JP2542791B2 - Process for producing processable conductive colloidal polymer - Google Patents
Process for producing processable conductive colloidal polymerInfo
- Publication number
- JP2542791B2 JP2542791B2 JP5301215A JP30121593A JP2542791B2 JP 2542791 B2 JP2542791 B2 JP 2542791B2 JP 5301215 A JP5301215 A JP 5301215A JP 30121593 A JP30121593 A JP 30121593A JP 2542791 B2 JP2542791 B2 JP 2542791B2
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- emulsion
- poly
- acrylate
- oxidant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
- C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
- C08G73/026—Wholly aromatic polyamines
- C08G73/0266—Polyanilines or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0605—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0611—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only one nitrogen atom in the ring, e.g. polypyrroles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
- H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、加工可能な電導性コロ
イドポリマーの製造方法に関し、特に立体安定剤として
ポリマー乳濁液を用いた水性反応媒質中の芳香族複素環
式モノマーの酸化的重合によるコロイドポリマーの製造
方法に関する。FIELD OF THE INVENTION This invention relates to a process for preparing processable conductive colloidal polymers, and more particularly to the oxidative polymerization of aromatic heterocyclic monomers in an aqueous reaction medium using a polymer emulsion as a steric stabilizer. To a method for producing a colloidal polymer.
【0002】[0002]
【従来の技術】印刷回路板の製造は、プラスチック支持
体などの非電導性支持体上に電導性表面を与えることが
必要である。通常の方法は、エッチングされたプラスチ
ック支持体に感光性を与え活性化して、その表面上にパ
ラジウムなどの貴金属の薄い層を作った後に、その活性
化支持体を、硫酸銅およびホルムアルデヒドを含む銅メ
ッキ槽中に入れて、プラスチック支持体を金属化する
(すなわちその表面を銅のフィルムで被覆する)。この
パラジウムは、硫酸銅およびホルムアルデヒドの酸化還
元反応を促進する触媒として働く。BACKGROUND OF THE INVENTION The manufacture of printed circuit boards requires the provision of a conductive surface on a non-conductive support, such as a plastic support. The usual method is to sensitize and activate the etched plastic support to create a thin layer of noble metal such as palladium on its surface, and then to activate the support to copper sulfate and formaldehyde containing copper. It is placed in a plating bath to metallize the plastic support (ie coat its surface with a film of copper). This palladium acts as a catalyst for promoting the redox reaction of copper sulfate and formaldehyde.
【0003】上記の通常の方法では複雑であり、その操
作において多くの化学試薬を必要とする。貴金属化合物
の費用も非常に高い。さらに、還元剤として用いられる
ホルムアルデヒドは発癌性物質であるために、それを無
電解メッキで使用することは米国を含めた多くの国で禁
止されている。さらに、感光化および活性化の操作中に
形成される強酸性排水と銅無電解メッキ操作中に形成さ
れる強塩基性排水を含むホルムアルデヒドは、深刻な汚
染問題を起こすことがありうる。The conventional methods described above are complicated and require many chemical reagents in their operation. The cost of precious metal compounds is also very high. Further, since formaldehyde used as a reducing agent is a carcinogen, its use in electroless plating is prohibited in many countries including the United States. In addition, formaldehyde, including strongly acidic wastewater formed during photosensitization and activation operations and strong basic wastewater formed during copper electroless plating operations, can cause serious pollution problems.
【0004】複合電導性ポリマーは、それらを帯電防止
被覆、電導性塗料,電磁遮蔽、電極被覆等に利用するこ
とに興味が高まりつつあるために広く研究されてきた。
それらポリマーも、印刷回路支持体のメッキされたスル
ーホール中に利用され、非電導支持体の金属化にも利用
されてきた。例えば、PCT特許出願NO.PCT/EP89/0020
4(1989年9月8日)は、非電導性支持体上に電導
性ポリマーを被覆する方法を開示している。この方法は
以下の3工程からなる:(1)酸化工程:80℃〜90
℃の操作温度にて過マンガン酸塩を含む溶液に支持体を
浸し、メッキされたスルーホールの壁上に二酸化マンガ
ン層を形成する;(2)活性化工程:電導性ポリマーの
モノマーを含むアルコール溶液中にこの酸化支持体を浸
し、二酸化マンガン層上にモノマー層を被覆し;そして
(3)固定化工程:この活性化された支持体を酸性溶液
中に浸すことによりモノマーを重合し、該支持体を金属
化する。次にこの電導性ポリマー被覆の支持体を銅でメ
ッキする。この方法の操作もかなり複雑である。Composite conductive polymers have been extensively studied because of their growing interest in their use in antistatic coatings, conductive coatings, electromagnetic shielding, electrode coatings and the like.
These polymers have also been utilized in the plated through-holes of printed circuit supports and also for metallization of non-conductive supports. For example, PCT patent application NO.PCT / EP89 / 0020
4 (September 8, 1989) discloses a method of coating a conductive polymer on a non-conductive support. This method consists of the following three steps: (1) Oxidation step: 80 ° C-90
The support is immersed in a solution containing permanganate at an operating temperature of ° C to form a manganese dioxide layer on the walls of the plated through holes; (2) activation step: alcohol containing a monomer of a conductive polymer. Immersing the oxidized support in solution, coating the monomer layer on the manganese dioxide layer; and (3) immobilization step: polymerizing the monomer by soaking the activated support in an acidic solution, Metallize the support. The conductive polymer coated support is then plated with copper. The operation of this method is also quite complicated.
【0005】ポリピロールは、濃厚溶液の形では比較的
空気に対して安定であり、最も重要な複合電導性ポリマ
ーの一つである。それが持つ堅い共役結合のために、ポ
リピロールは溶媒中に溶解することができないし、溶融
もできない。従って、ポリピロールを利用するときは、
その加工性を高めるためにコロイドポリピロールの分散
液を調製することが必要である。Polypyrrole is relatively stable to air in the form of a concentrated solution and is one of the most important composite conducting polymers. Due to its rigid conjugated bond, polypyrrole cannot be dissolved or melted in a solvent. Therefore, when using polypyrrole,
It is necessary to prepare a dispersion of colloidal polypyrrole to enhance its processability.
【0006】適当な立体安定剤はコロイド分散液の調製
のために一般に添加され、そこに含まれるコロイドを安
定化し、それが凝析してコロイド沈澱が起こることを防
止している。ポリピロールのコロイド分散液の調製にお
いて、2種類の立体安定剤が現在用いられていることが
知られている。最初の種類は水溶性立体安定剤であり、
例えばポリ(ビニルアルコール−コ−ビニルアセテー
ト)(J.Colloid Int. Sci.,1987, 118,410)、ポリ
(ビニルピロリドン)(J. Chem. Soc., Chem. Com
mun., 1987,228)、ポリ(エチレンオキシド)(J.
Chem. Soc., Chem.Commun., 1988, 1189)、メチル
セルロース(J. Chem. Soc., Chem.Commun., 198
6, 1293)、ポリ(ビニルピリジン)およびそのコポリ
マー[米国特許4,959,162(1990)]等がある。他の種類
のものは有機溶媒に可溶の立体安定剤である。これまで
そのような立体安定剤は僅かに1種類開示されているだ
けで、それはポリ(ビニルアセテート)(PVAc)
[米国特許NO.5,021,193(1991)]である。用いられる分
散媒質は、蟻酸メチルや酢酸メチルなどのエステルであ
るSuitable steric stabilizers are commonly added for the preparation of colloidal dispersions to stabilize the colloids contained therein and prevent them from coagulating and causing colloidal precipitation. It is known that two types of steric stabilizers are currently used in the preparation of polypyrrole colloidal dispersions. The first type is water-soluble steric stabilizers,
For example, poly (vinyl alcohol-co-vinyl acetate) (J. Colloid Int. Sci., 1987, 118, 410), poly (vinyl pyrrolidone) (J. Chem. Soc., Chem. Com.
mun., 1987, 228), poly (ethylene oxide) (J.
Chem. Soc., Chem.Commun., 1988, 1189), methylcellulose (J. Chem. Soc., Chem. Communi., 198)
6, 1293), poly (vinyl pyridine) and copolymers thereof [US Pat. No. 4,959,162 (1990)] and the like. Another class is steric stabilizers that are soluble in organic solvents. To date only one such steric stabilizer has been disclosed, which is poly (vinyl acetate) (PVAc).
[US Patent No. 5,021,193 (1991)]. The dispersion medium used is an ester such as methyl formate or methyl acetate
【0007】。[0007]
【発明が解決しようとする課題】コロイドポリピロール
の水性分散液は、支持体上に被覆した時に容易に乾燥し
ない欠点を有している。空気に長時間さらした後、それ
は湿気を吸収して膨潤し、支持体に対するその結合力を
減少させている。さらに、コロイドポリピロールの水性
分散液は、水性環境下での使用にも適さず、例えば、水
性分散液で支持体を被覆し、次に乾燥して得られた電導
ポリピロール層を有する支持体は、次に銅で電気メッキ
すると、その電導ポリピロール層が剥離し、銅メッキの
破損を起こすか、コロイド粒子が脱落し、水による腐食
のために、メッキされた銅フィルムの均一性と連続性が
結果として破壊されることになる。さらに、極端に速い
還元速度により引き起こされる電導性ポリマー電導率の
急速な低下により、支持体上に銅をメッキすることがで
きないこともある。さらに、コロイドの電導率は時間と
ともに減少するであろう。Aqueous dispersions of colloidal polypyrrole have the disadvantage that they do not dry easily when coated on a support. After prolonged exposure to air, it absorbs moisture and swells, reducing its binding strength to the support. Furthermore, an aqueous dispersion of colloidal polypyrrole is also not suitable for use in an aqueous environment, for example, a support having a conductive polypyrrole layer obtained by coating the support with an aqueous dispersion and then drying, Subsequent electroplating with copper results in the conductive polypyrrole layer peeling off, causing damage to the copper plating or colloidal particles falling off, resulting in uniformity and continuity of the plated copper film due to water corrosion. Will be destroyed as. In addition, it may not be possible to plate copper on the support due to the rapid drop in conductivity of the conducting polymer caused by the extremely fast reduction rate. Furthermore, the conductivity of colloids will decrease over time.
【0008】水溶性ポリマーを立体安定剤としてポリピ
ロールの分散のために使用することのもう一つの欠点
は、分散液(立体安定剤のポリ(ビニルアルコール)を
用いたもの以外)は、支持体、例えば印刷回路板のプラ
スチック支持体の上に被覆されたときには、フィルムに
流延できない。ポリ(ビニルアルコール)を安定剤とし
て用いるコロイド分散液はフィルムに流延することはで
きるが、その機械的強度は望ましいものではないため
に、これも実用的な利用性を欠いている。Another drawback of using water-soluble polymers as steric stabilizers for the dispersion of polypyrrole is that the dispersions (other than those using the steric stabilizer poly (vinyl alcohol)) are supports, For example, when coated on a plastic support of a printed circuit board, it cannot be cast into a film. Colloidal dispersions using poly (vinyl alcohol) as a stabilizer can be cast into films, but they also lack practical utility because their mechanical strength is undesired.
【0009】有機溶媒を立体安定剤として用いるポリピ
ロールコロイド分散液もフィルムに流延できず、しかも
そのコロイドの電導率は低すぎてその後の銅の電気メッ
キが達成できない。さらに、前記米国特許NO.5,021,193
に記載のようなエステルを分散媒質として用いると、こ
のエステルは揮発性であるために空気汚染が引き起こさ
れるであろう。A polypyrrole colloidal dispersion using an organic solvent as a steric stabilizer cannot be cast on a film, and the electric conductivity of the colloid is too low to achieve the subsequent electroplating of copper. Further, the above-mentioned US Patent No. 5,021,193
The use of an ester as described in 1 above as the dispersion medium will cause air pollution due to the volatility of the ester.
【0010】従って、本発明の目的は、加工可能な電導
性コロイドポリマー分散液の製造のための向上した方法
を提供することにある。向上した方法は、操作が単純で
あり、環境汚染を起こさず、支持体の被覆の際に優れた
フィルム形成性を有する分散性と高い電導率を有するコ
ロイドポリマーを作ることを可能とする。Accordingly, it is an object of the present invention to provide an improved process for preparing processable conductive colloidal polymer dispersions. The improved method is simple to operate, does not cause environmental pollution, and makes it possible to produce colloidal polymers with good film-forming dispersibility and high conductivity when coating the support.
【0011】[0011]
【課題を解決するための手段及び作用】上記目的を達成
するために、加工可能な電導性コロイドポリマー分散液
の製造方法は、(a)立体安定剤としてポリマー乳濁液
を作り;(b)ポリマー乳濁液を水性媒質で希釈し;
(c)ピロール、N−置換ピロール、ベータ−置換ピロ
ール、チオフエン、アニリン、フランおよびその混合物
からなる群から選ばれる芳香族複素環式モノマーを、芳
香族複素環式モノマーのためのオキシダントおよび希釈
ポリマー乳濁液を含む水性媒質中で酸化的に重合し;
(d)水性反応媒質から加工可能な電導性コロイドポリ
マーを分離し;そして(e)得られた加工可能な電導性
コロイドポリマーを、乳濁液中で該ポリマーと混和性の
ある溶媒中に分散させる工程からなる。In order to achieve the above object, a process for producing a processable conductive colloidal polymer dispersion is (a) preparing a polymer emulsion as a steric stabilizer; (b) Diluting the polymer emulsion with an aqueous medium;
(C) an aromatic heterocyclic monomer selected from the group consisting of pyrrole, N-substituted pyrrole, beta-substituted pyrrole, thiophene, aniline, furan and mixtures thereof, with an oxidant and a diluting polymer for the aromatic heterocyclic monomer. Polymerizes oxidatively in an aqueous medium containing an emulsion;
(D) separating the processable conductive colloidal polymer from the aqueous reaction medium; and (e) dispersing the resulting processable conductive colloidal polymer in an emulsion in a solvent miscible with the polymer. The process consists of
【0012】本発明の方法に従い、芳香族複素環式モノ
マーの重合は水性反応媒質中で行なう。これが本発明の
方法の主要な特徴である。適当な芳香族複素環式モノマ
ーとしては、ピロールおよび他のピロール類、例えばN
−置換ピロールおよびベータ−置換ピロール、チオフェ
ン、アニリン、およびフランがある。置換基は、アルキ
ル、アリール、アラルキル、アルカリール、ヒドロキ
シ、アルコキシ、クロロ、ブロモおよびニトロ基であっ
てよい。これらの中で、ピロールは芳香族複素環式モノ
マーとして特に好適である。According to the method of the present invention, the polymerization of aromatic heterocyclic monomers is carried out in an aqueous reaction medium. This is the main feature of the method of the present invention. Suitable aromatic heterocyclic monomers include pyrrole and other pyrroles such as N
There are -substituted pyrroles and beta-substituted pyrroles, thiophenes, anilines, and furans. The substituents may be alkyl, aryl, aralkyl, alkaryl, hydroxy, alkoxy, chloro, bromo and nitro groups. Of these, pyrrole is particularly suitable as the aromatic heterocyclic monomer.
【0013】水性反応媒質は、オキシダントと希釈した
ポリマー乳濁液を含む。希釈した乳濁液は、ポリマー乳
濁液を水性媒質で希釈して作る。前記重合プロセスに用
いられるオキシダントは、芳香族複素環式モノマーを酸
化的に重合できなければならない。オキシダントの例と
しては、過硫酸、ハロゲン、硝酸、ニクロン酸、過マン
ガン酸、マンガン酸、過ヨウ素酸素の鉄、銅、およびセ
シウム(IV)との塩がある。好適なオキシダントは塩
化第二鉄である。The aqueous reaction medium comprises a polymer emulsion diluted with oxidant. Diluted emulsions are made by diluting a polymer emulsion with an aqueous medium. The oxidant used in the polymerization process must be capable of oxidatively polymerizing aromatic heterocyclic monomers. Examples of oxidants are persulfuric acid, halogens, nitric acid, nicronic acid, permanganic acid, manganic acid, salts of periodic oxygen with iron, copper, and cesium (IV). The preferred oxidant is ferric chloride.
【0014】水性反応媒質中におけるオキシダントの芳
香族複素環式モノマーに対するモル比は、2:1から
5:1まである。好適には、オキシダントのモノマーに
対するモル比は2.33:1である。反応温度は0℃か
ら100℃までであり、より好適には室温程度である。The molar ratio of oxidant to aromatic heterocyclic monomer in the aqueous reaction medium is from 2: 1 to 5: 1. Suitably, the molar ratio of oxidant to monomer is 2.33: 1. The reaction temperature is from 0 ° C to 100 ° C, and more preferably about room temperature.
【0015】本方法で立体安定剤としての使用に適する
ポリマー乳濁液は、ポリ(ビニルアセテート)(PVA
c)およびポリ(アクリレート)の乳濁液である。PV
Acの乳濁液は本方法のために好適である。ポリアクリ
レートとしては、ポリ(メチルメタクリレート―コ(c
o:以下同様)―ブチルアクリレート)、ポリ(メチル
メタクリレート―コ―ブチルアクリレート―コ―アクリ
ル酸)およびポリ(メチルメタクリレート―コ―ブチル
アクリレート―コ―ビニルアセテート)がある。Polymer emulsions suitable for use as steric stabilizers in the present method include poly (vinyl acetate) (PVA
c) and poly (acrylate) emulsions. PV
An emulsion of Ac is suitable for this method. Examples of the polyacrylate include poly (methyl methacrylate-co (c
o: same as below) -butyl acrylate), poly (methyl methacrylate-co-butyl acrylate-co-acrylic acid) and poly (methyl methacrylate-co-butyl acrylate-co-vinyl acetate).
【0016】ポリマー乳濁液の主要な役割は、作られた
コロイド粒子を溶媒中に再分散するときに凝析による沈
殿を防止するために、モノマーの重合をその場(in sit
u)で実施できるように、乳濁液に含まれるポリマー粒
子の内部または表面に芳香族複素環式モノマーとオキシ
ダントを吸収させることにある。The main role of the polymer emulsion is to carry out in situ polymerization of the monomers in order to prevent precipitation by coagulation when the colloidal particles produced are redispersed in a solvent.
As it can be carried out in step u), the aromatic heterocyclic monomer and the oxidant are absorbed inside or on the surface of the polymer particles contained in the emulsion.
【0017】ポリマー乳濁液の希釈のための水性媒質
は、脱イオン水か酸性水溶液でよい。通常、ポリマー乳
濁液はその体積の20〜100倍まで希釈しなければな
らない。例えばPVAcのポリマー乳濁液で言うと、通
常1〜5mlのPVAc乳濁液(固形分、50%)を本
発明で使用するために100mlまで脱イオン水で希釈
する。The aqueous medium for the dilution of the polymer emulsion can be deionized water or an acidic aqueous solution. Generally, the polymer emulsion should be diluted to 20-100 times its volume. For example, referring to a polymer emulsion of PVAc, typically 1-5 ml of PVAc emulsion (solid content, 50%) is diluted to 100 ml with deionized water for use in the present invention.
【0018】酸化重合の完了後、得られた電導性ポリマ
ー粒子を分離することができる。本発明に従って、コロ
イド粒子は濾過により水性反応媒質から分離することが
でき、次に水で洗浄して過剰なオキシダントおよび立体
安定剤を除去する。この分離されたコロイド粒子はPV
Acと混和性のある溶媒中に再分散して、分散液を得る
ことができる。適当な例として、メタノール、ベンゼ
ン、トルエン、クロロホルム、DMF、アセトン、ブタ
ノン、エステル等がある。After completion of the oxidative polymerization, the resulting conductive polymer particles can be separated. According to the present invention, the colloidal particles can be separated from the aqueous reaction medium by filtration and then washed with water to remove excess oxidant and steric stabilizer. The separated colloidal particles are PV
The dispersion can be obtained by redispersing it in a solvent miscible with Ac. Suitable examples include methanol, benzene, toluene, chloroform, DMF, acetone, butanone, esters and the like.
【0019】注意すべきことは、モノマーおよびオキシ
ダントを前記希釈ポリマー分散液に加える順番は、得ら
れるコロイドポリマー再分散液の安定性に影響を与える
ことができるということである。本発明の方法に従え
ば、乳濁液中でモノマーをポリマー粒子に吸収させるた
めに、最初にモノマーを希釈ポリマー乳濁液中に加え、
次にオキシダントを加えて、立体安定剤に吸収されない
コロイド粒子の形成を防止することが望ましい。It should be noted that the order in which the monomer and oxidant are added to the diluted polymer dispersion can affect the stability of the resulting colloidal polymer redispersion. According to the method of the present invention, the monomer is first added to the diluted polymer emulsion in order to absorb the monomer into the polymer particles in the emulsion,
It is then desirable to add an oxidant to prevent the formation of colloidal particles that are not absorbed by the steric stabilizer.
【0020】本発明の方法により調製される電導性コロ
イドポリマーの分散液は、非電導支持体上か印刷回路板
のスルーホール壁上に直接被覆して、それらに電導性を
与え、メッキ適性のあるものとする。コロイド分散液
は、帯電防止被膜、電磁遮蔽等にも用いることができ
る。The dispersion of conductive colloidal polymer prepared by the method of the present invention is coated directly on a non-conductive support or on the through-hole wall of a printed circuit board to render them conductive and to render them suitable for plating. There is. The colloidal dispersion can also be used for antistatic coatings, electromagnetic shielding and the like.
【0021】[0021]
【実施例】以下の具体的な実施例は、本発明の範囲を限
定せずに本発明を完全に示すためのものであるが、これ
は、多くの改良や多様性が当業者には明らかになるであ
ろうからである。以下の実施例のすべての電導率は、4
点プローブ法を用いて測定した。The following specific examples are intended to illustrate the invention in full, without limiting the scope of the invention, as many modifications and variations will be apparent to those skilled in the art. Because it will be. The conductivity of all of the following examples is 4
It was measured using the point probe method.
【0022】(実施例1)50%の固形分を有する1m
lのポリ(ビニルアセテート)(これ以後「PVAc」
と称する)の乳濁液を脱イオン水で希釈して、全体積を
100mlとした。5.47gの塩化第二鉄を攪拌しな
がら先の希釈乳濁液に加えた。塩化第二鉄が完全に溶解
した後に1mlのピロールを加え、室温で24時間反応
させた。コロイドポリピロールの前乳濁液を得た。この
前乳濁液を濾過し、濾液が無色となるまで脱イオン水で
洗浄した。得られたコロイド(元素分析の利用による測
定で19%のPVAcをそこに含んでいることが分かっ
た)をメタノールに再分散し固形分が約2%〜3%の範
囲の分散液を得た。この分散液を乾燥して、得られたコ
ロイドを粉砕し微粉とした。この粉末から得られた圧縮
ペレットの電導率は、2.8×10-2S/cmと測定さ
れた。(Example 1) 1 m having a solid content of 50%
l poly (vinyl acetate) (hereinafter “PVAc”)
(Referred to as)) was diluted with deionized water to a total volume of 100 ml. 5.47 g ferric chloride was added to the above diluted emulsion with stirring. After ferric chloride was completely dissolved, 1 ml of pyrrole was added, and the mixture was reacted at room temperature for 24 hours. A pre-emulsion of colloidal polypyrrole was obtained. The pre-emulsion was filtered and washed with deionized water until the filtrate became colorless. The resulting colloid (which was found to contain 19% PVAc therein as determined by the use of elemental analysis) was redispersed in methanol to give a dispersion with a solids content in the range of about 2% to 3%. . This dispersion was dried, and the obtained colloid was crushed to obtain fine powder. The conductivity of compressed pellets obtained from this powder was measured to be 2.8 x 10 -2 S / cm.
【0023】(実施例2)2mlのPVAc乳濁液を用
いた以外は、実施例1に記載の同じ方法を用いた。粉末
からの圧縮ペレットの電導率は、5.5×10-3S/c
mと測定された。 (実施例3)3mlのPVAc乳濁液を用いた以外は、
実施例1に記載の同じ方法を用いた。粉末からの圧縮ペ
レットの電導率は、1.4×10-3S/cmと測定され
た。Example 2 The same method as described in Example 1 was used, except that 2 ml of PVAc emulsion was used. The conductivity of compressed pellets from powder is 5.5 × 10 -3 S / c
m. (Example 3) except that 3 ml of PVAc emulsion was used.
The same method described in Example 1 was used. The conductivity of the compressed pellets from the powder was measured as 1.4 × 10 −3 S / cm.
【0024】(実施例4)5mlのPVAc乳濁液を用
いた以外は、実施例1に記載の同じ方法を用いた。分散
液は流延してフィルムとしたが、小域のフィルムのみが
得られた。得られたフィルムの電導率は、9.1×10
-3S/cmと測定された。Example 4 The same method as described in Example 1 was used, except that 5 ml of PVAc emulsion was used. The dispersion was cast into a film, but only a small area film was obtained. The conductivity of the obtained film is 9.1 × 10.
-3 S / cm was measured.
【0025】(実施例5)1mlのPVAc乳濁液を1
モルのトルエンスルホン酸で希釈して全体積を100m
lとした以外は、実施例1に記載の同じ方法を用いた。
粉末からの圧縮ペレットの電導率は、2.5×10-3S
/cmと測定された。Example 5 1 ml of PVAc emulsion was added to 1
100m total volume by diluting with toluene sulfonic acid
The same method as described in Example 1 was used except that it was 1.
The conductivity of compressed pellets from powder is 2.5 × 10 -3 S
/ Cm was measured.
【0026】(実施例6)1mlのPVAc乳濁液を
0.1モルの塩酸で希釈して全体積を100mlとした
以外は、実施例1に記載の同じ方法を用いた。粉末から
の圧縮ペレットの電導率は、3.0×10-6S/cmと
測定された。Example 6 The same method as described in Example 1 was used, except that 1 ml of PVAc emulsion was diluted with 0.1 mol hydrochloric acid to bring the total volume to 100 ml. The conductivity of the compressed pellets from the powder was measured as 3.0 × 10 −6 S / cm.
【0027】(実施例7)7.52gの過硫酸アンモニ
ウムをオキシダントとして添加した以外は、実施例1に
記載の同じ方法を用いた。粉末の圧縮ペレットの電導率
は、4.3×10-5 S/cmと測定された。Example 7 The same procedure as described in Example 1 was used except 7.52 g of ammonium persulfate was added as an oxidant. The conductivity of compressed powder pellets was measured to be 4.3 × 10 −5 S / cm.
【0028】(実施例8)2mlのPVAcを脱イオン
水で希釈して、全体体積を50mlとした。その希釈乳
濁液を攪拌しながら1mlのピロールを添加した。30
〜60分間膨潤させて、5.47gの塩化第二鉄を含む
50mlの水性溶液を添加して、室温で24時間反応さ
せた。コロイドポリピロールの前分散液が得られた。こ
の前分散液を濾過して、濾液が無色となるまで脱イオン
水で洗浄した。得られたコロイドをメタノールに再分散
させた。コロイドの分散液が得られた。この分散液を乾
燥して、次に粉砕して微粉とした。この粉末の圧縮ペレ
ットの電導率は2.4×10-2S/cmと測定された。Example 8 2 ml of PVAc was diluted with deionized water to a total volume of 50 ml. While stirring the diluted emulsion, 1 ml of pyrrole was added. 30
After swelling for -60 minutes, 50 ml of an aqueous solution containing 5.47 g of ferric chloride was added and allowed to react for 24 hours at room temperature. A pre-dispersion of colloidal polypyrrole was obtained. The predispersion was filtered and washed with deionized water until the filtrate was colorless. The obtained colloid was redispersed in methanol. A colloidal dispersion was obtained. The dispersion was dried and then ground to a fine powder. The conductivity of the compressed pellets of this powder was measured to be 2.4 × 10 -2 S / cm.
【0029】(実施例9)4mlのPVAc乳濁液を用
いた以外は、実施例8に記載の同じ方法を用いた。分散
液を流延してフィルムとし、広域のフィルムが得られ
た。得られたフィルムの電導率は、9.5×10-4S/
cmと測定された。Example 9 The same method as described in Example 8 was used, except that 4 ml of PVAc emulsion was used. The dispersion liquid was cast into a film, and a wide-area film was obtained. The conductivity of the obtained film is 9.5 × 10 −4 S /
It was measured in cm.
【0030】(実施例10)2mlのポリ(メチルメタ
クリレート―コ―ブチルアクリレート)(モノマーのモ
ル比=1:1、固形分=14%)の乳濁液を脱イオン水
で希釈して、全体積を150mlとした。次に、5.4
7gの塩化第二鉄を攪拌しながら添加した。1mlのピ
ロールを塩化第二鉄が完全に溶けた後に添加し、室温で
12時間反応させた。コロイドポリピロールの前分散液
が得られた。この前分散液を濾過して、濾液が無色とな
るまで脱イオン水で洗浄した。得られたコロイドをブタ
ノールに再分散させた。そのコロイドの分散液が得られ
た。この分散液を乾燥し、粉砕して微粉とした。この粉
末からの圧縮ペレットの電導率は、0.5S/cmと測
定された。Example 10 An emulsion of 2 ml of poly (methyl methacrylate-co-butyl acrylate) (monomer molar ratio = 1: 1, solid content = 14%) was diluted with deionized water, and the whole was diluted. The product was 150 ml. Then 5.4
7 g ferric chloride was added with stirring. 1 ml of pyrrole was added after ferric chloride was completely dissolved, and the mixture was reacted at room temperature for 12 hours. A pre-dispersion of colloidal polypyrrole was obtained. The predispersion was filtered and washed with deionized water until the filtrate was colorless. The obtained colloid was redispersed in butanol. A dispersion of the colloid was obtained. This dispersion was dried and pulverized into a fine powder. The conductivity of compressed pellets from this powder was measured to be 0.5 S / cm.
【0031】(実施例11)実施例10に記載の同じ組
成を有する15mlのポリ(メチルメタクリレート―コ
―ブチルアクリレート)の乳濁液を脱イオン水で希釈し
て全体積を90mlとした。次に5.47gの塩化第二
鉄を含む10mlの溶液を攪拌しながら添加した。次
に、1mlのピロールを添加して、室温で13時間反応
させた。コロイドポリピロールの前分散液が得られた。
この前分散液を濾過して、濾液が無色となるまで脱イオ
ン水で洗浄した。得られたコロイドをブタノールに再分
散して、コロイドの分散液を得た。この分散液を流延し
てフィルムとして、広域のフィルムが得られた。得られ
たフィルムの電導率は、0.1S/cmと測定された。Example 11 15 ml of an emulsion of poly (methylmethacrylate-co-butylacrylate) having the same composition described in Example 10 was diluted with deionized water to a total volume of 90 ml. Then 10 ml of a solution containing 5.47 g of ferric chloride was added with stirring. Next, 1 ml of pyrrole was added and reacted at room temperature for 13 hours. A pre-dispersion of colloidal polypyrrole was obtained.
The predispersion was filtered and washed with deionized water until the filtrate was colorless. The obtained colloid was redispersed in butanol to obtain a colloidal dispersion. A film having a wide area was obtained by casting this dispersion liquid as a film. The conductivity of the resulting film was measured to be 0.1 S / cm.
【0032】(実施例12)10mlのポリ(メチルメ
タクリレート―コ―ブチルアクリレート―コ―アクリル
酸)のコポリマー(MMA:BA:AAのモノマーのモ
ル比=2:3:1、固形分=15%)を用いた以外は実
施例11に記載の同じ方法を用いた。この分散液を流延
して、フィルムとして、広域フィルムが得られた。得ら
れたフィルムの電導率は、0.2S/cmと測定され
た。Example 12 10 ml poly (methyl methacrylate-co-butyl acrylate-co-acrylic acid) copolymer (MMA: BA: AA monomer molar ratio = 2: 3: 1, solid content = 15%) The same method described in Example 11 was used, except that This dispersion was cast to obtain a wide area film as a film. The conductivity of the resulting film was measured to be 0.2 S / cm.
【0033】(実施例13)6mlのポリ(メチルメタ
クリレート―コ―ブチルアクリレート―コ―ビニルアセ
テート)のコポリマー(MMA:BA:VAcのモノマ
ーのモル比=1:1:1、固形分=15%)を用い、反
応時間が15時間であった以外は実施例10に記載の同
じ方法を用いた。この分散液を乾燥して、粉砕して微粉
とした。粉末の圧縮ペレットの電導率は、0.09S/
cmと測定された。Example 13 6 ml of poly (methyl methacrylate-co-butyl acrylate-co-vinyl acetate) copolymer (MMA: BA: VAc monomer molar ratio = 1: 1: 1, solid content = 15%) ) Was used and the same method described in Example 10 was used except that the reaction time was 15 hours. This dispersion was dried and pulverized into a fine powder. The conductivity of compressed powder pellets is 0.09 S /
It was measured in cm.
【0034】(比較例1)米国特許5,021,193(1991)に
開示のピロール―PVAcコロイドの調製方法を本比較
例で繰り返した。1gのPVAcを蟻酸メチルに溶解し
て溶液とする。5.47gの塩化第二鉄を攪拌しながら
その溶液に加えた。塩化第二鉄が完全に溶解した後に、
1mlのピロールを添加して室温で16〜18時間反応
させた。分離して再分散の後に、得られた分散液はフィ
ルムに流延できないことが分かった。その分散液を乾燥
し、粉砕して微粉とした。その粉末の圧縮ペレットの電
導率は、2.5×10-6S/cmと測定された。Comparative Example 1 The method for preparing the pyrrole-PVAc colloid disclosed in US Pat. No. 5,021,193 (1991) was repeated in this comparative example. A solution is prepared by dissolving 1 g of PVAc in methyl formate. 5.47 g ferric chloride was added to the solution with stirring. After ferric chloride is completely dissolved,
1 ml of pyrrole was added and reacted at room temperature for 16-18 hours. After separation and redispersion, it was found that the resulting dispersion could not be cast into a film. The dispersion was dried and ground into a fine powder. The conductivity of the compressed pellets of the powder was measured to be 2.5 × 10 −6 S / cm.
【0035】1gのPVAcを酢酸メチルに溶解した以
外は同じ方法で二回目の実施を行った。得られた圧縮ペ
レットの電導率は1.1×10-6S/cmと測定され
た。比較例1で調製されたポリピロールコロイドの電導
率は実施例2、3および4で調製されたものよりも明ら
かに低いことが分かる。A second run was carried out in the same manner except that 1 g of PVAc was dissolved in methyl acetate. The conductivity of the obtained compressed pellets was measured to be 1.1 × 10 −6 S / cm. It can be seen that the conductivity of the polypyrrole colloid prepared in Comparative Example 1 is clearly lower than that prepared in Examples 2, 3 and 4.
【0036】(比較例2)立体安定剤のPVAc乳濁液
を添加しない以外は、実施例1に記載の同じ方法を用い
た。得られた圧縮ペレットの電導率は、0.4S/cm
と測定された。実施例1で調製したポリピロールコロイ
ドは、絶縁PVAcをそこに含んでいるが、それらの電
導率は実施例2で調製されたものよりも明らかに低くは
ないことが分かる。Comparative Example 2 The same method as described in Example 1 was used except that the PVAc emulsion of the steric stabilizer was not added. The conductivity of the obtained compressed pellets is 0.4 S / cm
Was measured. It can be seen that the polypyrrole colloids prepared in Example 1 contained insulating PVAc therein, but their conductivity was not significantly lower than that prepared in Example 2.
【0037】(応用例1)実施例1で調製された分散液
を印刷回路板用の支持体(ファイバーグラス/エポキ
シ)上に被覆し、乾燥させた。コロイドポリピロールか
ら複合フィルムを形成させた。この被覆支持体を銅電気
メッキ槽中に陰極として入れた; 槽中で銅板は陽極と
して用いた。電気メッキ溶液は220g/リットルの硫
酸銅、60g/リットルの硫酸および0.1g/リット
ルの塩酸を含んでいた。用いられた電流密度は、1〜5
A/dm2 の範囲であった。電気メッキが完了した後、
均一な銅の層をコロイドポリピロールの複合フィルム上
に蒸着させた。さらに、その銅メッキの支持体は、酸化
による金属光沢の損失を防止するために抗オキシダント
を含む溶液に浸すことができた。図1および図2は、銅
メッキの前後のそれぞれのコロイドフィルムのSEM写
真である。Application Example 1 The dispersion prepared in Example 1 was coated on a support (fiberglass / epoxy) for a printed circuit board and dried. A composite film was formed from colloidal polypyrrole. The coated support was placed in a copper electroplating bath as the cathode; the copper plate served as the anode in the bath. The electroplating solution contained 220 g / liter copper sulfate, 60 g / liter sulfuric acid and 0.1 g / liter hydrochloric acid. The current density used was 1-5
It was in the range of A / dm 2 . After electroplating is completed,
A uniform copper layer was deposited on the colloidal polypyrrole composite film. In addition, the copper-plated substrate could be dipped into a solution containing an antioxidant to prevent loss of metallic luster due to oxidation. 1 and 2 are SEM photographs of each colloidal film before and after copper plating.
【0038】(応用例2)実施例10、11、12およ
び13で調製した分散液を印刷回路板の支持体上に被覆
した以外は、応用例1に記載の同じ方法を用いた。コロ
イドフィルムと蒸着銅層のSEMの写真は図1および図
2に似ている。 (応用例3)実施例12で調製した分散液を印刷回路板
のスルーホール上に被覆し、乾燥させた。コロイドポリ
ピロールの複合フィルムをそのホール壁上に形成した。
次に、その板を陰極として電気メッキ槽中に置いた;
その槽中で銅板は陽極として用いた。電気メッキ溶液は
220g/リットルの硫酸銅、60g/リットルの硫酸
および0.1g/リットルの塩酸を含んでいた。用いら
れた電流密度は、1〜5A/dm2の範囲にあった。電
気メッキが完了した後、銅層の2つの面を接続させてい
るホールの壁上に均一な銅の層を蒸着した。さらに、酸
化による銅層の金属光沢の損失を防ぐために抗オキシダ
ントを含む溶液にその板を浸すことができた。Application Example 2 The same method as in Application Example 1 was used, except that the dispersion prepared in Examples 10, 11, 12 and 13 was coated on the support of the printed circuit board. SEM photographs of the colloidal film and the deposited copper layer resemble FIGS. 1 and 2. (Application 3) The dispersion prepared in Example 12 was coated on the through holes of the printed circuit board and dried. A composite film of colloidal polypyrrole was formed on the hole wall.
The plate was then placed in the electroplating bath as the cathode;
The copper plate was used as the anode in the bath. The electroplating solution contained 220 g / liter copper sulfate, 60 g / liter sulfuric acid and 0.1 g / liter hydrochloric acid. The current density used was in the range of 1-5 A / dm 2 . After electroplating was completed, a uniform layer of copper was deposited on the walls of the holes connecting the two sides of the copper layer. Furthermore, the board could be dipped in a solution containing an antioxidant to prevent loss of metallic luster of the copper layer due to oxidation.
【0039】(応用例4)実施例9から調製された分散
液をポリ(エチレンテレフタレート)(PET)支持体
上に被覆し、乾燥させた。被覆フィルムの支持体への結
合は非常に良いことが分かった。被覆された支持体を布
でこすって、すぐに紙の切れはしの上に該支持体を置い
て静電荷の発生を調べた。紙の切れはしがその被覆支持
体に向かって引き付けられることは観察されず、静電荷
が発生しなかったことを示した。しかし、被覆しない支
持体は布でこすった後に紙の切れはしを引き付けること
が分かった。上記の二つの支持体を比較すると、コロイ
ド分散液で被覆した支持体は優れた帯電防止性を有する
ことが分かった。従って、コロイドポリピロールの分散
液は、電気部品の包装材料として、またプラスチックス
およびファイバーの帯電防止皮膜として用いることがで
きる。Application Example 4 The dispersion prepared from Example 9 was coated on a poly (ethylene terephthalate) (PET) support and dried. It has been found that the bond of the coating film to the support is very good. The coated support was rubbed with a cloth and immediately placed on a piece of paper to examine the generation of electrostatic charge. No piece of paper was observed to be attracted towards the coated support, indicating that no electrostatic charge had developed. However, it has been found that the uncoated substrate attracts a piece of paper after rubbing with a cloth. Comparing the above two supports, it was found that the support coated with the colloidal dispersion had excellent antistatic properties. Therefore, the colloidal polypyrrole dispersion can be used as a packaging material for electrical parts and as an antistatic coating for plastics and fibers.
【0040】[0040]
【発明の効果】以上のように本発明によれば、単純な操
作で、環境汚染を起こさず、支持体の被覆性に優れたフ
ィルム形成性を有する分散性と高い電導率を有するコロ
イドポリマーを作ることができる。INDUSTRIAL APPLICABILITY As described above, according to the present invention, a colloidal polymer having a dispersibility and a high electric conductivity, which does not cause environmental pollution and has excellent film-forming property on a support, can be obtained by simple operation. Can be made.
【図1】応用例1のコロイドフィルムの粒子構造の走査
電子顕微鏡(SEM)写真である。FIG. 1 is a scanning electron microscope (SEM) photograph of the particle structure of a colloidal film of Application Example 1.
【図2】応用例1の銅層の粒子構造のSEM写真であ
る。FIG. 2 is an SEM photograph of a grain structure of a copper layer of Application Example 1.
Claims (27)
イドポリマーの製造方法において、(a)立体安定剤と
してポリマー乳濁液を作り、(b)ポリマー乳濁液を水
性分散媒質で希釈し、(c)ピロール、N置換ピロー
ル、ベータ置換ピロール、チオフェン、アニリン、フラ
ンおよびその混合物からなる群から選ばれる芳香族複素
環式モノマーを、芳香族複素環式モノマーのためのオキ
シダントおよび希釈ポリマー乳濁液を含む水性媒質中で
酸化的に重合し、(d)水性媒質から加工可能な電導性
コロイドポリマーを分離する工程からなることを特徴と
する、水性媒質における加工可能な電導性コロイドポリ
マーの製造方法。1. A method for producing a conductive colloidal polymer processable in an aqueous medium, wherein (a) a polymer emulsion is prepared as a steric stabilizer, and (b) the polymer emulsion is diluted with an aqueous dispersion medium. c) an aromatic heterocyclic monomer selected from the group consisting of pyrrole, N-substituted pyrrole, beta-substituted pyrrole, thiophene, aniline, furan and mixtures thereof, an oxidant and a diluted polymer emulsion for the aromatic heterocyclic monomer. A process for producing a processable conductive colloidal polymer in an aqueous medium, which comprises the step of oxidatively polymerizing in an aqueous medium containing (d) and separating the processable conductive colloidal polymer from the aqueous medium. .
ト)の乳濁液である請求項1記載の方法。2. The method of claim 1, wherein the polymer emulsion is a poly (vinyl acetate) emulsion.
である請求項1記載の方法。3. The method of claim 1 wherein the polymer emulsion is an acrylate emulsion.
ート―コ―ブチルアクリレート)である請求項3記載の
方法。4. The method according to claim 3, wherein the acrylate is poly (methyl methacrylate-co-butyl acrylate).
ート―コ―ブチルアクリレート―コ―アクリル酸)であ
る請求項3記載の方法。5. The method according to claim 3, wherein the acrylate is poly (methyl methacrylate-co-butyl acrylate-co-acrylic acid).
ート―コ―ブチルアクリレート―コ―ビニルアセテー
ト)である請求項3記載の方法。6. The method according to claim 3, wherein the acrylate is poly (methyl methacrylate-co-butyl acrylate-co-vinyl acetate).
方法。7. The method according to claim 1, wherein the aqueous dispersion medium is water.
1記載の方法。8. The method according to claim 1, wherein the aqueous dispersion medium is an acidic aqueous solution.
ゲン、硝酸銀、ニクロン酸塩、過マンガン酸塩、マンガ
ン酸塩、過ヨウ素酸塩およびセシウム(IV)からなる
群から選ばれる請求項1記載の方法。9. The oxidant is selected from the group consisting of iron, copper, persulfates, halogens, silver nitrate, nicronates, permanganates, manganates, periodates and cesium (IV). The method described.
項9記載の方法。10. The method of claim 9 wherein the oxidant is ferric chloride.
ある請求項1記載の方法。11. The method of claim 1, wherein the aromatic heterocyclic monomer is pyrrole.
記載の方法。12. The separation according to claim 1, wherein the separation is carried out by filtration.
The described method.
ロイドポリマー分散液の製造方法において、(a)立体
安定剤としてポリマー乳濁液を作り、(b)ポリマー乳
濁液を水性分散媒質で希釈し、(c)ピロール、N置換
ピロール、ベータ置換ピロール、チオフェン、アニリ
ン、フランおよびその混合物からなる群から選ばれる芳
香族複素環式モノマーを、芳香族複素環式モノマーのた
めのオキシダントおよび希釈ポリマー乳濁液を含む水性
媒質中で酸化的に重合し、(d)水性媒質から加工可能
な電導性コロイドポリマーを分離し、(e)得られた加
工可能な電導性コロイドポリマーを、ポリマー乳濁液中
で該ポリマーと混和性のある溶媒中に分散させる工程か
らなることを特徴とする。水性媒質における加工可能な
電導性コロイドポリマー分散液の製造方法。13. A method for producing a processable conductive colloidal polymer dispersion in an aqueous medium, comprising: (a) preparing a polymer emulsion as a steric stabilizer, and (b) diluting the polymer emulsion with an aqueous dispersion medium. , (C) an aromatic heterocyclic monomer selected from the group consisting of pyrrole, N-substituted pyrrole, beta-substituted pyrrole, thiophene, aniline, furan and mixtures thereof, an oxidant and a diluted polymer milk for the aromatic heterocyclic monomer. Oxidatively polymerizing in an aqueous medium containing a suspension, (d) separating the processable conductive colloidal polymer from the aqueous medium, and (e) obtaining the processable conductive colloidal polymer as a polymer emulsion. In particular, it comprises a step of dispersing in a solvent miscible with the polymer. A method for producing a processable conductive colloidal polymer dispersion in an aqueous medium.
ート)の乳濁液である請求項13記載の方法。14. The method of claim 13, wherein the polymer emulsion is a poly (vinyl acetate) emulsion.
液である請求項13記載の方法。15. The method of claim 13 wherein the polymer emulsion is an acrylate emulsion.
レート―コ―ブチルアクリレート)である請求項15記
載の方法。16. The method of claim 15, wherein the acrylate is poly (methylmethacrylate-co-butylacrylate).
レート―コ―ブチルアクリレート―コ―アクリル酸)で
ある請求項15記載の方法。17. The method of claim 15, wherein the acrylate is poly (methyl methacrylate-co-butyl acrylate-co-acrylic acid).
レート―コ―ブチルアクリレート―コ―ビニルアセテー
ト)である請求項15記載の方法。18. The method according to claim 15, wherein the acrylate is poly (methyl methacrylate-co-butyl acrylate-co-vinyl acetate).
載の方法。19. The method of claim 13 wherein the aqueous dispersion medium is water.
項13記載の方法。20. The method of claim 13, wherein the aqueous dispersion medium is an acidic aqueous solution.
酸、ニクロン酸、過マンガン酸、マンガン酸、および過
ヨウ素酸の鉄、銅およびセシウム(IV)との塩からな
る群から選ばれる請求項13記載の方法。21. The oxidant is selected from the group consisting of persulfuric acid, halogen, nitric acid, nitric acid, permanganic acid, manganic acid, and salts of periodic acid with iron, copper and cesium (IV). the method of.
項21記載の方法。22. The method of claim 21, wherein the oxidant is ferric chloride.
ある請求項13記載の方法。23. The method of claim 13, wherein the aromatic heterocyclic monomer is pyrrole.
3記載の方法。24. The method according to claim 1, wherein the separation is performed by filtration.
3. The method described in 3.
ール、ベンゼン、トルエン、クロロホルム、DMF、ア
セトン、ブタノンおよびエステルからなる群から選ばれ
る請求項13記載の方法。25. The method according to claim 13, wherein the solvent used in step (e) is selected from the group consisting of methanol, benzene, toluene, chloroform, DMF, acetone, butanone and ester.
ールである請求項25記載の方法。26. The method according to claim 25, wherein the solvent used in step (e) is methanol.
ンである請求項25記載の方法。27. The method according to claim 25, wherein the solvent used in step (e) is butanone.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4334390A DE4334390C2 (en) | 1993-10-08 | 1993-10-08 | Process for making a processable, conductive, colloidal polymer |
JP5301215A JP2542791B2 (en) | 1993-10-08 | 1993-11-06 | Process for producing processable conductive colloidal polymer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4334390A DE4334390C2 (en) | 1993-10-08 | 1993-10-08 | Process for making a processable, conductive, colloidal polymer |
JP5301215A JP2542791B2 (en) | 1993-10-08 | 1993-11-06 | Process for producing processable conductive colloidal polymer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07157549A JPH07157549A (en) | 1995-06-20 |
JP2542791B2 true JP2542791B2 (en) | 1996-10-09 |
Family
ID=25930270
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JP5301215A Expired - Lifetime JP2542791B2 (en) | 1993-10-08 | 1993-11-06 | Process for producing processable conductive colloidal polymer |
Country Status (2)
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JP (1) | JP2542791B2 (en) |
DE (1) | DE4334390C2 (en) |
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US6593399B1 (en) | 1999-06-04 | 2003-07-15 | Rohm And Haas Company | Preparing conductive polymers in the presence of emulsion latexes |
WO2004029133A1 (en) | 2002-09-24 | 2004-04-08 | E.I. Du Pont De Nemours And Company | Water dispersible polyanilines made with polymeric acid colloids for electronics applications |
ATE404609T1 (en) | 2002-09-24 | 2008-08-15 | Du Pont | WATER DISPERSIBLE POLYTHIOPHENES PRODUCED USING COLLOIDS BASED ON POLYMERIC ACIDS |
US7317047B2 (en) | 2002-09-24 | 2008-01-08 | E.I. Du Pont De Nemours And Company | Electrically conducting organic polymer/nanoparticle composites and methods for use thereof |
TWI302563B (en) | 2002-09-24 | 2008-11-01 | Du Pont | Electrically conducting organic polymer/nanoparticle composites and methods for use thereof |
US7390438B2 (en) | 2003-04-22 | 2008-06-24 | E.I. Du Pont De Nemours And Company | Water dispersible substituted polydioxythiophenes made with fluorinated polymeric sulfonic acid colloids |
US7351358B2 (en) * | 2004-03-17 | 2008-04-01 | E.I. Du Pont De Nemours And Company | Water dispersible polypyrroles made with polymeric acid colloids for electronics applications |
US7250461B2 (en) | 2004-03-17 | 2007-07-31 | E. I. Du Pont De Nemours And Company | Organic formulations of conductive polymers made with polymeric acid colloids for electronics applications, and methods for making such formulations |
US7338620B2 (en) * | 2004-03-17 | 2008-03-04 | E.I. Du Pont De Nemours And Company | Water dispersible polydioxythiophenes with polymeric acid colloids and a water-miscible organic liquid |
US8147962B2 (en) | 2004-04-13 | 2012-04-03 | E. I. Du Pont De Nemours And Company | Conductive polymer composites |
CN101208369B (en) | 2005-06-28 | 2013-03-27 | E.I.内穆尔杜邦公司 | High work function transparent conductors |
WO2007002740A2 (en) | 2005-06-28 | 2007-01-04 | E. I. Du Pont De Nemours And Company | Buffer compositions |
US8216680B2 (en) | 2006-02-03 | 2012-07-10 | E I Du Pont De Nemours And Company | Transparent composite conductors having high work function |
US8153029B2 (en) | 2006-12-28 | 2012-04-10 | E.I. Du Pont De Nemours And Company | Laser (230NM) ablatable compositions of electrically conducting polymers made with a perfluoropolymeric acid applications thereof |
US8062553B2 (en) | 2006-12-28 | 2011-11-22 | E. I. Du Pont De Nemours And Company | Compositions of polyaniline made with perfuoropolymeric acid which are heat-enhanced and electronic devices made therewith |
US20080191172A1 (en) | 2006-12-29 | 2008-08-14 | Che-Hsiung Hsu | High work-function and high conductivity compositions of electrically conducting polymers |
US8241526B2 (en) | 2007-05-18 | 2012-08-14 | E I Du Pont De Nemours And Company | Aqueous dispersions of electrically conducting polymers containing high boiling solvent and additives |
JP2012520381A (en) | 2009-03-12 | 2012-09-06 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Conductive polymer composition for coating applications |
EP2421918B1 (en) | 2009-04-21 | 2020-08-26 | LG Chem, Ltd. | Electrically conductive polymer compositions and films made therefrom |
US8945427B2 (en) | 2009-04-24 | 2015-02-03 | E I Du Pont De Nemours And Company | Electrically conductive polymer compositions and films made therefrom |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5021193A (en) | 1989-06-30 | 1991-06-04 | United States Department Of Energy | Nonaqueous polypyrrole colloids |
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US4604427A (en) * | 1984-12-24 | 1986-08-05 | W. R. Grace & Co. | Method of forming electrically conductive polymer blends |
FR2628746B1 (en) * | 1988-03-21 | 1992-03-27 | Solvay | PROCESS FOR THE PREPARATION OF A POLYPYRROLE-BASED LATEX AND USE OF THIS LATEX TO FORM A CONDUCTIVE FILM |
JP2709130B2 (en) * | 1988-03-31 | 1998-02-04 | キヤノン株式会社 | Polymer gel-coated conductor, method for forming the same, and battery using core polymer gel-coated conductor |
US4973391A (en) * | 1988-08-30 | 1990-11-27 | Osaka Gas Company, Ltd. | Composite polymers of polyaniline with metal phthalocyanine and polyaniline with organic sulfonic acid and nafion |
EP0432929A3 (en) * | 1989-12-11 | 1991-08-21 | Milliken Research Corporation | Polyaniline dispersion and method for making same |
EP0554588B1 (en) * | 1992-01-28 | 2004-03-31 | Agfa-Gevaert | Sheet or web material having antistatic properties |
-
1993
- 1993-10-08 DE DE4334390A patent/DE4334390C2/en not_active Expired - Lifetime
- 1993-11-06 JP JP5301215A patent/JP2542791B2/en not_active Expired - Lifetime
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US5021193A (en) | 1989-06-30 | 1991-06-04 | United States Department Of Energy | Nonaqueous polypyrrole colloids |
Also Published As
Publication number | Publication date |
---|---|
DE4334390C2 (en) | 1999-01-21 |
DE4334390A1 (en) | 1995-04-13 |
JPH07157549A (en) | 1995-06-20 |
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