JP2025507454A5 - - Google Patents

Info

Publication number
JP2025507454A5
JP2025507454A5 JP2024541258A JP2024541258A JP2025507454A5 JP 2025507454 A5 JP2025507454 A5 JP 2025507454A5 JP 2024541258 A JP2024541258 A JP 2024541258A JP 2024541258 A JP2024541258 A JP 2024541258A JP 2025507454 A5 JP2025507454 A5 JP 2025507454A5
Authority
JP
Japan
Prior art keywords
substrate
layer
metal layer
forming
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024541258A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025507454A (ja
Filing date
Publication date
Priority claimed from US17/649,965 external-priority patent/US12261583B2/en
Application filed filed Critical
Publication of JP2025507454A publication Critical patent/JP2025507454A/ja
Publication of JP2025507454A5 publication Critical patent/JP2025507454A5/ja
Pending legal-status Critical Current

Links

JP2024541258A 2022-02-04 2023-01-20 クロストーク低減層を含む積層弾性波（ａｗ）フィルタパッケージ及び関連する製造方法 Pending JP2025507454A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/649,965 US12261583B2 (en) 2022-02-04 2022-02-04 Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods
US17/649,965 2022-02-04
PCT/US2023/060987 WO2023150436A1 (en) 2022-02-04 2023-01-20 Stacked acoustic wave (aw) filter packages, including cross-talk reduction layers, and related fabrication methods

Publications (2)

Publication Number Publication Date
JP2025507454A JP2025507454A (ja) 2025-03-19
JP2025507454A5 true JP2025507454A5 (cg-RX-API-DMAC7.html) 2026-01-09

Family

ID=85278566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024541258A Pending JP2025507454A (ja) 2022-02-04 2023-01-20 クロストーク低減層を含む積層弾性波（ａｗ）フィルタパッケージ及び関連する製造方法

Country Status (7)

Country Link
US (1) US12261583B2 (cg-RX-API-DMAC7.html)
EP (1) EP4473660A1 (cg-RX-API-DMAC7.html)
JP (1) JP2025507454A (cg-RX-API-DMAC7.html)
KR (1) KR20240142413A (cg-RX-API-DMAC7.html)
CN (1) CN118511431A (cg-RX-API-DMAC7.html)
TW (1) TW202335433A (cg-RX-API-DMAC7.html)
WO (1) WO2023150436A1 (cg-RX-API-DMAC7.html)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7596849B1 (en) 2003-06-11 2009-10-06 Triquint Semiconductor, Inc. Method of assembling a wafer-level package filter
DE102007058951B4 (de) 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
CN107431478B (zh) * 2015-04-01 2020-10-13 株式会社村田制作所 双工器
WO2017110308A1 (ja) 2015-12-21 2017-06-29 株式会社村田製作所 弾性波装置
JP6547617B2 (ja) 2015-12-22 2019-07-24 株式会社村田製作所 電子部品
JP6556663B2 (ja) * 2016-05-26 2019-08-07 太陽誘電株式会社 弾性波デバイス
WO2019130943A1 (ja) 2017-12-26 2019-07-04 株式会社村田製作所 弾性波装置および弾性波モジュール

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