JP2522796Y2 - 半導体素子の取付構造 - Google Patents
半導体素子の取付構造Info
- Publication number
- JP2522796Y2 JP2522796Y2 JP1987103796U JP10379687U JP2522796Y2 JP 2522796 Y2 JP2522796 Y2 JP 2522796Y2 JP 1987103796 U JP1987103796 U JP 1987103796U JP 10379687 U JP10379687 U JP 10379687U JP 2522796 Y2 JP2522796 Y2 JP 2522796Y2
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- chip
- semiconductor element
- wiring pattern
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 29
- 239000000758 substrate Substances 0.000 claims description 64
- 239000011521 glass Substances 0.000 description 49
- 239000004973 liquid crystal related substance Substances 0.000 description 22
- 229910000679 solder Inorganic materials 0.000 description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000013078 crystal Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Landscapes
- Electric Clocks (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987103796U JP2522796Y2 (ja) | 1987-07-08 | 1987-07-08 | 半導体素子の取付構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987103796U JP2522796Y2 (ja) | 1987-07-08 | 1987-07-08 | 半導体素子の取付構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6411538U JPS6411538U (enrdf_load_stackoverflow) | 1989-01-20 |
| JP2522796Y2 true JP2522796Y2 (ja) | 1997-01-16 |
Family
ID=31334946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987103796U Expired - Lifetime JP2522796Y2 (ja) | 1987-07-08 | 1987-07-08 | 半導体素子の取付構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2522796Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2699283B2 (ja) * | 1989-03-23 | 1998-01-19 | カシオ計算機株式会社 | 集積回路チップのボンディング方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5023977A (enrdf_load_stackoverflow) * | 1973-07-04 | 1975-03-14 | ||
| JPS5387170A (en) * | 1977-01-11 | 1978-08-01 | Sharp Corp | Mounting method and mounting device of semiconductor device |
-
1987
- 1987-07-08 JP JP1987103796U patent/JP2522796Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6411538U (enrdf_load_stackoverflow) | 1989-01-20 |
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