin metal foil, including a pressing roll for pressing the strip and a dam roll installed on the CR for melting plating metal such as Zn that is deposited little by little on the CR current-carrying part. It is composed of a plating device.

[0005]

Next, the operation of the present invention will be described in detail. FIG. 1 is a schematic view of an apparatus for plating an ultrathin metal foil using the plating apparatus of the present invention. In FIG. 1, 1 is a plating solution tank, 2 is a plating solution, 3 is CR, 4 is a deflector roll, 5 is a strip, 6 is an electrode, 7 is a ringer roll, 8 is a press roll, and 9 is a dam roll. From the right side of FIG. 1, the pretreated strip 5 enters the ringer roll 7 (the ringer roll is placed in front of CR, that is, in the strip entering side direction as shown in FIG. 1),
After being sufficiently drained, it is wound around the CR 3 via the deflector roll 4. After that, the strip wound around the CR is plated by the anode immersed in the plating solution. At that time, the strip winding portion, and
By pressing the part leaving the CR with the pressing roll 8, the plating solution was prevented from entering the CR energizing band during immersion of the plating solution. It was possible to press the strip with the pressing roll even though the object to be plated was an ultra-thin metal foil. Because it was done. Further, in order to remove the plating metal that is deposited little by little, install the dam roll 9 on the CR (in a state of being in contact with the upper part of the CR in FIG. 1) and store the low-PH plating solution there. The precipitate was dissolved by.

[0010]

EFFECTS OF THE INVENTION Since the present invention is constructed as described above, it is possible to prevent the pretreatment liquid from being brought in, and to prevent the plating solution from wrapping around to the conduction band during immersion of the plating solution.
By installing a dam roll on top and accumulating the plating solution, it becomes possible to dissolve Zn that gradually precipitates in the CR current-carrying part during continuous operation, thereby making the Zn precipitation prevention measure more complete. It is possible to provide an ultra-thin metal foil plating apparatus that can be used.

[Brief description of drawings]

FIG. 1 is a schematic view of a plating apparatus of the present invention. 1, plating bath 2, plating bath 3, conductor roll 4, deflector roll 5, strip 6, electrode 7, ringer roll 8, press roll 9, dam roll

Claims (1)

(57) [Claims] 1. In a radial cell type plating apparatus,
A conductor roll using ceramics as an insulating material at both ends, a ringer roll installed in front of the conductor roll to prevent carry-in of pretreatment liquid to the conductor roll, and a press roll for pressing the strip on the conductor roll. An ultra-thin metal foil, which is installed in contact with the upper portion of the conductor roll, and a dam roll for accumulating a solution for dissolving a plating metal such as Zn, which is deposited little by little on the current-carrying portion of the conductor roll. Plating equipment.