JP2513375Y2 - Processing liquid circulation device in substrate processing equipment using high-viscosity processing liquid - Google Patents

Processing liquid circulation device in substrate processing equipment using high-viscosity processing liquid

Info

Publication number
JP2513375Y2
JP2513375Y2 JP1989026692U JP2669289U JP2513375Y2 JP 2513375 Y2 JP2513375 Y2 JP 2513375Y2 JP 1989026692 U JP1989026692 U JP 1989026692U JP 2669289 U JP2669289 U JP 2669289U JP 2513375 Y2 JP2513375 Y2 JP 2513375Y2
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JP
Japan
Prior art keywords
filter
processing liquid
liquid
flow path
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989026692U
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Japanese (ja)
Other versions
JPH02112303U (en
Inventor
敏朗 廣江
敏行 大崎
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Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
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Priority to JP1989026692U priority Critical patent/JP2513375Y2/en
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Application granted granted Critical
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Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、処理槽内の処理液に半導体基板等の被処理
基板を浸漬して処理を行う浸漬処理装置において、処理
液を、液中に浮遊する粒子等を濾過するフィルタを通し
て循環させるようにした処理液循環装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an immersion treatment apparatus for treating a substrate such as a semiconductor substrate by immersing the treatment liquid in the treatment liquid in a treatment tank. The present invention relates to a treatment liquid circulating device that circulates particles and the like floating in a filter through a filter.

〔従来の技術〕[Conventional technology]

たとえば、リン酸(H3PO4)、硫酸(H2SO4)等の処理
液を使用して、半導体基板のエッチング処理、洗浄処理
あるいはレジスト剥離処理等をする装置は、第4図に示
すように構成されている。
For example, an apparatus for performing etching treatment, cleaning treatment, resist stripping treatment or the like on a semiconductor substrate using a treatment liquid such as phosphoric acid (H 3 PO 4 ) or sulfuric acid (H 2 SO 4 ) is shown in FIG. Is configured.

これは、処理槽(1)に収容した処理液(A)の液中
に、被処理基板(B)を浸漬して処理を行うもので、処
理槽(1)の適所には、処理液(A)を加熱するための
ヒーター(2)が設置してある。
This is for treating the substrate (B) by immersing the substrate (B) in the treatment liquid (A) contained in the treatment bath (1). A heater (2) for heating A) is installed.

処理液(A)は、管(3)、ポンプ(4)、管
(5)、フィルタ(6)及び管(7)で構成される流路
を通って、矢印で示すように処理槽(1)に循環し、フ
ィルタ(6)により液中の浮遊粒子を除去するようにな
つている。
The treatment liquid (A) passes through a flow path composed of a pipe (3), a pump (4), a pipe (5), a filter (6) and a pipe (7), and is treated by a treatment tank (1) as indicated by an arrow. ), And suspended particles in the liquid are removed by the filter (6).

〔考案が解決しようとする課題〕[Problems to be solved by the device]

処理槽(1)内の液温を均一に昇温保持するために
は、槽内の処理液を適宜に撹拌することが必要であり、
ポンプ(4)によつて充分な循環流量を保持することに
より、所要の撹拌度を得ている。しかし、リン酸や硫酸
等の処理液は、低温では粘度が高く、高温になるにした
がって粘度が低下する性質がある。たとえば、第3図の
グラフに示すように、濃度85%(wt)のリン酸水溶液の
粘度は、液温が100℃では6.2c.p.であるが、20℃では4
7.3c.p.となる。また、濃度90%(wt)の硫酸水溶液の
粘度は、80℃では5.0c.p.、20℃では24.0c.p.となる。
すなわち、これらの処理液は、高温時には高い流動性を
持つが、低温時には粘度が増加して流れにくい性質があ
る。
In order to keep the temperature of the liquid in the treatment tank (1) uniform, it is necessary to appropriately stir the treatment liquid in the tank.
By maintaining a sufficient circulation flow rate by the pump (4), the required degree of stirring is obtained. However, the treatment liquid such as phosphoric acid or sulfuric acid has a property that the viscosity is high at low temperature and the viscosity decreases as the temperature rises. For example, as shown in the graph of FIG. 3, the viscosity of an aqueous solution of phosphoric acid having a concentration of 85% (wt) is 6.2 cp at a liquid temperature of 100 ° C.
It will be 7.3 cp. Also, the viscosity of a 90% (wt) concentration sulfuric acid aqueous solution is 5.0 cp at 80 ° C and 24.0 cp at 20 ° C.
That is, these treatment liquids have high fluidity at high temperatures, but have the property of increasing viscosity at low temperatures and making it difficult to flow.

このために、作業開始直後の液温が低い時期にあって
は、フィルタ(6)における濾過抵抗が大きいため、循
環流量がきわめて小さく、処理槽(1)内の処理液
(A)がほとんど撹拌されず、液温を所定値まで上昇さ
せるには、時間がかかる。
For this reason, at the time when the liquid temperature is low immediately after the start of work, the filtration flow rate in the filter (6) is large, so the circulation flow rate is extremely small, and the treatment liquid (A) in the treatment tank (1) is almost agitated. However, it takes time to raise the liquid temperature to a predetermined value.

そこで、本考案者等は、フィルタ(6)の入口側もし
くは管(5)の中間を始端として主流路から分岐し、処
理槽(1)へ到るバイパス流路を付設して、作業開始直
後の液温が低い時期や、フイルタ(6)の濾過抵抗の増
大による循環流量の低下時に、バイパス流路を通して処
理液(A)を処理槽(1)へ戻す構成を考えた。この構
成において、バイパス流路への処理液(A)の流通を制
御するために、バイパス流路に設置したバルブを開閉す
る操作は、最も簡単には手動で行うこともできるが、手
動操作の場合、液温については、ヒーター(2)に通電
した後、作業者が液温の上昇度を監視していて、処理液
がフイルタ(6)を充分に通過できる温度に達した時
に、バルブを閉じるという操作、あるいはまた、作業者
が管(5)の内圧を監視して、それが許容値を超える場
合には、バルブを開くという操作になり、いずれの場合
も、液温及び管(5)の内圧を常に監視している必要が
あり、煩わしい手間がかかって、非能率である。
Therefore, the inventors of the present invention have installed a bypass flow path branching from the main flow path starting from the inlet side of the filter (6) or the middle of the pipe (5) and reaching the processing tank (1) immediately after the start of work. A structure was considered in which the treatment liquid (A) is returned to the treatment tank (1) through the bypass flow passage when the liquid temperature of the liquid is low or when the circulation flow rate decreases due to the increase of the filtration resistance of the filter (6). In this configuration, in order to control the flow of the treatment liquid (A) to the bypass flow passage, the operation of opening and closing the valve installed in the bypass flow passage can be most easily performed manually. In this case, regarding the liquid temperature, after energizing the heater (2), an operator monitors the degree of increase in the liquid temperature, and when the processing liquid reaches a temperature at which it can sufficiently pass through the filter (6), the valve is turned on. The operation of closing, or the operator monitors the internal pressure of the pipe (5), and when it exceeds the allowable value, it is the operation of opening the valve. In either case, the liquid temperature and the pipe (5) ) It is necessary to constantly monitor the internal pressure, which is troublesome and inefficient.

このバルブ開閉操作を自動的に行う手段として、処理
槽(1)内に液温検知手段を付設し、また、バルブに開
閉駆動手段を付設して、液温が所要レベルまで上昇した
ときには、液温検出手段からの信号によりバルブを閉じ
る構成が考えられるが、構成が複雑化する難点がある。
As a means for automatically performing this valve opening / closing operation, a liquid temperature detecting means is attached in the treatment tank (1), and an opening / closing driving means is attached to the valve so that the liquid temperature rises to a required level. A configuration in which the valve is closed by a signal from the temperature detecting means is conceivable, but there is a drawback that the configuration becomes complicated.

本考案は、簡易な構成の手段により、液温の状態に対
応するようにした処理液循環装置に関する。
The present invention relates to a processing liquid circulating device adapted to cope with a liquid temperature state by means of a simple structure.

〔課題を解決するための手段〕[Means for solving the problem]

常温で高粘度の処理液を、所要温度に昇温させ、ポン
プにより、濾過用のフィルタを通る主流路を通って処理
槽に循環させ、該処理槽に基板を浸漬して処理する基板
処理装置における処理液循環装置において、 フィルタの入口側もしくはポンプとフィルタの入口側
との間において、主流路から分岐し、ポンプにより処理
液が吸入された槽に、フィルタを通過することなしに処
理液を戻すバイパス流路を付設し、かつこのバイパス流
路の適所に、バイパス流路に加わる流体圧が所定値以下
である場合には閉止し、該所定値を超えた場合には開放
されるリリーフ弁を設けてある。
Substrate processing apparatus that heats a high-viscosity processing liquid at room temperature to a required temperature, circulates it in a processing tank through a main flow path through a filter for filtration by a pump, and immerses a substrate in the processing tank for processing In the treatment liquid circulation device in step 1, the treatment liquid is branched into the tank into which the treatment liquid is sucked by the pump and which is branched from the main flow path between the inlet side of the filter or the inlet side of the filter without passing through the filter. A relief valve provided with a bypass flow passage for returning, and closed at a proper position of the bypass flow passage when the fluid pressure applied to the bypass flow passage is below a predetermined value, and opened when the fluid pressure exceeds the predetermined value. Is provided.

〔作用〕[Action]

処理液の液温が低くて粘度が高い場合には、フィルタ
の濾過抵抗が大きくて、処理液が通過しにくくなり、バ
イパス流路に加わる流体圧が大きくなる。そこで、バイ
パス流路に加わる流体圧のレベルに応じて開閉するリリ
ーフ弁を設けることにより、流体圧が諸低値を超えた場
合には、リリーフ弁が開いて、処理液がバイパス流路側
に循環し、一方、処理液の液温が所要レベルに上昇して
粘度が低下し、あるいはフィルタに目詰まりがなく、濾
過抵抗が小さくて、バイパス流路に加わる流体圧が所定
値より低い状態では、リリーフ弁が閉止して、処理液が
主流路側に循環する。
When the liquid temperature of the treatment liquid is low and the viscosity is high, the filtration resistance of the filter is large, the treatment liquid is less likely to pass through, and the fluid pressure applied to the bypass flow passage is increased. Therefore, by providing a relief valve that opens and closes according to the level of fluid pressure applied to the bypass flow path, when the fluid pressure exceeds various low values, the relief valve opens and the processing liquid circulates to the bypass flow path side. On the other hand, when the temperature of the treatment liquid rises to a required level and the viscosity decreases, or the filter is not clogged, the filtration resistance is small, and the fluid pressure applied to the bypass flow passage is lower than a predetermined value, The relief valve is closed and the processing liquid circulates to the main flow path side.

〔実施例〕〔Example〕

第1図は、本考案の処理液循環装置の1実施例を示す
概略図である。
FIG. 1 is a schematic view showing one embodiment of the processing liquid circulation apparatus of the present invention.

この装置は、第4図示従来装置に準じて、処理槽(1
1)に収容した処理液(A)に被処理基板(B)を浸漬
して処理を行うもので、処理槽(11)の適所に処理液
(A)を加熱するヒーター(12)を設置してある。
This equipment is based on the conventional equipment shown in Fig. 4 and is based on the treatment tank (1
The substrate (B) to be processed is immersed in the treatment liquid (A) housed in 1) for treatment. A heater (12) for heating the treatment liquid (A) is installed at an appropriate place in the treatment tank (11). There is.

処理液(A)は、管(13)、ポンプ(14)、管(1
5)、フィルタ(16)及び管(17)で構成される主流路
を通って、矢印で示すように処理槽(11)に循環する。
The processing liquid (A) is used for the pipe (13), pump (14), and pipe (1).
5), the filter (16) and the pipe (17) pass through the main flow path to circulate in the processing tank (11) as shown by the arrow.

フィルタ(16)の入口側、あるいは管(15)の中間か
ら分岐して処理槽(11)へ到るバイパス流路は、管(1
8)、リリーフ弁(19)、管(20)で構成される。リリ
ーフ弁(19)は、弁体をスプリングにより弁座に圧着し
て閉止し、管(18)に加わる流体圧がスプリングによる
弁体の圧着力を超える場合には、弁体が弁座から離間し
た開放されるようにしたスプリング弁、あるいは同様な
構成で、スプリングに代えて圧縮空気圧により弁体を圧
着するエア作動弁等を適用し、弁体が弁座に圧着される
圧力を調節するスプリング押圧力あるいは空気圧等を、
後述する所要値に設定してある。
The bypass flow path that branches from the inlet side of the filter (16) or the middle of the pipe (15) to the treatment tank (11) is
8), relief valve (19) and pipe (20). The relief valve (19) closes the valve body by pressing it against the valve seat with a spring, and when the fluid pressure applied to the pipe (18) exceeds the pressure force of the valve body due to the spring, the valve body separates from the valve seat. A spring valve that is opened, or a spring that adjusts the pressure at which the valve body is crimped to the valve seat by applying an air actuated valve that crimps the valve body by compressed air pressure instead of the spring with a similar structure Pressing force or air pressure,
It is set to the required value described later.

ヒーター(12)とポンプ(14)に通電して、装置を起
動すると、処理液(A)の温度が低い初期段階では、前
述のように処理液(A)の粘度が高いために、フィルタ
(16)における濾過抵抗が大きくて処理液(A)の通過
が阻まれ、バイパス流路側にフィルタ(16)の濾過抵抗
値に対応する流体圧が印加される。
When the heater (12) and the pump (14) are energized and the apparatus is started, in the initial stage where the temperature of the treatment liquid (A) is low, the filter ( The filtration resistance in 16) is large and the passage of the treatment liquid (A) is blocked, and a fluid pressure corresponding to the filtration resistance value of the filter (16) is applied to the bypass flow path side.

この流体圧が、リリーフ弁(19)に印加されると、弁
体が弁座から離間してリリーフ弁(19)が開放されて、
処理液(A)は、主としてバイパス流路を通って循環す
る。
When this fluid pressure is applied to the relief valve (19), the valve element is separated from the valve seat, the relief valve (19) is opened,
The treatment liquid (A) circulates mainly through the bypass passage.

時間の経過にともない、処理液(A)の温度が上昇し
て、その粘度が低下すると、フイルタ(16)における濾
過抵抗が減少し、処理液(A)のほとんどがフィルタ
(16)を通る主流路を通って循環するようになり、それ
にともなって、バイパス流路に印加される流体圧が漸次
低下する。
When the temperature of the treatment liquid (A) rises and its viscosity decreases with the passage of time, the filtration resistance in the filter (16) decreases, and most of the treatment liquid (A) flows through the filter (16). As it circulates through the passage, the fluid pressure applied to the bypass passage gradually decreases accordingly.

バイパス流路の流体圧の低下に応じて、リリーフ弁
(19)は次第に閉止状態に近づき、処理液(A)の温度
が所定のレベルまで到達したときに完全に閉止して、バ
イパス流路側の循環を停止させる。その後、処理液
(A)は、全量がフィルタ(16)を通過する主流路を通
って循環する。
The relief valve (19) gradually approaches the closed state in response to the decrease in the fluid pressure in the bypass flow passage, and is completely closed when the temperature of the treatment liquid (A) reaches a predetermined level. Stop circulation. After that, the treatment liquid (A) circulates through the main flow path, the whole amount of which passes through the filter (16).

すなわち、リリーフ弁(19)における弁体を弁座に圧
着するスプリングあるいは圧縮空気等による圧着力を適
切に調整して、所定温度の処理液(A)が通過する際の
フィルタ(16)の濾過抵抗に基づく流体圧に相当する値
に設定することにより、温度が低い期間には処理液
(A)をバイパス流路側に循環させ、所定温度に達した
後は、処理液(A)の全量を、フィルタ(16)により浮
遊粒子を除去しつつ、主流路側に循環させることができ
る。
That is, the pressure of the spring in the relief valve (19) for crimping the valve body to the valve seat, or the crimping force of compressed air or the like is appropriately adjusted to filter the filter (16) when the treatment liquid (A) at a predetermined temperature passes through. By setting the value corresponding to the fluid pressure based on the resistance, the treatment liquid (A) is circulated to the bypass flow passage side during the period when the temperature is low, and after reaching the predetermined temperature, the total amount of the treatment liquid (A) is changed. It is possible to circulate on the main flow path side while removing suspended particles by the filter (16).

また、処理液(A)が所定温度に達して、主流路側に
循環している状態で、フイルタ(16)の目詰まりや気泡
の累積等の異常状態が発生し、フィルタ(16)の濾過抵
抗が大きくなつた場合には、リリーフ弁(19)に印加さ
れる流体圧が設定値よりも高くなるので、弁体が弁座か
ら離間してリリーフ弁(19)が開放され、少なくとも一
部の処理液(A)がバイパス流路を通って循環する。こ
れにより、フイルタ(16)の目詰まりや気泡の累積等の
異常状態に際して、ポンプ(14)からフィルタ(16)の
間の管路に過大な圧力がかかって、継手部が破損する等
の事故を防止することができる。
Further, when the treatment liquid (A) reaches a predetermined temperature and circulates on the main flow path side, an abnormal state such as clogging of the filter (16) or accumulation of bubbles occurs, and the filtration resistance of the filter (16) is increased. Is increased, the fluid pressure applied to the relief valve (19) becomes higher than the set value, so that the valve element is separated from the valve seat, the relief valve (19) is opened, and at least a part of the relief valve (19) is opened. The treatment liquid (A) circulates through the bypass channel. As a result, in the event of abnormal conditions such as clogging of the filter (16) or accumulation of air bubbles, excessive pressure is applied to the pipe line between the pump (14) and the filter (16), and the joint part is damaged. Can be prevented.

次に第2図示装置は、循環装置としての構成は第1図
示装置と同様であり、対応する部材を同一符号で示して
ある。
Next, the second illustrated device has the same structure as the circulation device as the first illustrated device, and corresponding members are designated by the same reference numerals.

第2図示装置は、処理槽(11)にオーバーフロー槽
(21)を付設し、処理槽(11)との間に、上端の高さを
外壁よりも低くした隔壁(22)を設けてある。
In the second illustrated apparatus, an overflow tank (21) is attached to the treatment tank (11), and a partition wall (22) having an upper end lower than the outer wall is provided between the overflow tank (21) and the treatment tank (11).

循環装置の配管として、吸入側の管(13)は、オーバ
ーフロー槽(21)に配置され、吐出側の主流路側の管
(17)は処理槽(11)に、バイパス流路側の管(20)は
オーバーフロー槽(21)に、処理液(A)を循環させる
ように配置する。
As the piping of the circulation device, the suction side pipe (13) is arranged in the overflow tank (21), the discharge side main flow path side pipe (17) is in the processing tank (11), and the bypass flow path side pipe (20). Is disposed in the overflow tank (21) so as to circulate the treatment liquid (A).

第2図示装置では、処理液(A)内に生じる各種浮遊
粒子のフィルタ(16)への滞留量が大きくなったとか、
あるいは処理液(A)内に発生した気泡がフィルタ(1
6)の入口側に累積した等の理由で、濾過抵抗が異常に
大きくなつた場合に、リリーフ弁(19)が開放されて、
処理液(A)がオーバーフロー槽(21)に対して循環す
るように構成してある。
In the second illustrated device, the amount of various suspended particles generated in the treatment liquid (A) in the filter (16) is increased,
Alternatively, the bubbles generated in the processing liquid (A) are
When the filtration resistance becomes abnormally large due to accumulation on the inlet side of 6), the relief valve (19) is opened,
The processing liquid (A) is configured to circulate in the overflow tank (21).

これは、処理液(A)内の浮遊粒子ないし気泡が除去
されない状態で、処理槽(11)に注入されることに基づ
くトラブルを防ぐためで、処理槽(11)には、フイルタ
(16)で濾過された処理液(A)のみを循環させるよう
にしたものである。
This is to prevent troubles due to being injected into the treatment tank (11) in a state where suspended particles or bubbles in the treatment liquid (A) are not removed. The treatment tank (11) has a filter (16). Only the treatment liquid (A) filtered in (1) is circulated.

なお、第1図又は第2図示の実施例においては、ヒー
ター(12)を処理槽(11)内に配置しているが、主流路
側の管(15)又は(17)に付設するようにしてもよい。
Although the heater (12) is arranged in the treatment tank (11) in the embodiment shown in FIG. 1 or 2, it may be attached to the pipe (15) or (17) on the main flow path side. Good.

〔考案の効果〕[Effect of device]

起動直後、処理液の粘度が高くて充分な循環流量が得
られない期間には、処理液をフィルタを通らないバイパ
ス流路側に循環させ、処理液の粘度が低下した時点で、
自動的に主流路側に切り替えて循環させることができ
る。
Immediately after startup, during a period when the viscosity of the treatment liquid is high and a sufficient circulation flow rate cannot be obtained, the treatment liquid is circulated to the bypass passage side that does not pass through the filter, and when the viscosity of the treatment liquid decreases,
It is possible to automatically switch to the main flow path side for circulation.

【図面の簡単な説明】[Brief description of drawings]

第1図及び第2図はそれぞれ本考案の1実施例装置の構
成を示す概略図、第3図は処理液の温度と粘度の関係を
例示するグラフ、第4図は従来の処理液循環装置の構成
を示す概略図である。 (1)……処理槽、(2)……ヒーター、(4)……ポ
ンプ、(6)……フィルタ、(11)……処理槽、(12)
……ヒーター、(14)……ポンプ、(16)……フィル
タ、(19)……リリーフ弁、(21)……オーバーフロー
槽、(22)……隔壁。
FIG. 1 and FIG. 2 are schematic diagrams showing the constitution of the apparatus of one embodiment of the present invention, FIG. 3 is a graph illustrating the relationship between the temperature and viscosity of the processing liquid, and FIG. 4 is a conventional processing liquid circulating device. It is a schematic diagram showing a configuration of. (1) …… Treatment tank, (2) …… Heater, (4) …… Pump, (6) …… Filter, (11) …… Treatment tank, (12)
...... Heater, (14) …… Pump, (16) …… Filter, (19) …… Relief valve, (21) …… Overflow tank, (22) …… Partition wall.

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of utility model registration request] 【請求項1】常温で高粘度の処理液を、所要温度に昇温
させ、ポンプにより、濾過用のフィルタを通る主流路を
通って処理槽に循環させ、該処理槽に基板を浸漬して処
理する基板処理装置における処理液循環装置において、 フィルタの入口側もしくはポンプとフィルタの入口側と
の間において、主流路から分岐し、ポンプにより処理液
が吸入された槽に、フィルタを通過することなしに処理
液を戻すバイパス流路を付設し、かつこのバイパス流路
の適所に、バイパス流路に加わる流体圧が所定値以下で
ある場合には閉止し、該所定値を超えた場合には開放さ
れるリリーフ弁を設けたことを特徴とする、高粘度処理
液による基板処理装置における処理液循環装置。
1. A treatment liquid having a high viscosity at room temperature is heated to a required temperature, circulated in a treatment tank by a pump through a main channel passing through a filter for filtration, and a substrate is immersed in the treatment tank. In the processing liquid circulation device of the substrate processing apparatus for processing, the filter should pass through the tank into which the processing liquid is sucked by the pump, branching from the main flow path between the filter inlet side or the pump and filter inlet side. If a bypass flow path for returning the processing liquid is provided, and if the fluid pressure applied to the bypass flow path is below a predetermined value, the bypass flow path is closed at a proper position, and if the flow pressure exceeds the predetermined value. A processing liquid circulating device in a substrate processing device using a high-viscosity processing liquid, comprising a relief valve that is opened.
JP1989026692U 1988-10-28 1989-03-10 Processing liquid circulation device in substrate processing equipment using high-viscosity processing liquid Expired - Lifetime JP2513375Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989026692U JP2513375Y2 (en) 1988-10-28 1989-03-10 Processing liquid circulation device in substrate processing equipment using high-viscosity processing liquid

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP27076188 1988-10-28
JP63-270761 1988-10-28
JP1989026692U JP2513375Y2 (en) 1988-10-28 1989-03-10 Processing liquid circulation device in substrate processing equipment using high-viscosity processing liquid

Publications (2)

Publication Number Publication Date
JPH02112303U JPH02112303U (en) 1990-09-07
JP2513375Y2 true JP2513375Y2 (en) 1996-10-02

Family

ID=31497357

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Application Number Title Priority Date Filing Date
JP1989026692U Expired - Lifetime JP2513375Y2 (en) 1988-10-28 1989-03-10 Processing liquid circulation device in substrate processing equipment using high-viscosity processing liquid

Country Status (1)

Country Link
JP (1) JP2513375Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812854B2 (en) * 1993-01-22 1996-02-07 日本電気株式会社 Wet etching equipment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4879357A (en) * 1972-01-27 1973-10-24
JPS5347421B2 (en) * 1977-05-16 1978-12-21

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5347421U (en) * 1976-09-27 1978-04-21
JPS5676013U (en) * 1979-11-16 1981-06-20

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4879357A (en) * 1972-01-27 1973-10-24
JPS5347421B2 (en) * 1977-05-16 1978-12-21

Also Published As

Publication number Publication date
JPH02112303U (en) 1990-09-07

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