JP2025007018A5 - - Google Patents

Info

Publication number
JP2025007018A5
JP2025007018A5 JP2023108144A JP2023108144A JP2025007018A5 JP 2025007018 A5 JP2025007018 A5 JP 2025007018A5 JP 2023108144 A JP2023108144 A JP 2023108144A JP 2023108144 A JP2023108144 A JP 2023108144A JP 2025007018 A5 JP2025007018 A5 JP 2025007018A5
Authority
JP
Japan
Prior art keywords
resin composition
curable resin
composition according
mass
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023108144A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025007018A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2023108144A priority Critical patent/JP2025007018A/ja
Priority claimed from JP2023108144A external-priority patent/JP2025007018A/ja
Publication of JP2025007018A publication Critical patent/JP2025007018A/ja
Publication of JP2025007018A5 publication Critical patent/JP2025007018A5/ja
Pending legal-status Critical Current

Links

JP2023108144A 2023-06-30 2023-06-30 硬化性樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品 Pending JP2025007018A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023108144A JP2025007018A (ja) 2023-06-30 2023-06-30 硬化性樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023108144A JP2025007018A (ja) 2023-06-30 2023-06-30 硬化性樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品

Publications (2)

Publication Number Publication Date
JP2025007018A JP2025007018A (ja) 2025-01-17
JP2025007018A5 true JP2025007018A5 (enExample) 2025-11-18

Family

ID=94234926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023108144A Pending JP2025007018A (ja) 2023-06-30 2023-06-30 硬化性樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品

Country Status (1)

Country Link
JP (1) JP2025007018A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025197869A1 (ja) * 2024-03-19 2025-09-25 日東電工株式会社 粘着剤組成物、粘着シート、光学積層体及び画像表示装置

Similar Documents

Publication Publication Date Title
CN101014664B (zh) 可自由基固化的聚酯及其使用方法
JP2021162834A5 (enExample)
JP2025007018A5 (enExample)
CN102753640B (zh) 用于制造电子部件的粘合带
US6958250B2 (en) Light-emitting diode encapsulation material and manufacturing process
JPWO2018143014A1 (ja) 電子部品の製造方法、仮保護用樹脂組成物及び仮保護用樹脂フィルム
JP2009544768A5 (enExample)
JP2022103008A5 (enExample)
KR20140112017A (ko) 도전성 접착제, 및 전자 부품의 접속 방법
JP2021138916A5 (enExample)
JPWO2023276773A5 (enExample)
JP2003109916A (ja) 半導体加工用シート、並びに、それを用いた半導体装置の製造方法及び半導体装置
JP5577635B2 (ja) 接着剤組成物、回路接続用接着剤及び回路接続体
JP5654672B2 (ja) パルスuv光源によるウエハ裏面被覆方法
CN101601122A (zh) 涂有填充的、可旋涂的材料的半导体晶片
JPWO2023042600A5 (enExample)
CN108659747A (zh) 一种压敏导电胶黏剂及其制备方法
US20190316009A1 (en) Adhesive composition, cured product, and precision part
JP2021165397A5 (enExample)
CN108603080A (zh) 各向异性导电膜、连接方法以及接合体
JPWO2021045843A5 (enExample)
JPWO2024117182A5 (enExample)
JP2022115943A5 (enExample)
JPWO2023017752A5 (enExample)
CN105940559B (zh) 各向异性导电膜及其制造方法