JP2503301Y2 - ウェ―ハ立替装置 - Google Patents
ウェ―ハ立替装置Info
- Publication number
- JP2503301Y2 JP2503301Y2 JP8967689U JP8967689U JP2503301Y2 JP 2503301 Y2 JP2503301 Y2 JP 2503301Y2 JP 8967689 U JP8967689 U JP 8967689U JP 8967689 U JP8967689 U JP 8967689U JP 2503301 Y2 JP2503301 Y2 JP 2503301Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- boat
- pusher
- holder
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 210000000078 claw Anatomy 0.000 claims description 18
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 63
- 238000010586 diagram Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8967689U JP2503301Y2 (ja) | 1989-07-28 | 1989-07-28 | ウェ―ハ立替装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8967689U JP2503301Y2 (ja) | 1989-07-28 | 1989-07-28 | ウェ―ハ立替装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0328735U JPH0328735U (enrdf_load_stackoverflow) | 1991-03-22 |
JP2503301Y2 true JP2503301Y2 (ja) | 1996-06-26 |
Family
ID=31639247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8967689U Expired - Lifetime JP2503301Y2 (ja) | 1989-07-28 | 1989-07-28 | ウェ―ハ立替装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2503301Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8813338B2 (en) * | 2011-03-11 | 2014-08-26 | Varian Semiconductor Equipment Associates, Inc. | Workpiece alignment device |
-
1989
- 1989-07-28 JP JP8967689U patent/JP2503301Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0328735U (enrdf_load_stackoverflow) | 1991-03-22 |
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