JP2024527308A5 - - Google Patents

Info

Publication number
JP2024527308A5
JP2024527308A5 JP2023579795A JP2023579795A JP2024527308A5 JP 2024527308 A5 JP2024527308 A5 JP 2024527308A5 JP 2023579795 A JP2023579795 A JP 2023579795A JP 2023579795 A JP2023579795 A JP 2023579795A JP 2024527308 A5 JP2024527308 A5 JP 2024527308A5
Authority
JP
Japan
Prior art keywords
slot
metallization layers
package substrate
metallization
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023579795A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024527308A (ja
Filing date
Publication date
Priority claimed from US17/375,289 external-priority patent/US20230014567A1/en
Application filed filed Critical
Publication of JP2024527308A publication Critical patent/JP2024527308A/ja
Publication of JP2024527308A5 publication Critical patent/JP2024527308A5/ja
Pending legal-status Critical Current

Links

JP2023579795A 2021-07-14 2022-06-14 集積スロット型アンテナ（１つ又は複数）を採用するパッケージ基板、及び関連する集積回路（ｉｃ）パッケージ及び製造方法 Pending JP2024527308A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/375,289 2021-07-14
US17/375,289 US20230014567A1 (en) 2021-07-14 2021-07-14 Package substrate employing integrated slot-shaped antenna(s), and related integrated circuit (ic) packages and fabrication methods
PCT/US2022/072928 WO2023288163A1 (en) 2021-07-14 2022-06-14 Package substrate employing integrated slot-shaped antenna(s), and related integrated circuit (ic) packages and fabrication methods

Publications (2)

Publication Number Publication Date
JP2024527308A JP2024527308A (ja) 2024-07-24
JP2024527308A5 true JP2024527308A5 (enExample) 2025-06-11

Family

ID=82547514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023579795A Pending JP2024527308A (ja) 2021-07-14 2022-06-14 集積スロット型アンテナ（１つ又は複数）を採用するパッケージ基板、及び関連する集積回路（ｉｃ）パッケージ及び製造方法

Country Status (7)

Country Link
US (1) US20230014567A1 (enExample)
EP (1) EP4371186A1 (enExample)
JP (1) JP2024527308A (enExample)
KR (1) KR20240031309A (enExample)
CN (1) CN117597830A (enExample)
TW (1) TW202324833A (enExample)
WO (1) WO2023288163A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN217691636U (zh) * 2019-09-27 2022-10-28 株式会社村田制作所 天线模块
CN117121373A (zh) * 2021-03-31 2023-11-24 株式会社村田制作所 高频模块和通信装置
US11978697B2 (en) * 2021-07-16 2024-05-07 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure
US11894314B2 (en) * 2021-09-10 2024-02-06 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation
US12074360B2 (en) * 2021-10-22 2024-08-27 Sensorview Co., Ltd. RFIC assembled antenna
US12347929B2 (en) * 2022-08-12 2025-07-01 Apple Inc. Antenna feed structure
WO2025115920A1 (ja) * 2023-11-27 2025-06-05 株式会社村田製作所 アンテナモジュール及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9806422B2 (en) * 2013-09-11 2017-10-31 International Business Machines Corporation Antenna-in-package structures with broadside and end-fire radiations
WO2016120254A1 (en) * 2015-01-27 2016-08-04 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with integrated antenna structure
EP3449532B1 (en) * 2016-04-28 2024-02-28 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with integrated antenna arrangement, electronic apparatus, radio communication method
KR102423296B1 (ko) * 2017-09-14 2022-07-21 삼성전자주식회사 Pcb를 포함하는 전자 장치
KR102019354B1 (ko) * 2017-11-03 2019-09-09 삼성전자주식회사 안테나 모듈
KR102022353B1 (ko) * 2018-01-18 2019-09-18 삼성전기주식회사 안테나 모듈
US10862211B2 (en) * 2018-08-21 2020-12-08 Htc Corporation Integrated antenna structure
KR102733019B1 (ko) * 2019-07-17 2024-11-21 삼성전자주식회사 안테나 모듈 및 그것을 포함하는 전자 장치
JP7382776B2 (ja) * 2019-09-30 2023-11-17 日本特殊陶業株式会社 偏波共用アンテナ
US11670836B2 (en) * 2020-10-29 2023-06-06 Advanced Semiconductor Engineering, Inc. Semiconductor device package

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