JP2025036321A5 - - Google Patents

Info

Publication number
JP2025036321A5
JP2025036321A5 JP2024147083A JP2024147083A JP2025036321A5 JP 2025036321 A5 JP2025036321 A5 JP 2025036321A5 JP 2024147083 A JP2024147083 A JP 2024147083A JP 2024147083 A JP2024147083 A JP 2024147083A JP 2025036321 A5 JP2025036321 A5 JP 2025036321A5
Authority
JP
Japan
Prior art keywords
outermost surface
electrode
conductive bump
sectional
cross
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024147083A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025036321A (ja
Filing date
Publication date
Priority claimed from TW112132890A external-priority patent/TW202512387A/zh
Application filed filed Critical
Publication of JP2025036321A publication Critical patent/JP2025036321A/ja
Publication of JP2025036321A5 publication Critical patent/JP2025036321A5/ja
Pending legal-status Critical Current

Links

JP2024147083A 2023-08-30 2024-08-29 半導体素子及びその製造方法 Pending JP2025036321A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW112132890A TW202512387A (zh) 2023-08-30 2023-08-30 半導體元件及其製造方法
TW112132890 2023-08-30

Publications (2)

Publication Number Publication Date
JP2025036321A JP2025036321A (ja) 2025-03-14
JP2025036321A5 true JP2025036321A5 (https=) 2025-08-15

Family

ID=94706322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024147083A Pending JP2025036321A (ja) 2023-08-30 2024-08-29 半導体素子及びその製造方法

Country Status (5)

Country Link
US (1) US20250081699A1 (https=)
JP (1) JP2025036321A (https=)
KR (1) KR20250033091A (https=)
CN (1) CN119542309A (https=)
TW (1) TW202512387A (https=)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014022380A (ja) * 2012-07-12 2014-02-03 Dowa Electronics Materials Co Ltd 半導体素子およびその製造方法
JP7216296B2 (ja) * 2020-09-30 2023-02-01 日亜化学工業株式会社 発光素子及び発光装置

Similar Documents

Publication Publication Date Title
JP2006279042A5 (https=)
JP2024099623A5 (https=)
JPWO2021140407A5 (https=)
JPWO2020089726A5 (https=)
JPWO2022102273A5 (https=)
JPS6014462A (ja) 半導体メモリ素子
JP2024133604A5 (https=)
JP2025036321A5 (https=)
JP2004080050A5 (https=)
JPWO2021149688A5 (https=)
JP2021145318A5 (https=)
JPWO2023152595A5 (https=)
JPWO2020089762A5 (https=)
JPWO2023145110A5 (https=)
JP2003188286A5 (https=)
JP2005109291A5 (https=)
JPWO2024070592A5 (https=)
JPWO2022239717A5 (https=)
JPWO2022264969A5 (https=)
JPWO2023171464A5 (https=)
JPH10270708A5 (https=)
JP2005085487A5 (https=)
JPWO2024069696A5 (https=)
JPWO2023145111A5 (https=)
JPWO2024252871A5 (https=)