JP2519504Y2 - 発光ダイオード - Google Patents
発光ダイオードInfo
- Publication number
- JP2519504Y2 JP2519504Y2 JP1989128382U JP12838289U JP2519504Y2 JP 2519504 Y2 JP2519504 Y2 JP 2519504Y2 JP 1989128382 U JP1989128382 U JP 1989128382U JP 12838289 U JP12838289 U JP 12838289U JP 2519504 Y2 JP2519504 Y2 JP 2519504Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- lead frame
- emitting chip
- base
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989128382U JP2519504Y2 (ja) | 1989-10-31 | 1989-10-31 | 発光ダイオード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989128382U JP2519504Y2 (ja) | 1989-10-31 | 1989-10-31 | 発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0367461U JPH0367461U (US06256357-20010703-M00001.png) | 1991-07-01 |
JP2519504Y2 true JP2519504Y2 (ja) | 1996-12-04 |
Family
ID=31676090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989128382U Expired - Fee Related JP2519504Y2 (ja) | 1989-10-31 | 1989-10-31 | 発光ダイオード |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2519504Y2 (US06256357-20010703-M00001.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9196800B2 (en) | 1996-06-26 | 2015-11-24 | Osram Gmbh | Light-radiating semiconductor component with a luminescence conversion element |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100790347B1 (ko) * | 2006-10-27 | 2008-01-02 | 주식회사 대목환경건설 | 수생식물용 식생블록 |
JP5174630B2 (ja) * | 2008-11-26 | 2013-04-03 | Towa株式会社 | 光学成形品の圧縮成形方法 |
KR102204273B1 (ko) | 2013-06-28 | 2021-01-19 | 루미리즈 홀딩 비.브이. | 발광 다이오드 장치 |
CN105340090B (zh) * | 2013-06-28 | 2018-11-09 | 亮锐控股有限公司 | 发光二极管器件 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS508884U (US06256357-20010703-M00001.png) * | 1973-05-18 | 1975-01-29 | ||
JPS587364U (ja) * | 1981-07-07 | 1983-01-18 | スタンレー電気株式会社 | 発光ダイオ−ドランプ |
JPS6315483A (ja) * | 1986-07-07 | 1988-01-22 | Toyoda Gosei Co Ltd | 発光ダイオ−ド用リ−ドフレ−ム |
-
1989
- 1989-10-31 JP JP1989128382U patent/JP2519504Y2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9196800B2 (en) | 1996-06-26 | 2015-11-24 | Osram Gmbh | Light-radiating semiconductor component with a luminescence conversion element |
Also Published As
Publication number | Publication date |
---|---|
JPH0367461U (US06256357-20010703-M00001.png) | 1991-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |