JP2541762Y2 - 半導体素子収納用パッケージ - Google Patents

半導体素子収納用パッケージ

Info

Publication number
JP2541762Y2
JP2541762Y2 JP1990127590U JP12759090U JP2541762Y2 JP 2541762 Y2 JP2541762 Y2 JP 2541762Y2 JP 1990127590 U JP1990127590 U JP 1990127590U JP 12759090 U JP12759090 U JP 12759090U JP 2541762 Y2 JP2541762 Y2 JP 2541762Y2
Authority
JP
Japan
Prior art keywords
external lead
test
lead terminal
connecting member
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990127590U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0482849U (US20020128544A1-20020912-P00008.png
Inventor
達海 坂元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1990127590U priority Critical patent/JP2541762Y2/ja
Publication of JPH0482849U publication Critical patent/JPH0482849U/ja
Application granted granted Critical
Publication of JP2541762Y2 publication Critical patent/JP2541762Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1990127590U 1990-11-28 1990-11-28 半導体素子収納用パッケージ Expired - Lifetime JP2541762Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990127590U JP2541762Y2 (ja) 1990-11-28 1990-11-28 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990127590U JP2541762Y2 (ja) 1990-11-28 1990-11-28 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0482849U JPH0482849U (US20020128544A1-20020912-P00008.png) 1992-07-20
JP2541762Y2 true JP2541762Y2 (ja) 1997-07-16

Family

ID=31875084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990127590U Expired - Lifetime JP2541762Y2 (ja) 1990-11-28 1990-11-28 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JP2541762Y2 (US20020128544A1-20020912-P00008.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5306497B2 (ja) * 2012-02-07 2013-10-02 京セラ株式会社 電子素子キャリア

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519817A (en) * 1978-07-28 1980-02-12 Hitachi Ltd Integrated circuit lead protecting device
JPS60195959A (ja) * 1984-03-19 1985-10-04 Hitachi Ltd リ−ドフレ−ムおよびその製造方法
JPS63132444U (US20020128544A1-20020912-P00008.png) * 1987-02-23 1988-08-30

Also Published As

Publication number Publication date
JPH0482849U (US20020128544A1-20020912-P00008.png) 1992-07-20

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term