JP2025515282A5 - - Google Patents
Info
- Publication number
- JP2025515282A5 JP2025515282A5 JP2024561754A JP2024561754A JP2025515282A5 JP 2025515282 A5 JP2025515282 A5 JP 2025515282A5 JP 2024561754 A JP2024561754 A JP 2024561754A JP 2024561754 A JP2024561754 A JP 2024561754A JP 2025515282 A5 JP2025515282 A5 JP 2025515282A5
- Authority
- JP
- Japan
Links
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263332649P | 2022-04-19 | 2022-04-19 | |
| US63/332,649 | 2022-04-19 | ||
| US202263342039P | 2022-05-13 | 2022-05-13 | |
| US63/342,039 | 2022-05-13 | ||
| US202263375310P | 2022-09-12 | 2022-09-12 | |
| US63/375,310 | 2022-09-12 | ||
| US202263383236P | 2022-11-10 | 2022-11-10 | |
| US63/383,236 | 2022-11-10 | ||
| PCT/US2023/019000 WO2023205184A1 (en) | 2022-04-19 | 2023-04-18 | Molybdenum integration and void-free fill |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2025515282A JP2025515282A (ja) | 2025-05-14 |
| JP2025515282A5 true JP2025515282A5 (https=) | 2026-04-22 |
| JPWO2023205184A5 JPWO2023205184A5 (https=) | 2026-04-22 |
Family
ID=88420458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024561754A Pending JP2025515282A (ja) | 2022-04-19 | 2023-04-18 | モリブデン集積およびボイドフリー充填 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250259894A1 (https=) |
| EP (1) | EP4511875A1 (https=) |
| JP (1) | JP2025515282A (https=) |
| KR (1) | KR20250005319A (https=) |
| CN (1) | CN119404303A (https=) |
| TW (1) | TW202412178A (https=) |
| WO (1) | WO2023205184A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7686761B2 (ja) | 2021-02-23 | 2025-06-02 | ラム リサーチ コーポレーション | ３ｄ－ｎａｎｄ用の酸化物表面上へのモリブデン膜の堆積 |
| WO2022221210A1 (en) | 2021-04-14 | 2022-10-20 | Lam Research Corporation | Deposition of molybdenum |
| CN115702474A (zh) | 2021-05-14 | 2023-02-14 | 朗姆研究公司 | 高选择性掺杂硬掩模膜 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101604054B1 (ko) * | 2009-09-03 | 2016-03-16 | 삼성전자주식회사 | 반도체 소자 및 그 형성방법 |
| US10170320B2 (en) * | 2015-05-18 | 2019-01-01 | Lam Research Corporation | Feature fill with multi-stage nucleation inhibition |
| US20190067014A1 (en) * | 2017-08-30 | 2019-02-28 | Asm Ip Holding B.V. | Methods for filling a gap feature on a substrate surface and related semiconductor device structures |
| WO2021076636A1 (en) * | 2019-10-15 | 2021-04-22 | Lam Research Corporation | Molybdenum fill |
| US11417568B2 (en) * | 2020-04-10 | 2022-08-16 | Applied Materials, Inc. | Methods for selective deposition of tungsten atop a dielectric layer for bottom up gapfill |
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2023
- 2023-04-18 JP JP2024561754A patent/JP2025515282A/ja active Pending
- 2023-04-18 EP EP23792451.9A patent/EP4511875A1/en active Pending
- 2023-04-18 TW TW112114336A patent/TW202412178A/zh unknown
- 2023-04-18 WO PCT/US2023/019000 patent/WO2023205184A1/en not_active Ceased
- 2023-04-18 CN CN202380048420.4A patent/CN119404303A/zh active Pending
- 2023-04-18 KR KR1020247038216A patent/KR20250005319A/ko active Pending
- 2023-04-18 US US18/857,125 patent/US20250259894A1/en active Pending