JP2510569Y2 - 半導体パッケ―ジのリ―ドピン保護用治具 - Google Patents

半導体パッケ―ジのリ―ドピン保護用治具

Info

Publication number
JP2510569Y2
JP2510569Y2 JP1989101355U JP10135589U JP2510569Y2 JP 2510569 Y2 JP2510569 Y2 JP 2510569Y2 JP 1989101355 U JP1989101355 U JP 1989101355U JP 10135589 U JP10135589 U JP 10135589U JP 2510569 Y2 JP2510569 Y2 JP 2510569Y2
Authority
JP
Japan
Prior art keywords
jig
pin
lead pin
package
semiconductor package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989101355U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0339854U (enExample
Inventor
孝男 土井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1989101355U priority Critical patent/JP2510569Y2/ja
Publication of JPH0339854U publication Critical patent/JPH0339854U/ja
Application granted granted Critical
Publication of JP2510569Y2 publication Critical patent/JP2510569Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1989101355U 1989-08-30 1989-08-30 半導体パッケ―ジのリ―ドピン保護用治具 Expired - Lifetime JP2510569Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989101355U JP2510569Y2 (ja) 1989-08-30 1989-08-30 半導体パッケ―ジのリ―ドピン保護用治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989101355U JP2510569Y2 (ja) 1989-08-30 1989-08-30 半導体パッケ―ジのリ―ドピン保護用治具

Publications (2)

Publication Number Publication Date
JPH0339854U JPH0339854U (enExample) 1991-04-17
JP2510569Y2 true JP2510569Y2 (ja) 1996-09-11

Family

ID=31650313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989101355U Expired - Lifetime JP2510569Y2 (ja) 1989-08-30 1989-08-30 半導体パッケ―ジのリ―ドピン保護用治具

Country Status (1)

Country Link
JP (1) JP2510569Y2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4802312B2 (ja) * 2005-01-18 2011-10-26 ジクス工業株式会社 セラミック治具及びその製造方法
US7887899B2 (en) 2005-08-25 2011-02-15 Sumitomo Electric Industries, Ltd. Anisotropic conductive sheet, production method thereof, connection method and inspection method
JP6930317B2 (ja) * 2017-09-13 2021-09-01 富士電機株式会社 端子ピンの接合方法及び接合用冶具
CN118969757B (zh) * 2024-07-31 2025-10-14 杭州熙驰科技有限公司 一种集成电路封装导线支架

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62274646A (ja) * 1986-05-22 1987-11-28 Nec Corp 端子矯正治具
JPS6447050U (enExample) * 1987-09-16 1989-03-23

Also Published As

Publication number Publication date
JPH0339854U (enExample) 1991-04-17

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