JP2536110B2 - Bonding pad formation method - Google Patents

Bonding pad formation method

Info

Publication number
JP2536110B2
JP2536110B2 JP63329889A JP32988988A JP2536110B2 JP 2536110 B2 JP2536110 B2 JP 2536110B2 JP 63329889 A JP63329889 A JP 63329889A JP 32988988 A JP32988988 A JP 32988988A JP 2536110 B2 JP2536110 B2 JP 2536110B2
Authority
JP
Japan
Prior art keywords
bonding pad
bonding
printing plate
pattern
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63329889A
Other languages
Japanese (ja)
Other versions
JPH02174239A (en
Inventor
浩之 新井
伸也 立花
裕一 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP63329889A priority Critical patent/JP2536110B2/en
Publication of JPH02174239A publication Critical patent/JPH02174239A/en
Application granted granted Critical
Publication of JP2536110B2 publication Critical patent/JP2536110B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/10125—Reinforcing structures
    • H01L2224/10126—Bump collar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、ワイヤボンディングを確実に行なうことを
可能とするボンディングパッドの形成方法に関する。The present invention relates to a method for forming a bonding pad that enables reliable wire bonding.

［従来の技術］ 半導体チップ等の配線の端部にはボンディングパッド
と呼ばれる領域が形成され、これにワイヤーを結着する
ことにより、外部リード線と半導体チップとが電気的に
接続される。ボンディングパッドの形成方法には、印刷
法とホトリソグラフィーとがある。ホトリソグラフィー
は微細なパターンを精度良く形成できるという利点があ
る反面、その工程が複雑であるために生産コストが高い
という欠点がある。そのため、ボンディングパッドの形
成には、印刷法の中でも比較的微細パターンの形成が可
能な凹版オフセット印刷法を用いることが検討されてい
る。印刷法では、導電性インキを基板上に印刷すること
により、所定の配線パターン及びボンディングパッドを
形成する。しかしながら、このようにしてボンディング
パッドを形成すると、印刷インキの性質上、その表面が
平らとならず、断面形状が円弧を描くことが多い。この
状態でワイヤボンディングを行なうと、ワイヤのパッド
上を滑り落ち、ボンディングミスを生じることがあり、
ワイヤボンディングを確実に行なうことができない。[Prior Art] A region called a bonding pad is formed at an end of a wiring such as a semiconductor chip, and an external lead wire and a semiconductor chip are electrically connected to each other by connecting a wire to the region. Methods of forming the bonding pad include a printing method and photolithography. Although photolithography has an advantage that a fine pattern can be formed with high precision, it has a drawback that the production cost is high because the process is complicated. Therefore, for forming the bonding pad, it is considered to use an intaglio offset printing method that can form a relatively fine pattern among printing methods. In the printing method, a conductive ink is printed on a substrate to form a predetermined wiring pattern and bonding pads. However, when the bonding pad is formed in this manner, the surface of the bonding pad is not flat due to the nature of the printing ink, and the cross-sectional shape often draws an arc. If you perform wire bonding in this state, it may slip off on the wire pad, resulting in a bonding error.
Wire bonding cannot be reliably performed.

［発明が解決しようとする課題］ 本発明は、上記事情に鑑みてなされたもので、印刷法
によってもボンディングミスを起こすことのないボンデ
ィングパッドの形成方法を提供することを目的とする。[Problems to be Solved by the Invention] The present invention has been made in view of the above circumstances, and an object thereof is to provide a method for forming a bonding pad that does not cause a bonding error even by a printing method.

［課題を解決するための手段］ 本発明の方法は、ボンディングパッドに対応する領域
の中央部またはその近傍にブランクを設けたパターンを
有する印刷版作成用原版を用いて、該パターンと略同様
のパターンを有する凹版印刷版を作成し、この凹版印刷
版を用いて、オフセット印刷法により基板表面に導電性
インキを印刷し、表面が平坦かまたは中央部もしくはそ
の近傍に凹部もしくは非印刷部を有するボンディングパ
ッドを形成することからなるボンディングパッドの形成
方法である。[Means for Solving the Problems] The method of the present invention uses a printing plate making original plate having a pattern in which a blank is provided at or near the central portion of the region corresponding to the bonding pad, and is substantially the same as the pattern. An intaglio printing plate having a pattern is prepared, and by using this intaglio printing plate, a conductive ink is printed on the substrate surface by an offset printing method, and the surface is flat or has a concave portion or a non-printed portion in the central portion or its vicinity. A method for forming a bonding pad, which comprises forming a bonding pad.

［作用］ 本発明の方法により形成されたボンディングパッド
は、表面が平坦であるか、またはその中央部付近に凹部
もしくは非印刷部を有する。このような形状を有するボ
ンディングパッドにワイヤボンディングを施す場合、円
弧状の断面形状を有する従来のボンディングパッドと異
なり、該パッド上でワイヤが滑ることがなく、ボンディ
ングミスが起り難く、確実なワイヤボンディングが可能
となる。[Operation] The bonding pad formed by the method of the present invention has a flat surface or has a concave portion or a non-printed portion near the center thereof. When performing wire bonding on a bonding pad having such a shape, unlike a conventional bonding pad having an arcuate cross-sectional shape, the wire does not slip on the pad, a bonding error is unlikely to occur, and a reliable wire bonding is performed. Is possible.

［実施例］ 以下、図面を参照し、本発明の方法により通電プリン
ター用のラインヘッドを作成した例について説明する。[Example] An example in which a line head for an electric printer is produced by the method of the present invention will be described below with reference to the drawings.

第１図（ａ）及び（ｂ）は、各々本発明の方法に用い
られる印刷版作成用の原版及び印刷版を示し、第１図
（ｃ）は、本発明により形成された通電プリンター用ラ
インヘッドのボンディングパッドを示す。1 (a) and 1 (b) respectively show an original plate and a printing plate for making a printing plate used in the method of the present invention, and FIG. 1 (c) is a line for an electric printer formed by the present invention. The bonding pad of the head is shown.

第１図（ａ）に示すように、印刷版作成用の原版１の
ボンディングパッド中央付近に相当する部分に、幅約10
μｍ長さ約25μｍの１本のスジ状ブランク２を入れ、こ
の原版１を用いて第１図（ｂ）に示す印刷版３を作成し
た。次に、導電性インキとしてタングステンインキを用
い、この印刷版３を使用し、凹版オフセット印刷法によ
りフォルステライト製の基板上に、第１図（ｃ）に示す
ように、125μｍのピッチで90μｍの幅を有する多数の
ボンディングパッド４を印刷した。導電性インキとして
は、タングステンインキに限定するものではなく、金イ
ンキ等を使用することもできる。As shown in FIG. 1 (a), a width of about 10
One strip blank 2 having a length of about 25 μm was put, and the original plate 1 was used to prepare a printing plate 3 shown in FIG. 1 (b). Next, using a tungsten ink as a conductive ink, this printing plate 3 was used, and as shown in FIG. 1 (c), an intaglio offset printing method was used to print 90 μm of 90 μm at a pitch of 125 μm. A number of bonding pads 4 having a width were printed. The conductive ink is not limited to the tungsten ink, and gold ink or the like can also be used.

原版１に入れられたスジ状ブランク２は、印刷版３に
もほぼ同様の寸法及び形状で形成されているが、この印
刷版３を用いて凹版オフセット印刷を行なうと、インク
の流動性および印刷時の押圧のため、第２図に示すよう
に基板５上に形成された該ボンディングパッド４の断面
形状は、非印刷部ではなく凹型の形状となる。このボン
ディングパッド４の形状は、凹型に限らず、平坦または
非印刷部であってもよいが、非印刷部である場合は、ボ
ンディングに影響を与えない幅2.0μｍ以下の非印刷部
が望ましい。The streak-shaped blank 2 put in the original plate 1 is also formed on the printing plate 3 with substantially the same size and shape. However, when intaglio offset printing is performed using this printing plate 3, the fluidity of the ink and the printing will be improved. Due to the pressing force at the time, the cross-sectional shape of the bonding pad 4 formed on the substrate 5 is not a non-printed portion but a concave shape as shown in FIG. The shape of the bonding pad 4 is not limited to the concave shape and may be a flat or non-printed portion, but in the case of the non-printed portion, a non-printed portion having a width of 2.0 μm or less that does not affect the bonding is desirable.

上記のようにボンディングパッド４を印刷した後、約
560℃で焼成し、インキ被膜中の樹脂バインダーを蒸発
させた。印刷されたパターンの末端に形成されたボンデ
ィングパッド４に、直径25μｍの太さの金線を、ボンダ
ーを用い溶融圧着することによりボンディングし、通電
プリンター用のラインヘッドを作成した。ボンディング
は35箇所行なったが、ボンディングミスは殆ど起こらな
かった。After printing the bonding pad 4 as described above,
The resin binder in the ink film was evaporated by baking at 560 ° C. A gold wire having a diameter of 25 μm was melt-pressed with a bonder to the bonding pad 4 formed at the end of the printed pattern to bond the wire, thereby preparing a line head for an electric printer. Bonding was done at 35 points, but almost no bonding mistakes occurred.

本発明にかかる原版のボンディングパッド中央付近に
相当する部分の形状は、前述の１本のスジに限定するも
のではなく、第３図（ａ）に示すように直径20μｍのピ
ンホールを数個形成した場合、第３図（ｂ）に示すよう
に幅10μｍ長さ75μｍのスジを３本入れた場合、第３図
（ｃ）に示すように５μｍ×５μｍの四角形を10μｍお
きに３×５列作成してメッシュ状にした場合、及び第３
図（ｄ）に示すように幅10μｍの５本のスジを井形状に
入れた場合についても良好な効果が認められた。The shape of the portion corresponding to the vicinity of the center of the bonding pad of the original plate according to the present invention is not limited to the above-mentioned one stripe, and several pinholes having a diameter of 20 μm are formed as shown in FIG. 3 (a). When three lines with a width of 10 μm and a length of 75 μm are inserted as shown in FIG. 3 (b), a square of 5 μm × 5 μm is 3 × 5 rows every 10 μm as shown in FIG. 3 (c). When created and made into a mesh shape, and the third
As shown in FIG. 3D, a good effect was also observed when five stripes having a width of 10 μm were formed in a well shape.

［発明の効果］ 本発明の方法を用いると、ボンディングミスを起こし
難く、確実なワイヤボンディングを可能とするボンディ
ングパッドを低い生産コストで形成することができる。[Advantages of the Invention] By using the method of the present invention, it is possible to form a bonding pad that is unlikely to cause a bonding error and enables reliable wire bonding at a low production cost.

【図面の簡単な説明】[Brief description of drawings]

第１図（ａ）は、本発明の一実施例に用いられる原版を
示す図、第１図（ｂ）は、本発明の一実施例に用いられ
る印刷版を示す図、第１図（ｃ）はこれらを用いて形成
された本発明の一実施例に係るボンディングパッドを示
す平面図、第２図は、第１図（ｃ）のＡ−Ａ′断面図、
第３図（ａ）ないし第３図（ｄ）は、本発明の方法に用
いられるボンディングパッドの原版の他の例を示す図で
ある。1 (a) is a diagram showing an original plate used in one embodiment of the present invention, FIG. 1 (b) is a diagram showing a printing plate used in one embodiment of the present invention, and FIG. 1 (c). ) Is a plan view showing a bonding pad according to an embodiment of the present invention formed by using these, FIG. 2 is a sectional view taken along the line AA ′ of FIG. 1 (c),
FIGS. 3 (a) to 3 (d) are views showing another example of the original plate of the bonding pad used in the method of the present invention.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】ボンディングパッドに対応する領域の中央
部またはその近傍にブランクを設けたパターンを有する
印刷版作成用原版を用いて、該パターンと略同様のパタ
ーンを有する凹版印刷版を作成し、この凹版印刷版を用
いて、オフセット印刷法により基板表面に導電性インキ
を印刷し、表面が平坦かまたは中央部もしくはその近傍
に凹部もしくは非印刷部を有するボンディングパッドを
形成することからなるボンディングパッドの形成方法。1. An intaglio printing plate having a pattern substantially similar to the pattern is prepared by using a printing plate making original plate having a pattern in which a blank is provided at or near a central portion of a region corresponding to a bonding pad, Bonding pad comprising using this intaglio printing plate to print a conductive ink on the surface of a substrate by an offset printing method to form a bonding pad having a flat surface or a concave portion or a non-printed portion at or near a central portion. Forming method.
JP63329889A 1988-12-27 1988-12-27 Bonding pad formation method Expired - Lifetime JP2536110B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63329889A JP2536110B2 (en) 1988-12-27 1988-12-27 Bonding pad formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63329889A JP2536110B2 (en) 1988-12-27 1988-12-27 Bonding pad formation method

Publications (2)

Publication Number Publication Date
JPH02174239A JPH02174239A (en) 1990-07-05
JP2536110B2 true JP2536110B2 (en) 1996-09-18

Family

ID=18226387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63329889A Expired - Lifetime JP2536110B2 (en) 1988-12-27 1988-12-27 Bonding pad formation method

Country Status (1)

Country Link
JP (1) JP2536110B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100845505B1 (en) * 2005-07-27 2008-07-10 세이코 엡슨 가부시키가이샤 Bonding pad fabrication method, bonding pad, method for fabricating an electronic device, and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100845505B1 (en) * 2005-07-27 2008-07-10 세이코 엡슨 가부시키가이샤 Bonding pad fabrication method, bonding pad, method for fabricating an electronic device, and electronic device

Also Published As

Publication number Publication date
JPH02174239A (en) 1990-07-05

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