JP2024089575A5 - - Google Patents

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Publication number
JP2024089575A5
JP2024089575A5 JP2022204990A JP2022204990A JP2024089575A5 JP 2024089575 A5 JP2024089575 A5 JP 2024089575A5 JP 2022204990 A JP2022204990 A JP 2022204990A JP 2022204990 A JP2022204990 A JP 2022204990A JP 2024089575 A5 JP2024089575 A5 JP 2024089575A5
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JP
Japan
Prior art keywords
resin
resin layer
layer
circuit board
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022204990A
Other languages
English (en)
Japanese (ja)
Other versions
JP7786731B2 (ja
JP2024089575A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2022204990A priority Critical patent/JP7786731B2/ja
Publication of JP2024089575A publication Critical patent/JP2024089575A/ja
Publication of JP2024089575A5 publication Critical patent/JP2024089575A5/ja
Application granted granted Critical
Publication of JP7786731B2 publication Critical patent/JP7786731B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022204990A 2022-12-21 回路基板およびその製造方法 Active JP7786731B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022204990A JP7786731B2 (ja) 2022-12-21 回路基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022204990A JP7786731B2 (ja) 2022-12-21 回路基板およびその製造方法

Publications (3)

Publication Number Publication Date
JP2024089575A JP2024089575A (ja) 2024-07-03
JP2024089575A5 true JP2024089575A5 (enExample) 2025-09-30
JP7786731B2 JP7786731B2 (ja) 2025-12-16

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