JP2025501494A - 少なくとも1つの中空構造を作製する方法及び装置、ミラー、euvリソグラフィシステム、流体供給装置、及び流体を供給する方法 - Google Patents

少なくとも1つの中空構造を作製する方法及び装置、ミラー、euvリソグラフィシステム、流体供給装置、及び流体を供給する方法 Download PDF

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JP2025501494A
JP2025501494A JP2024535549A JP2024535549A JP2025501494A JP 2025501494 A JP2025501494 A JP 2025501494A JP 2024535549 A JP2024535549 A JP 2024535549A JP 2024535549 A JP2024535549 A JP 2024535549A JP 2025501494 A JP2025501494 A JP 2025501494A
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Prior art keywords
channel
fluid
workpiece
hollow structure
removal
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JP2024535549A
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Japanese (ja)
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JP2025501494A5 (https=
Inventor
ウルスペアガー トビアス
ノルテ シュテファン
グリーズン クリスティアン
クノール ソーレン
モンツ トーマス
ザルター シュテファン
クラースナ ミヒャエル
ツァチェク クリストフ
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カール・ツァイス・エスエムティー・ゲーエムベーハー
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Priority claimed from DE102021214310.5A external-priority patent/DE102021214310A1/de
Priority claimed from DE102021214318.0A external-priority patent/DE102021214318B4/de
Priority claimed from DE102022203593.3A external-priority patent/DE102022203593A1/de
Application filed by カール・ツァイス・エスエムティー・ゲーエムベーハー filed Critical カール・ツァイス・エスエムティー・ゲーエムベーハー
Publication of JP2025501494A publication Critical patent/JP2025501494A/ja
Publication of JP2025501494A5 publication Critical patent/JP2025501494A5/ja
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/55Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/08Mirrors
    • G02B5/0891Ultraviolet [UV] mirrors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/181Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G02B7/1815Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation with cooling or heating systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/702Reflective illumination, i.e. reflective optical elements other than folding mirrors, e.g. extreme ultraviolet [EUV] illumination systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825Mounting of individual elements, e.g. mounts, holders or supports
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891Temperature
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975Assembly, maintenance, transport or storage of apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/04Tubular or hollow articles
    • B23K2101/14Heat exchangers

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Lasers (AREA)
JP2024535549A 2021-12-14 2022-12-13 少なくとも1つの中空構造を作製する方法及び装置、ミラー、euvリソグラフィシステム、流体供給装置、及び流体を供給する方法 Pending JP2025501494A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
DE102021214318.0 2021-12-14
DE102021214310.5A DE102021214310A1 (de) 2021-12-14 2021-12-14 Verfahren und Vorrichtung zum Erzeugen mindestens einer Hohlstruktur, EUVSpiegel und EUV-Lithographiesystem
DE102021214310.5 2021-12-14
DE102021214318.0A DE102021214318B4 (de) 2021-12-14 2021-12-14 Fluidzuführungsvorrichtung und Verfahren zum Zuführen eines Fluids zu mindestens einer Ablationsfront
DE102022203593.3A DE102022203593A1 (de) 2022-04-08 2022-04-08 Optisches Element und EUV-Lithographiesystem
DE102022203593.3 2022-04-08
PCT/EP2022/085520 WO2023110816A2 (de) 2021-12-14 2022-12-13 Verfahren und vorrichtung zum erzeugen mindestens einer hohlstruktur, spiegel, euv-lithographiesystem, fluidzuführungsvorrichtung und verfahren zum zuführen eines fluids

Publications (2)

Publication Number Publication Date
JP2025501494A true JP2025501494A (ja) 2025-01-22
JP2025501494A5 JP2025501494A5 (https=) 2025-12-24

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JP2024535549A Pending JP2025501494A (ja) 2021-12-14 2022-12-13 少なくとも1つの中空構造を作製する方法及び装置、ミラー、euvリソグラフィシステム、流体供給装置、及び流体を供給する方法

Country Status (6)

Country Link
US (1) US20240329285A1 (https=)
EP (3) EP4448213B1 (https=)
JP (1) JP2025501494A (https=)
KR (1) KR20240119295A (https=)
TW (2) TWI889440B (https=)
WO (1) WO2023110816A2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023205947A1 (de) * 2023-06-23 2024-05-02 Carl Zeiss Smt Gmbh Verfahren zur Herstellung eines Grundkörpers einer Komponente, optisches Element und optische Anordnung
DE102023205946A1 (de) 2023-06-23 2024-06-13 Carl Zeiss Smt Gmbh Optisches Element mit Kühlkanälen und optische Anordnung
DE102023205966A1 (de) * 2023-06-23 2024-06-06 Carl Zeiss Smt Gmbh Optisches Element mit Temperierkanälen und Lithographiesystem
DE102023208751A1 (de) 2023-09-11 2024-07-18 Carl Zeiss Smt Gmbh Optische Anordnung mit einer zu temperierenden Komponente
DE102023211220A1 (de) 2023-11-13 2024-10-10 Carl Zeiss Smt Gmbh Optisches Element mit Temperierkanälen und optische Anordnung
EP4684906A1 (de) 2024-07-22 2026-01-28 Carl Zeiss SMT GmbH Verfahren und vorrichtung zum bestimmen von lageparametern und/oder bewegungsparametern einer flexiblen fluidleitung
DE102024207384A1 (de) * 2024-08-05 2026-02-05 Carl Zeiss Smt Gmbh Fluidzuführungsvorrichtung und Verfahren zum Zuführen eines Fluids zu mindestens einer Abtragsfront
DE102024209846A1 (de) 2024-10-10 2026-04-16 Carl Zeiss Smt Gmbh Verfahren zum Optimieren der Temperierung eines Werkstücks, Spiegel und Anlage der Halbleitertechnologie

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3327586A1 (de) * 1982-08-17 1984-02-23 Andrew Charles Bromley Kent MacKechnie-Jarvis Wunddrainagekatheder
DE102009039400A1 (de) * 2009-08-31 2011-03-03 Carl Zeiss Laser Optics Gmbh Reflektives optisches Element zur Verwendung in einem EUV-System
WO2012013751A1 (en) * 2010-07-30 2012-02-02 Carl Zeiss Smt Gmbh Euv exposure apparatus
CN109254501A (zh) * 2012-02-03 2019-01-22 Asml荷兰有限公司 衬底支架、光刻装置、器件制造方法和制造衬底保持器的方法
WO2019158215A1 (de) * 2018-02-19 2019-08-22 Trumpf Lasersystems For Semiconductor Manufacturing Gmbh Faraday-rotator, optischer isolator, treiberlaseranordnung und euv-strahlungserzeugungsvorrichtung
DE102018202687A1 (de) * 2018-02-22 2018-05-03 Carl Zeiss Smt Gmbh Herstellungsverfahren für Komponenten einer Projektionsbelichtungsanlage für die Halbleiterlithographie und Projektionsbelichtungsanlage
DE102019205265A1 (de) * 2019-04-11 2020-10-15 Carl Zeiss Smt Gmbh Verfahren zum Herstellen eines Glaskörpers mit Kühlkanälen
DE102019219179A1 (de) * 2019-12-09 2021-06-10 Carl Zeiss Smt Gmbh Optisches Element und Lithographiesystem

Also Published As

Publication number Publication date
KR20240119295A (ko) 2024-08-06
EP4625018A2 (de) 2025-10-01
TWI884402B (zh) 2025-05-21
EP4448213B1 (de) 2025-10-15
WO2023110816A3 (de) 2023-09-07
EP4448213C0 (de) 2025-10-15
US20240329285A1 (en) 2024-10-03
TWI889440B (zh) 2025-07-01
TW202443288A (zh) 2024-11-01
EP4448213A2 (de) 2024-10-23
EP4621465A3 (de) 2026-01-07
WO2023110816A2 (de) 2023-06-22
TW202332979A (zh) 2023-08-16
EP4621465A2 (de) 2025-09-24
EP4625018A3 (de) 2026-01-14

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