JPS6358396B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming two types of conductor patterns made of different metals on an insulating substrate such as a thermal head.

The inventor of the present invention has developed a thermal head used in facsimiles and the like in which an IC for driving a heating resistor on an insulating substrate is mounted on the same insulating substrate. In such a thermal head, gold is used for the bonding pad for die-bonding the IC on the insulating substrate or for wire-bonding the IC, and gold is used for the electrode lead that supplies voltage to the heating resistor. The type of gold differs depending on the type of gold used, but when the IC is mounted directly on the insulating substrate, a conductor pattern is used in which the gold pattern for the bonding pad and the gold pattern for the electrode lead are connected to each other. need to be formed.

Conventionally, this type of conductor pattern forming method has been as follows. That is, as shown in Figure 1,
A first conductor pattern 2 is printed on an insulating substrate 1. Next, as shown in FIG. 2, a second conductor pattern 3 is formed by printing in the same manner as the first conductor pattern 2, and finally both conductor patterns 2 and 3 are fired and sintered.

The conventional method for forming conductor patterns on insulating substrates is as described above, and since printing technology was used to form both conductor patterns, the alignment accuracy is not high enough to form the conductor patterns as fine fine patterns. The problem was that it was insufficient.

This invention has been made in order to eliminate the drawbacks of the conventional ones as described above. To provide a method for forming a conductor pattern on an insulating substrate, in which a fine pattern of conductor patterns made of different metals can be formed by coating a conductor to form two types of conductor glazes, firing them, and then etching them. The purpose is

An embodiment of the present invention will be described below with reference to the drawings.

3 and 4 are diagrams for explaining a method for forming a conductor pattern on an insulating substrate according to an embodiment of the present invention, and the method for forming a conductor pattern according to the present invention will be explained below with reference to both figures.

First, as shown in FIG.
The first conductor is applied over the entire width of the substrate 1 in the region 2 where the conductor pattern is to be formed, and
A conductive glaze 4 is formed. Next, a second conductor is applied over the entire width of the substrate 1 in the region 3 where a second conductor pattern made of a metal different from that of the first conductor pattern on the insulating substrate 1 is to be formed. A conductive glaze 5 is formed. At this time, both end sides of the second conductive glaze 5 are made to overlap with the end sides 4a of the first conductive glaze 4. After firing and sintering both conductor glazes 4 and 5, exposure, development, and etching are performed on both conductor patterns 2 and 3 at once using a photographic method, thereby forming the first conductor pattern 2 and the second conductor pattern. 3 form a continuous conductor pattern (see FIG. 4).

As described above, since this method uses a photographic method that allows for easy alignment to form a conductor pattern, it is possible to easily create a fine pattern conductor pattern made of different metals.

As described above, according to the present invention, two conductor glaze layers are formed in a band shape on an insulating substrate, and the two conductor patterns are formed into a continuous conductor pattern by etching. This has the effect of forming a fine pattern conductor pattern.

[Brief explanation of the drawing]

1 and 2 are plan views for explaining a conventional method for forming a conductor pattern on an insulating substrate, and FIGS. 3 and 4 illustrate a method for forming a conductor pattern on an insulating substrate according to an embodiment of the present invention. FIG. 1... Insulating substrate, 2, 3... First and second conductor patterns, 4, 5... First and second conductor glaze, 6... Conductor pattern. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] 1 A method for forming first and second conductor patterns made of different metals on an insulating substrate, the method comprising: forming first and second conductor patterns on an insulating substrate, the method comprising: forming first and second conductor patterns made of different metals; Then, first and second conductor patterns are applied respectively to form first and second conductor glazes, and after both conductor glazes are fired, exposure, development, and etching are performed so that the first and second conductor patterns are mutually aligned. A method for forming a conductor pattern on an insulating substrate, the method comprising forming a continuous conductor pattern.