JP2527865Y2 - Lead frame pickup device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame pickup device.

[0002]

2. Description of the Related Art In the manufacture of a resin-sealed type semiconductor device, after a lead frame is sealed with a resin, unnecessary parts such as gates or runners are removed, and dam bars are removed, leads are bent, and the like, and the product is commercialized. I do. Here, when setting the lead frame after resin encapsulation in a processing machine for lead bending or the like, a predetermined number of resin-encapsulated lead frames are stacked and set in a magazine, and the lead frames are chucked one by one by a lead frame pickup device. And transfer it to the processing machine side.

Incidentally, a resin-sealed lead frame may be warped due to a difference in shrinkage between the sealing resin and the lead frame. When the lead frames are stacked and set as described above, FIG. The lead frames are stacked in a warped state as shown. Recently, the lead frame has many pins, and since many resin mold parts are formed on the lead frame like a matrix frame, the lead frame after resin sealing may be greatly warped. In a stacked state, a considerably warped state may occur.

As shown in FIG. 6, the lead frame pickup device described above holds the stacked lead frames 10 from above with a frame retainer 12, and chucks the lead frames 10 one by one in the width direction in order from the top lead frame 10 to the processing side. Transfer to Frame holder 12 is chuck 1
By holding the lead frame 10 in step 4, the lead frame 10 is sent to the processing side without warping.

[0005]

The lead frame pick-up device described above is designed to insert a claw into a gap formed between the upper and lower portions of the stacked lead frame due to the thickness of the resin sealing portion and chuck the lead frame. When the lead frame is warped in the state, frame holding 1
In some cases, it is not possible to perform chucking properly when 2 is lowered. For example, as shown in FIG. 6, when the central portion is warped in an upwardly convex state, the lead frame cannot be chucked if the position of the chuck 14 is too far outside the lead frame. As shown in the figure, if the stacking is performed in a state where the central portion is depressed, the frame retainer 12 cannot be fully lowered and the lead frame cannot be gripped by the chuck 14. Therefore, in such a case, the position of the chuck 14 can be shifted toward the center or toward the outside according to the product so that the chuck can be chucked.

Further, the frame presser 12 has a function of correcting the warp of the lead frame by pressing the lead frame and holding the lead frame. However, even if the lead frame is pressed while a large number of lead frames are stacked, as shown in FIG. However, the frame retainer 12 only has a bridge-like shape, and cannot accurately chuck the lead frame. For this reason, the number of lead frames accommodated in the magazine and stacked may be limited to a small number, and the lead frame may be warped by the frame holder 12 so that the lead frame can be chucked.

However, it is inefficient to limit the number of lead frames accommodated in a magazine,
It is also troublesome to replace the head for chucking the lead frame according to the product. In addition, when the warpage of the lead frame exceeds a certain level, there is a problem that even if the chuck position is changed, a reliable chuck cannot be performed, and a chuck error easily occurs. In addition,
In the conventional lead frame chuck device, the chuck portion is air-driven by an air cylinder. However, there are problems that many parts are required and an air circuit is required. Therefore, the present invention has been made in order to solve the above-mentioned problem, and the purpose thereof is to be able to reliably chuck the lead frame even when the warpage of the lead frame is considerably large, so that the pickup of the lead frame can be achieved. An object of the present invention is to provide a lead frame pick-up device that can be reliably moved and transferred.

[0008]

The present invention has the following arrangement to achieve the above object. That is, a lead frame in which a predetermined number of lead frames are stacked and set, one by one from the top, is held down from above by a frame holder formed substantially in the same shape as the lead frame, and the lead frame is chucked and picked up in the width direction. In the pickup device, a movable plate is provided so that the front end can be moved upward at both ends in the longitudinal direction of the fixed plate for holding the frame, and the frame holding surface of the fixed plate and the movable plate is always a flat surface. The movable plate is provided so as to urge the front end side of the movable plate to be movable.

[0009]

When the lead frame is pressed from above by the frame holder, both ends of the frame holder are movable. For example, if the center of the lead frame is warped in a concave state, the movable plate Both ends are lifted, and the center part of the frame holder is lowered to a position where it comes into contact with the lead frame, thereby chucking the lead frame accurately. When the central portion of the lead frame is warped upwardly, the central portion of the frame holder contacts the lead frame and chucks.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is an explanatory view showing an embodiment of a lead frame pickup device according to the present invention, in which the pickup device is viewed from the front, and FIG. 2 is a diagram in which a frame holder of the pickup device is viewed from the plane. The lead frame pickup device according to the present invention is characterized in that both end portions of a frame holder for holding the lead frame are movably provided in the vertical direction. In FIG. 1, reference numeral 20 denotes a fixed plate for holding the frame, and reference numerals 22 and 24 denote movable plates movably mounted on the fixed plate 20. Movable plate 2
As shown in FIG. 2, reference numerals 2 and 24 support the base plate at the base end via a shaft 26 so as to be movable upward with respect to the fixed plate 20.
A spring 28 is extrapolated, and is normally urged so that the plate surface of the fixed plate 20 and the plate surfaces of the movable plates 22 and 24 are flush with each other. The biasing direction of the spring 28 is the movable plate 22, 24.
Is a direction in which the front end side of FIG. In the embodiment, the fixed plate 20 and the movable plates 22 and 24 constitute a frame holder.

A support rod 30 is provided upright on the upper surface of the fixed plate 20, and an upper end of the support rod 30 is inserted into a push plate 32. The push plate 32 is driven up and down when picking up the lead frame, and is moved laterally to a position where the lead frame is fed to the processing machine. Numeral 34 denotes a coil spring which is externally inserted into the support rod 30 and resiliently presses between the fixed plate 20 and the push plate 32. Reference numeral 36 denotes a stopper that regulates an interval between the pressing plate 32 and the fixed plate 20.

Reference numeral 40 denotes a chuck mechanism for chucking the lead frame, and a pair of chuck mechanisms are provided on the upper surface of the fixed plate 40 at a predetermined interval. FIG. 3 is an explanatory view of the chuck mechanism viewed from the width direction of the lead frame. Reference numeral 42 denotes a chuck claw that sandwiches the lead frame 10 from both sides in the width direction, reference numeral 44 denotes an air cylinder for opening and closing the chuck claw 42, and reference numeral 46 denotes a spring for urging the chuck claw 42 in the chuck direction. The spring 46 has an L-shaped chuck jaw 42.
Are constantly pushed up to urge the tip of the chuck claw 42 in a direction of shrinking (a direction of gripping the lead frame).

In the lead frame pickup device of the above embodiment, the front end of the frame holder is constituted by the movable plates 22 and 24. Therefore, when the lead frames are stacked in a depressed and warped state at the center, Movable plate 2
The leading ends of the lead frames 2 and 24 come into contact with the ends of the lead frame and are lifted, and the fixing plate 20 is lowered to a position where the fixed plate 20 is in contact with the lead frame at the central portion of the lead frame, whereby the lead frame is gripped. After gripping the lead frame, grip the lead frame with the chuck claws 42 by air drive,
By lifting the frame holder, the movable plate 22,
24 returns to the original flat surface position, corrects the warpage of the lead frame, and transfers it to the processing machine side in a flat state. As shown in FIG. 6, in the case of a warped state in which the center of the lead frame is convex, the distal ends of the movable plates 22 and 24 do not abut the lead frame, and the lead frame is kept flat and the lead frame is kept flat. Chuck.

As described above, according to the lead frame pickup device of the present embodiment, since both ends of the frame holder are configured to be movable, the lead frame can be accurately picked up even when the lead frame is warped in either direction. be able to. In addition, the movable plates 22 and 24 allow a reliable pickup even when the lead frame is considerably warped.

FIGS. 4 and 5 show examples in which the chuck mechanism of the lead frame is not driven by air. In this example, as shown in FIG.
The base of No. 2 is pushed up by the spring 46 and the chuck jaws 42
Is always urged in the chucking direction (the direction in which it contracts), and the pushing rod 50 is provided in contact with the upper surface of the chuck claw 42. The push rod 50 is, as shown in FIG.
The pressing plate 32 presses the base of the chuck claw 42 when the pressing plate 32 presses the frame retainer. According to the lead frame pickup device of the present embodiment, when picking up the lead frame, the pressing plate 32 presses the frame press, and the frame press presses the stacked lead frames, whereby the coil spring 34 is slightly compressed. When the distance between the pushing plate 32 and the fixed plate 20 is reduced, the pushing rod 5
0 presses the base position of the chuck pawl 42, whereby the chuck pawl 42 opens against the urging force of the spring 46. When the push plate 32 attempts to move up to the original position with the chuck pawl 42 opened, the chuck pawl 42 contracts due to the urging force of the spring 46 simultaneously with the upward movement of the push rod 50, and the lead frame 10 is moved from the width direction. Since the frame is held, the frame holder rises while the lead frame is held by the frame holder and the chuck claws 42. Thus, the lead frame pickup operation is performed.

In the apparatus shown in FIGS. 4 and 5, the push plate 3
Since the chuck claw 42 is opened and closed in relation to the operation of the main body portion of the frame holder 2 and the frame holder, the configuration of the chuck mechanism can be simplified as compared with the case where an air circuit or the like is used. In addition, this method has an advantage that the opening / closing amount of the chuck can be easily set by designing the protruding length of the pushing rod 50 and the shape of the shape of the chuck claw 42.

[0017]

According to the lead frame pickup device of the present invention, as described above, regardless of the direction of warpage of the lead frame after resin sealing, even when the amount of warpage of the lead frame is large, it can be accurately performed. The lead frame can be chucked, and chuck errors in transferring the lead frame can be eliminated. In addition, it is not necessary to adjust the chuck or replace the chuck head depending on the product, and the workability is improved.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing one embodiment of a lead frame pickup device.

FIG. 2 is an explanatory diagram of a frame holder viewed from a plane direction.

FIG. 3 is an explanatory view showing a chuck mechanism of the embodiment.

FIG. 4 is an explanatory view showing another example of a chuck mechanism of a lead frame.

FIG. 5 is an explanatory view showing a chuck mechanism.

FIG. 6 is an explanatory diagram of a warped state and a pickup state of the lead frame.

FIG. 7 is an explanatory view of a warped state and a pickup state of the lead frame.

[Explanation of symbols]

 Reference Signs List 10 lead frame 12 frame holder 14 chuck 20 fixed plate 22, 24 movable plate 28 spring 30 support rod 32 push plate 34 coil spring 40 chuck mechanism 42 chuck jaw 46 spring 50 push rod

Claims (1)

(57) [Scope of request for utility model registration] 1. A method for picking up lead frames, wherein a predetermined number of lead frames are stacked and set, one by one in order from the top, by holding the lead frames from above with a frame retainer formed substantially in the same shape as the lead frames, and chucking from the width direction. In the lead frame pickup device, a movable plate is provided at both ends in the longitudinal direction of the fixed plate for holding the frame, the movable plate being provided so that the tip side can be moved upward, and a frame holding surface of the fixed plate and the movable plate is always provided. A lead frame pickup device characterized in that a movable plate is urged at a tip end side of a movable plate so that a flat surface is provided.