JP2025510631A - 加圧焼結方法および対応する加圧焼結装置 - Google Patents

加圧焼結方法および対応する加圧焼結装置 Download PDF

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Publication number
JP2025510631A
JP2025510631A JP2024554909A JP2024554909A JP2025510631A JP 2025510631 A JP2025510631 A JP 2025510631A JP 2024554909 A JP2024554909 A JP 2024554909A JP 2024554909 A JP2024554909 A JP 2024554909A JP 2025510631 A JP2025510631 A JP 2025510631A
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JP
Japan
Prior art keywords
sintering
tool
substrate
pressure
tool part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024554909A
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English (en)
Japanese (ja)
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JP2025510631A5 (cg-RX-API-DMAC7.html
Inventor
フランシスカス ヘラルドゥス ヨハネス ボシュマン，
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Boschman Technologies BV
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Boschman Technologies BV
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Filing date
Publication date
Application filed by Boschman Technologies BV filed Critical Boschman Technologies BV
Publication of JP2025510631A publication Critical patent/JP2025510631A/ja
Publication of JP2025510631A5 publication Critical patent/JP2025510631A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01365—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07125—Means for controlling the bonding environment, e.g. valves or vacuum pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2024554909A 2022-03-23 2023-03-23 加圧焼結方法および対応する加圧焼結装置 Pending JP2025510631A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL2031383 2022-03-23
NL2031383A NL2031383B1 (en) 2022-03-23 2022-03-23 Pressure Sintering Apparatus, and corresponding Pressure Sintering Method
PCT/NL2023/050149 WO2023182885A1 (en) 2022-03-23 2023-03-23 Pressure sintering method and corresponding pressure sintering apparatus

Publications (2)

Publication Number Publication Date
JP2025510631A true JP2025510631A (ja) 2025-04-15
JP2025510631A5 JP2025510631A5 (cg-RX-API-DMAC7.html) 2026-03-23

Family

ID=82482611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024554909A Pending JP2025510631A (ja) 2022-03-23 2023-03-23 加圧焼結方法および対応する加圧焼結装置

Country Status (10)

Country Link
US (1) US20250239565A1 (cg-RX-API-DMAC7.html)
EP (1) EP4497157A1 (cg-RX-API-DMAC7.html)
JP (1) JP2025510631A (cg-RX-API-DMAC7.html)
KR (1) KR20240163652A (cg-RX-API-DMAC7.html)
CN (1) CN118922934A (cg-RX-API-DMAC7.html)
CA (1) CA3245722A1 (cg-RX-API-DMAC7.html)
MX (1) MX2024011555A (cg-RX-API-DMAC7.html)
NL (1) NL2031383B1 (cg-RX-API-DMAC7.html)
TW (1) TW202406424A (cg-RX-API-DMAC7.html)
WO (1) WO2023182885A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT527921B1 (de) * 2024-04-25 2025-08-15 Smt Maschinen Und Vertriebs Gmbh & Co Kg Zylinderplatte einer Vorrichtung zum Verbinden eines Bauelements mit einem Substrat

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4770379B2 (ja) * 2005-10-13 2011-09-14 富士電機株式会社 金属部材の接合方法およびその組立治具
US7851334B2 (en) * 2007-07-20 2010-12-14 Infineon Technologies Ag Apparatus and method for producing semiconductor modules
DE102014103013B4 (de) * 2014-03-06 2017-09-21 Infineon Technologies Ag Verfahren zum Erzeugen einer getrockneten Pastenschicht, Verfahren zum Erzeugen einer Sinterverbindung und Durchlaufanlage zur Durchführung der Verfahren
DE102014114093B4 (de) * 2014-09-29 2017-03-23 Danfoss Silicon Power Gmbh Verfahren zum Niedertemperatur-Drucksintern

Also Published As

Publication number Publication date
CA3245722A1 (en) 2023-09-28
KR20240163652A (ko) 2024-11-19
MX2024011555A (es) 2024-12-06
NL2031383B1 (en) 2023-10-06
WO2023182885A1 (en) 2023-09-28
TW202406424A (zh) 2024-02-01
CN118922934A (zh) 2024-11-08
US20250239565A1 (en) 2025-07-24
EP4497157A1 (en) 2025-01-29

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