JP2506695Y2 - プリント基板冷却装置 - Google Patents

プリント基板冷却装置

Info

Publication number
JP2506695Y2
JP2506695Y2 JP1990083011U JP8301190U JP2506695Y2 JP 2506695 Y2 JP2506695 Y2 JP 2506695Y2 JP 1990083011 U JP1990083011 U JP 1990083011U JP 8301190 U JP8301190 U JP 8301190U JP 2506695 Y2 JP2506695 Y2 JP 2506695Y2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
air
soldering
solder bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990083011U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0440569U (cs
Inventor
真一 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1990083011U priority Critical patent/JP2506695Y2/ja
Publication of JPH0440569U publication Critical patent/JPH0440569U/ja
Application granted granted Critical
Publication of JP2506695Y2 publication Critical patent/JP2506695Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1990083011U 1990-08-04 1990-08-04 プリント基板冷却装置 Expired - Lifetime JP2506695Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990083011U JP2506695Y2 (ja) 1990-08-04 1990-08-04 プリント基板冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990083011U JP2506695Y2 (ja) 1990-08-04 1990-08-04 プリント基板冷却装置

Publications (2)

Publication Number Publication Date
JPH0440569U JPH0440569U (cs) 1992-04-07
JP2506695Y2 true JP2506695Y2 (ja) 1996-08-14

Family

ID=31630323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990083011U Expired - Lifetime JP2506695Y2 (ja) 1990-08-04 1990-08-04 プリント基板冷却装置

Country Status (1)

Country Link
JP (1) JP2506695Y2 (cs)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1602779A (en) * 1977-12-02 1981-11-18 Cooper Ind Inc Methods and apparatus for mass soldering of printed circuit boards
JPH0783939B2 (ja) * 1986-12-11 1995-09-13 株式会社東芝 半田付け装置
JPH0751273B2 (ja) * 1988-01-13 1995-06-05 松下電器産業株式会社 基板加熱装置

Also Published As

Publication number Publication date
JPH0440569U (cs) 1992-04-07

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