JP2527232C - - Google Patents

Info

Publication number
JP2527232C
JP2527232C JP2527232C JP 2527232 C JP2527232 C JP 2527232C JP 2527232 C JP2527232 C JP 2527232C
Authority
JP
Japan
Prior art keywords
wafer
pressure
elastic film
polishing
pipeline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
Other languages
English (en)
Japanese (ja)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Publication date

Links

Family

ID=

Similar Documents

Publication Publication Date Title
JP2527232B2 (ja) 研磨装置
US6764387B1 (en) Control of a multi-chamber carrier head
JP4108023B2 (ja) 圧力コントロールシステム及び研磨装置
KR100874712B1 (ko) 기판 유지 장치
JPH0220135B2 (enrdf_load_stackoverflow)
CN110977750B (zh) 一种压力控制装置和化学机械抛光装置
US20020039879A1 (en) Carrier head with flexible membranes to provide controllable pressure and loading area
KR20180118533A (ko) 누설 검사 방법, 및 이 누설 검사 방법을 실행하기 위한 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체
JP2001230191A (ja) 処理液供給方法及び処理液供給装置
KR20080046737A (ko) 폴리싱방법, 폴리싱장치, 및 폴리싱장치를 제어하기 위한 프로그램을 기록한 컴퓨터로 읽을 수 있는 기록매체
JP2005526373A5 (enrdf_load_stackoverflow)
CN210499744U (zh) 一种压力控制装置和化学机械抛光装置
US20060166611A1 (en) Back pressure control system for CMP and wafer polishing
JP3970561B2 (ja) 基板保持装置及び基板研磨装置
JP3883929B2 (ja) 薄膜形成装置および薄膜形成方法
JP2003173995A (ja) 基板保持装置及びポリッシング装置
JP2002359214A (ja) 半導体基板ホルダおよびこれを備えた半導体基板の研磨装置
JP6353418B2 (ja) 基板吸着方法、トップリングおよび基板研磨装置
KR102070152B1 (ko) 양압 및 음압을 제어하는 밸브모듈 및 이를 이용한 반도체 웨이퍼 또는 글래스의 cmp 공정용 웨이퍼 캐리어 장치
KR20060063340A (ko) 기판 상으로 용액을 공급하기 위한 장치
US6183147B1 (en) Process solution supply system, substrate processing apparatus employing the system, and intermediate storage mechanism employed in the system
JP2527232C (enrdf_load_stackoverflow)
JPH1058315A (ja) 研磨装置及び研磨方法
JP2007048862A (ja) 研磨システム及び研磨方法
JP3561438B2 (ja) 処理液供給システム、これを用いた処理装置、および処理液供給方法