JP2024166236A5 - - Google Patents
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- Publication number
- JP2024166236A5 JP2024166236A5 JP2024153030A JP2024153030A JP2024166236A5 JP 2024166236 A5 JP2024166236 A5 JP 2024166236A5 JP 2024153030 A JP2024153030 A JP 2024153030A JP 2024153030 A JP2024153030 A JP 2024153030A JP 2024166236 A5 JP2024166236 A5 JP 2024166236A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- thermosetting resin
- composition according
- mass
- inorganic particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011342 resin composition Substances 0.000 claims 27
- 229920001187 thermosetting polymer Polymers 0.000 claims 26
- 239000003822 epoxy resin Substances 0.000 claims 12
- 229920000647 polyepoxide Polymers 0.000 claims 12
- 239000010954 inorganic particle Substances 0.000 claims 9
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 4
- 239000011256 inorganic filler Substances 0.000 claims 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims 4
- 150000002989 phenols Chemical class 0.000 claims 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 2
- YQUVCSBJEUQKSH-UHFFFAOYSA-N 3,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(O)=C1 YQUVCSBJEUQKSH-UHFFFAOYSA-N 0.000 claims 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 claims 2
- 235000010290 biphenyl Nutrition 0.000 claims 2
- 239000004305 biphenyl Substances 0.000 claims 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 claims 2
- 229920001568 phenolic resin Polymers 0.000 claims 2
- 239000005011 phenolic resin Substances 0.000 claims 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims 1
- SGNZYJXNUURYCH-UHFFFAOYSA-N 5,6-dihydroxyindole Chemical compound C1=C(O)C(O)=CC2=C1NC=C2 SGNZYJXNUURYCH-UHFFFAOYSA-N 0.000 claims 1
- 229910052582 BN Inorganic materials 0.000 claims 1
- 229930185605 Bisphenol Natural products 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 claims 1
- QNHQEUFMIKRNTB-UHFFFAOYSA-N aesculetin Natural products C1CC(=O)OC2=C1C=C(O)C(O)=C2 QNHQEUFMIKRNTB-UHFFFAOYSA-N 0.000 claims 1
- GUAFOGOEJLSQBT-UHFFFAOYSA-N aesculetin dimethyl ether Natural products C1=CC(=O)OC2=C1C=C(OC)C(OC)=C2 GUAFOGOEJLSQBT-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 239000007822 coupling agent Substances 0.000 claims 1
- 230000001186 cumulative effect Effects 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- ILEDWLMCKZNDJK-UHFFFAOYSA-N esculetin Chemical compound C1=CC(=O)OC2=C1C=C(O)C(O)=C2 ILEDWLMCKZNDJK-UHFFFAOYSA-N 0.000 claims 1
- 125000000623 heterocyclic group Chemical group 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000000395 magnesium oxide Substances 0.000 claims 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 1
- JRNGUTKWMSBIBF-UHFFFAOYSA-N naphthalene-2,3-diol Chemical compound C1=CC=C2C=C(O)C(O)=CC2=C1 JRNGUTKWMSBIBF-UHFFFAOYSA-N 0.000 claims 1
- 229920003986 novolac Polymers 0.000 claims 1
- 239000003921 oil Substances 0.000 claims 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims 1
- 229940079877 pyrogallol Drugs 0.000 claims 1
- 239000000565 sealant Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024153030A JP2024166236A (ja) | 2020-05-25 | 2024-09-05 | 熱硬化性樹脂組成物、及び電子装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020090871A JP7618967B2 (ja) | 2020-05-25 | 2020-05-25 | 熱硬化性樹脂組成物、及び電子装置 |
| JP2024153030A JP2024166236A (ja) | 2020-05-25 | 2024-09-05 | 熱硬化性樹脂組成物、及び電子装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020090871A Division JP7618967B2 (ja) | 2020-05-25 | 2020-05-25 | 熱硬化性樹脂組成物、及び電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024166236A JP2024166236A (ja) | 2024-11-28 |
| JP2024166236A5 true JP2024166236A5 (enrdf_load_stackoverflow) | 2025-02-26 |
Family
ID=78848942
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020090871A Active JP7618967B2 (ja) | 2020-05-25 | 2020-05-25 | 熱硬化性樹脂組成物、及び電子装置 |
| JP2024153030A Pending JP2024166236A (ja) | 2020-05-25 | 2024-09-05 | 熱硬化性樹脂組成物、及び電子装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020090871A Active JP7618967B2 (ja) | 2020-05-25 | 2020-05-25 | 熱硬化性樹脂組成物、及び電子装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP7618967B2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7618967B2 (ja) * | 2020-05-25 | 2025-01-22 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、及び電子装置 |
| JPWO2024058130A1 (enrdf_load_stackoverflow) * | 2022-09-16 | 2024-03-21 | ||
| WO2025013880A1 (ja) * | 2023-07-10 | 2025-01-16 | 株式会社レゾナック | 成形用樹脂組成物及び電子部品装置 |
| WO2025013879A1 (ja) * | 2023-07-10 | 2025-01-16 | 株式会社レゾナック | 成形用樹脂組成物及び電子部品装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4496786B2 (ja) * | 2004-01-23 | 2010-07-07 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP6123277B2 (ja) * | 2011-12-28 | 2017-05-10 | 日立化成株式会社 | 樹脂組成物、樹脂組成物シート及び樹脂組成物シートの製造方法、金属箔付樹脂組成物シート、ｂステージシート、半硬化の金属箔付樹脂組成物シート、メタルベース配線板材料、メタルベース配線板、ｌｅｄ光源部材、並びにパワー半導体装置 |
| US10000679B2 (en) * | 2012-07-05 | 2018-06-19 | Hitachi Chemical Company, Ltd. | Phenolic resin composition |
| JP6871960B2 (ja) * | 2018-09-26 | 2021-05-19 | 株式会社Kri | 基材表面の改質方法 |
| JP7618967B2 (ja) * | 2020-05-25 | 2025-01-22 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、及び電子装置 |
| JP7515984B2 (ja) * | 2020-12-14 | 2024-07-16 | 鈴茂器工株式会社 | テーブル駆動機構およびそれを用いた食材供給装置 |
-
2020
- 2020-05-25 JP JP2020090871A patent/JP7618967B2/ja active Active
-
2024
- 2024-09-05 JP JP2024153030A patent/JP2024166236A/ja active Pending
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