JP2538039B2 - Electronic component mounting device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus, and more particularly to a means for performing high-speed and precise θ correction of a chip sucked by a nozzle of a transfer head.

(Prior Art) FIG. 5 shows a conventional electronic component mounting apparatus, in which 101 is a rotary head and 102 is a rotary head 10.
1 is a transfer head vertically installed; 103 is a nozzle for adsorbing the chip P; 104 is a nozzle for correcting the positional deviation of the chip P in the θ direction (rotational direction around the axis of the nozzle 103).
A motor for rotating 103 in the θ direction, a belt 105, and an XY direction moving device 106 on which a substrate 107 is arranged.

In this apparatus, when the rotary head 101 rotates in an index manner, the nozzle 103 sucks the chips P in the chip supply unit (not shown) to take them up, and the chips are transferred and mounted on the substrate 107. An observation device (not shown) for observing the positional deviation of the chip P adsorbed by the nozzle 103 in the XYθ direction is provided between the chip supply unit and the XY direction movement device 106.
Based on the observation result, the displacement in the XY direction is corrected by driving the XY direction moving device 106 to move the substrate 107 in the same direction by the same amount, and the displacement in the θ direction is corrected by the motor.
The correction is performed by driving the nozzle 104 and rotating the nozzle 103.

(Problems to be Solved by the Invention) By the way, there is a limit to the minimum rotation angle of the motor 104, and therefore, in order to perform a minute θ correction, the pulley ratio of the pulley in which the belt 105 is banded is increased. Then, the rotation speed of the motor 104 must be sufficiently reduced. However, when the pulley ratio is increased in this way, the rotation speed of the nozzle 103 is reduced, the mounting efficiency is reduced accordingly, and the belt 105 is easily stretched to lower the mounting accuracy, and further the capacity of the motor 104 is increased. Therefore, there is a problem that the device becomes large and heavy. Such a problem similarly occurs when the rotation of the motor 104 is transmitted to the nozzle 103 by another speed reducing means such as a gear instead of the belt or the pulley. Further, such a problem is not limited to the rotary head type electronic component mounting apparatus equipped with a large number of transfer heads, and one transfer head is moved in the XY direction to transfer and mount the chips of the chip supply unit onto the substrate. The same also occurs in the case of a system type electronic component mounting apparatus and the like.

Therefore, an object of the present invention is to provide an electronic component mounting apparatus provided with means capable of performing θ correction of a chip sucked by a nozzle with high speed and high accuracy.

(Means for Solving the Problem) For this purpose, the present invention is to adsorb a chip of a chip supply unit to a nozzle and transfer and mount the chip on a substrate arranged in a positioning device, and to a nozzle. In an electronic component mounting apparatus including an observation device that detects a positional deviation of the chip in the XYθ directions, and a motor that rotates a nozzle that has adsorbed the chip in the θ direction based on this observation result, the motor is the transfer head. A driving device that is provided so as to move integrally and that is provided with the substrate and that is provided separately from the positioning device is horizontally rotatably provided on the positioning device, and that the placement part is horizontally rotated. Is provided, and rough correction in the θ direction of the chip sucked by the nozzle is performed by driving the motor, and fine correction is performed by driving the driving device to horizontally rotate the arrangement portion. One in which the.

Further, the arranging portion is provided with a clamp member for clamping and positioning the substrate, and a corner portion thereof is pivotally attached to the positioning device by a hinge so as to be horizontally rotatable, and the drive device is on a diagonal line with the corner portion. The drive device is provided at a corner portion, and the drive device includes a motor, a feed screw, and a nut.

(Operation) According to the above configuration, the motor is driven to rotate the nozzle to perform the rough correction in the θ direction of the chip, and the driving device is driven to horizontally rotate the placement portion, thereby performing precise rotation. After fine correction, the chip is mounted on the substrate.

(Example) Next, the Example of this invention is described, referring drawings.

FIG. 4 is a perspective view of a main part of a rotary head type electronic component mounting apparatus, in which reference numeral 1 is a rotary head, and a large number of transfer heads 2 are vertically provided along a circumferential direction thereof. Reference numeral 3 denotes a chip supply unit composed of a tray provided below the rotary head 1, and reference numeral 4 denotes an XY direction moving device as a device for positioning the substrate 5. A tape feeder is often used as the chip supply unit.

Between the chip supply unit 3 and the XY direction moving device 4, the chip P sucked by the transfer head 2 is observed from below, and
An observing device 7 having a camera 6 for detecting positional deviations in the XYθ directions is provided. The rotary head 1 makes an index rotation in the horizontal direction N1, and accordingly, the transfer head 2 sucks the chip P of the chip supply unit 3 and transfers and mounts it on the substrate 5. Reference numeral 8 denotes a conveyor that carries the substrate 5 into and out of the XY direction moving device 4.

FIG. 1 shows the transfer head 2 and the XY direction moving device 4 in detail. The transfer head 2 includes a main body case 11, a nozzle 12 protruding from a lower portion of the main body case 11, and the nozzle 12 in the θ direction (rotational direction about the axis of the nozzle 12).
It consists of a pulse motor 13 that rotates to. The pulse motor 13 is provided inside the rotary head 1 together with the transfer head 2 and moves along the moving path integrally with the transfer head 2. The chip P adsorbed by the nozzle 12 is a QFP having leads 14 protruding in four directions. Since QFP has a large number of leads 14 and a small pitch, extremely high mounting accuracy is required. Of course, not limited to QFP, 2
SOPs with leads in the direction, resistor chips, capacitor chips, etc. are also to be mounted.

Reference numeral 16 denotes an arrangement portion of a plate-like substrate 5 provided separately from the XY direction moving device 4 on the XY direction moving device 4, and positions the substrate 5 on both sides by clamping the substrate 5 from both sides. Clamping materials 17a and 17b are provided. Further, the corners thereof are horizontally rotatably attached to the XY direction moving device 4 by hinges 18.

FIG. 2 shows a driving device 20 for horizontally rotating the disposing portion 16, 21 is a motor, 22 is a feed screw, and 23 is a nut provided on the XY direction moving device 4. Drive device 20
Are provided at corners on a diagonal line from the corner at which the hinge 18 is provided. At the tip of the lead screw 22,
24 extends, and its tip end engages with a long hole 25 formed in the disposing portion 16. Therefore, when the motor 21 is driven, the feed screw 22 reciprocates in the length direction N2 thereof,
16 rotates horizontally around the hinge 18. FIG. 3 shows the situation in a simplified manner.

The present apparatus has the above-mentioned configuration, and the operation will be described next.

Along with the pitch rotation of the rotary head 1, the chips of the chip supply unit 3 are attracted to the lower end of the nozzle 12 and transferred toward the substrate 5 positioned by the XY direction moving device 4. In the middle of the process, the observing device 7 detects the displacement of the chip P sucked by the nozzle 12 in the XYθ directions. The misalignment in the XY direction is corrected by driving the XY direction moving device 4 and moving the substrate 5 in the same direction. The positional deviation in the θ direction is corrected by driving the motor 13 and the motor 21. That is, when the motor 13 is driven, the nozzle 12 rotates in the θ direction, but since the minimum rotation angle of the motor 13 is limited as described above, the nozzle 12
It is difficult to correct the misalignment in the θ direction with high speed and high accuracy by rotating 12 in the θ direction. Therefore, rough correction (for example, correction of 5 ° or more) is performed by the motor 13, and fine correction (for example, correction of 5 ° or less) is performed by horizontally rotating the mounting portion 16 by the other motor 21. In this case, the placement unit 16 is a separate unit from the XY moving device 4,
21 only needs to rotate the light weight installation part 16 horizontally,
The load of the motor 21 is extremely small, and even the small-capacity motor 21 can perform fine correction by rotating the disposing portion 16 at high speed and with high accuracy.

As described above, if only the rough correction is performed by the θ correction motor 13 provided in the transfer head 2, the motor 13
No large deceleration of the number of rotations of is required, and the nozzle 12 can be rotated at high speed even with a small capacity motor 13.
Further, since the fine correction is performed by driving the driving device 20 to horizontally rotate the disposing portion 16, the chip P can be mounted on the substrate 5 at high speed and with high accuracy. Incidentally, a new positional deviation in the XY direction accompanying the θ correction can be easily corrected by driving the XY direction moving device 4 in the same direction.

Although the above embodiment has been described by taking the rotary head type electronic component mounting apparatus as an example, the present invention can be applied to other electronic component mounting apparatuses such as a one-by-one system.

(Effect of the invention) In the electronic component mounting apparatus of this type, the motor for rotating the nozzle of the transfer head is provided so as to move integrally with the transfer head, and the substrate is arranged. The positioning section is provided separately from the positioning apparatus so as to be horizontally rotatable on the positioning apparatus, and a driving device for horizontally rotating the positioning section is provided to drive the θ of the chips attracted to the nozzle by driving the motor. The rough correction of the direction is performed and the fine correction is performed by driving the driving device to horizontally rotate the disposition part. Therefore, the misalignment of the chip adsorbed by the nozzle of the transfer head in the θ direction is performed. Can be corrected at high speed and with high accuracy and mounted on a substrate. Especially, in this case, since the disposing portion is separate from the positioning device and the motor only needs to horizontally rotate the light disposing portion, the load on the motor is extremely small and even a small capacity motor can be used. Fine correction can be performed by rotating the disposition part at high speed and high accuracy.

According to a second aspect of the present invention, the arranging portion includes a clamp member that clamps and positions the substrate, and a corner portion of the clamp member is horizontally rotatably attached to the positioning device by a hinge, and the drive device. Are provided at the corners and the corners on a diagonal line, and since the drive unit is composed of a motor, a feed screw and a nut, fine correction of the tip in the θ direction can be performed more precisely and accurately.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is a perspective view of a transfer head and an XY direction moving device, FIG. 2 is a side view of a driving device, FIG. 3 is a plan view during correction, FIG. 4 is a perspective view of a rotary head type electronic component mounting apparatus, and FIG. 5 is a perspective view of a conventional apparatus. 2 ... Transfer head 3 ... Chip supply part 4 ... Positioning device 5 ... Substrate 7 ... Observation device 11 ... Nozzle 13 ... Motor 16 ... Arrangement part 20 ... Drive device

Claims (2)

(57) [Claims] 1. A transfer head for adsorbing a chip of a chip supply unit to a nozzle and transferring and mounting the chip on a substrate provided in a positioning device, and an observation for detecting a positional deviation in the XYθ direction of the chip adsorbed by the nozzle. In an electronic component mounting apparatus including an apparatus and a motor that rotates a nozzle that adsorbs a chip based on this observation result in a θ direction, the motor is provided so as to move integrally with the transfer head, and An arrangement portion for arranging the substrate is provided separately from the positioning device so as to be horizontally rotatable on the positioning device, and a drive device for horizontally rotating the arrangement portion is provided. A rough correction in the θ direction of the mounted chip is performed, and a fine correction is performed by horizontally driving the driving unit by driving this driving device. . 2. The arranging portion includes a clamp member for clamping and positioning the substrate, and a corner portion of the clamp member is rotatably and horizontally attached to the positioning device by a hinge, and the driving device has the corner portion. 2. The electronic component mounting apparatus according to claim 1, wherein the electronic device mounting apparatus is provided at a corner portion on a diagonal line, and the driving device is composed of a motor, a feed screw, and a nut.