JP2503360Y2 - 樹脂封止型半導体集積回路装置 - Google Patents

樹脂封止型半導体集積回路装置

Info

Publication number
JP2503360Y2
JP2503360Y2 JP1989078063U JP7806389U JP2503360Y2 JP 2503360 Y2 JP2503360 Y2 JP 2503360Y2 JP 1989078063 U JP1989078063 U JP 1989078063U JP 7806389 U JP7806389 U JP 7806389U JP 2503360 Y2 JP2503360 Y2 JP 2503360Y2
Authority
JP
Japan
Prior art keywords
area
resin
package
small area
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989078063U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0317644U (US07576130-20090818-C00114.png
Inventor
耕三 小松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP1989078063U priority Critical patent/JP2503360Y2/ja
Publication of JPH0317644U publication Critical patent/JPH0317644U/ja
Application granted granted Critical
Publication of JP2503360Y2 publication Critical patent/JP2503360Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1989078063U 1989-06-30 1989-06-30 樹脂封止型半導体集積回路装置 Expired - Lifetime JP2503360Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989078063U JP2503360Y2 (ja) 1989-06-30 1989-06-30 樹脂封止型半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989078063U JP2503360Y2 (ja) 1989-06-30 1989-06-30 樹脂封止型半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPH0317644U JPH0317644U (US07576130-20090818-C00114.png) 1991-02-21
JP2503360Y2 true JP2503360Y2 (ja) 1996-06-26

Family

ID=31621009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989078063U Expired - Lifetime JP2503360Y2 (ja) 1989-06-30 1989-06-30 樹脂封止型半導体集積回路装置

Country Status (1)

Country Link
JP (1) JP2503360Y2 (US07576130-20090818-C00114.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04140717A (ja) * 1990-10-01 1992-05-14 Semiconductor Energy Lab Co Ltd 液晶装置
US8440509B2 (en) 1997-11-27 2013-05-14 Semiconductor Energy Laboratory Co., Ltd. Method for producing a semiconductor device by etch back process

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5458476B2 (ja) * 2007-05-23 2014-04-02 株式会社デンソー モールドパッケージおよびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189659A (ja) * 1983-04-13 1984-10-27 Matsushita Electronics Corp 半導体装置
JPS6045447U (ja) * 1983-09-07 1985-03-30 日本電気株式会社 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04140717A (ja) * 1990-10-01 1992-05-14 Semiconductor Energy Lab Co Ltd 液晶装置
US8440509B2 (en) 1997-11-27 2013-05-14 Semiconductor Energy Laboratory Co., Ltd. Method for producing a semiconductor device by etch back process

Also Published As

Publication number Publication date
JPH0317644U (US07576130-20090818-C00114.png) 1991-02-21

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