JP2024076154A - MASK STORAGE, LITHOGRAPHY APPARATUS, INSPECTION METHOD, AND PRODUCTION METHOD OF ARTICLE - Google Patents

Abstract

[Problem] To provide a mask stocker that is advantageous for improving throughput. [Solution] The mask stocker has a plurality of storage shelves for storing originals used in a lithography apparatus, and at least one of the plurality of storage shelves has a detection unit for detecting foreign matter on the originals. [Selected Figure] Figure 1

Description

The present invention relates to a mask storage device, a lithography apparatus, an inspection method, and a method for manufacturing an article.

Semiconductor devices and liquid crystal devices are manufactured using a lithography process in which the pattern of an original is transferred to a photosensitive material applied to a substrate. In the exposure equipment used in this lithography process, if foreign matter such as dust or dirt is attached to the original, an image of the foreign matter will be transferred to the photosensitive material along with the pattern of the original, which can cause defects in the device.

Patent document 1 discloses that an inspection device that inspects the original for foreign objects is provided within the exposure device, making it possible to inspect for foreign objects.

JP 2009-253252 A

In the above-mentioned foreign substance inspection, for example, the inspection is performed in parallel with the exposure process of the exposure device, and the process of replacing the master to be used in the next exposure process is performed when the foreign substance inspection is completed, so that semiconductor devices and liquid crystal devices can be manufactured without reducing throughput. However, the method of Patent Document 1 requires a process of transporting the master, which increases the time required for the master replacement process and may reduce throughput.

The present invention aims to provide a mask storage device that is advantageous for improving throughput.

To achieve the above object, one aspect of the present invention is a mask stocker having a plurality of storage shelves for storing originals used in a lithography apparatus, characterized in that at least one of the plurality of storage shelves has a detection means for detecting foreign matter on the originals.

The present invention provides a mask storage device that is advantageous for improving throughput.

FIG. 2 is a diagram showing a configuration of a stocker according to the first embodiment. FIG. 2 is a diagram showing the stocker of the first embodiment as viewed from the X-axis direction. 3A and 3B are diagrams showing details of a light projecting unit configured in the first embodiment. FIG. 13 is a diagram of a stocker having a plurality of slots. FIG. 11 is a diagram showing a stocker according to a second embodiment. FIG. 13 is a diagram showing a stocker according to a third embodiment. FIG. 13 is a diagram showing a stocker according to a fourth embodiment. FIG. 13 is a diagram showing a stocker according to a fifth embodiment. FIG. 13 is a diagram showing a stocker according to a sixth embodiment. 13 is a flowchart of a method for replacing an original. 1 is a flowchart of a method for manufacturing an article. FIG. 1 is a schematic diagram showing the configuration of a conventional exposure apparatus. 1 is a schematic diagram showing a configuration of an exposure apparatus according to the present invention.

Below, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings. Note that in each drawing, the same reference numbers are used for the same components, and duplicated explanations will be omitted.

First Embodiment
First, the configuration of the exposure apparatus EXP in this embodiment will be described. Fig. 12 is a schematic diagram showing the configuration of a conventional exposure apparatus. In the following description, a coordinate system is defined with the plane on which the substrate P is placed as the XY plane, and the direction perpendicular to the XY plane as the Z direction. Furthermore, within the XY plane, the scanning direction in which the substrate P is scanned is the Y direction, and the non-scanning direction perpendicular to the scanning direction is the X direction.

The exposure apparatus EXP in this embodiment is a lithography apparatus used in the photolithography process, which is a manufacturing process for devices such as semiconductor devices and flat panel displays (FPDs). The exposure apparatus EXP exposes a substrate P through an original M on which a pattern is formed, and performs an exposure process in which the pattern of the original M is transferred to the substrate P. The exposure apparatus EXP may employ a so-called step-and-scan method in which scanning exposure is performed while scanning the original M and the substrate P in synchronization. Furthermore, the exposure apparatus is not limited to this method, and may also employ other exposure methods such as a step-and-repeat method for performing the exposure process.

The exposure apparatus EXP has an illumination optical system IL, an original stage MS that holds the original M, a projection optical system PO, a substrate stage PS that holds the substrate P, a stocker 1 (mask stocker), a control unit 7, a transport device 26, an inspection unit 27, and a cleaning unit 28. Exposure light irradiated from a light source (not shown, for example, a high-pressure mercury lamp or an LED) is focused on the original M by the illumination optical system IL.

The projection optical system PO is an optical system for projecting a pattern formed on the original M onto a substrate P coated with a photosensitive material, and transferring the pattern. In this embodiment, a projection optical system using an Offner type optical system is assumed. In the case of an Offner type optical system, the original M is illuminated with an arc-shaped illumination area to ensure a good image area. Furthermore, the illumination shape of the exposure light that reaches the substrate P is also arc-shaped. The projection optical system PO is also referred to as a pattern forming means, as it forms the pattern of the original on the substrate.

Stocker 1 stores multiple originals used in the exposure process of exposure apparatus EXP. Stocker 1 can be provided inside the exposure apparatus so that originals M can be quickly replaced, but it may also be provided outside the apparatus, taking into account the design space of exposure apparatus EXP.

The original M stored in the stocker 1 is transported by the transport device 26 to the inspection section 27. In the inspection section 27, a process (inspection process) is performed to inspect the original for foreign matter. If foreign matter is attached to the original M, the original M is transported by the transport device 26 to the cleaning section 28. In the cleaning section 28, a process (cleaning process) is performed to remove the foreign matter from the original M. The cleaning section 28 removes the foreign matter from the original M, for example, by blowing gas onto the original M, and collects the foreign matter by sucking in the blown gas. Once the cleaning process is completed, the original M is transported again to the inspection section 27, where the inspection process is performed.

If it is determined that no foreign matter is attached, the original M is transported to the original stage MS by the transport device 26, and preparations for exposure processing (replacement of the original) are completed. The control unit 7 controls each operation of the exposure device.

As explained above, in the conventional exposure apparatus EXP, the process of transporting the original M increases the time required to replace the original M, which may result in a decrease in throughput.

Next, the configuration of the exposure apparatus EXP in this embodiment will be described. FIG. 13 is a schematic diagram showing the configuration of the exposure apparatus in this embodiment. The exposure apparatus EXP in this embodiment is not provided with an inspection unit 27, and the stocker 1 (mask stocker) has a detection means for detecting foreign matter adhering to the original M stored in the stocker 1. This makes it possible to reduce the transport time from the stocker 1 to the inspection unit 27.

In addition, the exposure apparatus EXP in this embodiment does not need to be provided with the cleaning unit 28. The stocker 1 (mask stocker) may have a cleaning means for removing foreign matter adhering to the original M stored in the stocker 1. This makes it possible to reduce the transport time from the stocker 1 to the cleaning unit 28.

Next, the stocker 1 will be described in detail. FIG. 1 is a diagram showing the configuration of the stocker 1 (mask stocker) in this embodiment. The stocker 1 has multiple slots (storage shelves) that store multiple originals M, but FIG. 1 focuses on one slot for description. The stocker 1 has a light-projecting unit 2, a light-receiving unit 3, a linear guide 4, a drive unit 5, and a slot 6. The light-projecting unit 2 and the light-receiving unit 3 are collectively referred to as the detection means.

The light-projecting unit 2 projects light 8 (laser light) onto a foreign substance 9 adhering to the original M. The light-receiving unit 3 receives the light scattered by the light 8 incident on the foreign substance 9. The light-projecting unit 2 and the light-receiving unit 3 are moved at a constant speed in the X-axis direction by a driving unit 5 on a linear guide 4. The driving unit 5 can be driven by any method, such as by using a motor or by slide driving using a fluid. The light-receiving unit 3 can be, for example, a line sensor with pixels arranged in a predetermined direction (Y-axis direction).

The above describes a method of inspecting the entire surface (XY plane) of original M while scanning a light-projecting unit and a light-receiving unit capable of inspecting a predetermined line (Y-axis) in the X-axis direction, but the present invention is not limited to this method and foreign matter detection may be performed by another method. For example, foreign matter detection may be performed on the entire surface of original M while the driving unit 5 moves arbitrarily in the X-axis direction and the Y-axis direction, or foreign matter detection may be performed by capturing an image of the entire surface of original M all at once using an image sensor or the like.

Figure 2 is a view of the stocker 1 in this embodiment as viewed from the X-axis direction. The slot 6 is provided in the center of the slot 6 to hold the original M, and a part of the slot 6 is cut out to enable foreign body inspection of the front side (+Z side) and back side (-Z side) of the original M. The first light projecting unit 2a, the first light receiving unit 3a, the first linear guide 4a, and the first driving unit 5a are provided on the front side of the original M, and the second light projecting unit 2b, the second light receiving unit 3b, the second linear guide 4b, and the second driving unit 5b are provided on the back side of the original M. The first driving unit 5a and the second driving unit 5b may be integrally configured to simultaneously inspect the first foreign body adhering to the front side and the second foreign body adhering to the back side. If the first drive unit 5a and the second drive unit 5b are configured separately, the inspection of the first foreign object and the inspection of the second foreign object may be performed in parallel so that at least a portion of the inspection time for both overlaps, or they may be performed separately.

As shown in FIG. 2, the light projector 2 irradiates light 8 in the Y-axis direction across the original M near the surface of the original M. If a foreign object 9 is present in the optical path of the light 8, the irradiated light 8 is incident on the foreign object 9 and scattered. The scattered light caused by the foreign object 9 is collected by the light receiver 3 and converted into an electrical signal according to the amount of scattered light. The size and position of the foreign object 9 can be calculated from the converted electrical signal.

The scattered light from the foreign matter 9 is not necessarily scattered in a fixed direction. Therefore, in this embodiment, the angle of the light receiving unit 3 can be changed to any angle. For example, in the first inspection, the angle of the light receiving unit 3 is set to a first angle, a foreign matter inspection is performed, and a first inspection result is obtained. In the second inspection, the angle of the light receiving unit 3 is set to a second angle different from the first angle, a foreign matter inspection is performed, and a second inspection result is obtained. At this time, the electrical signals calculated in the first inspection result and the second inspection result may differ. In such a case, the presence or absence of a foreign matter may be determined based on the first inspection result and the second inspection result. Specifically, if it is determined that a foreign matter is present in at least one of the first inspection result and the second inspection result, it may be determined that a foreign matter is attached to the original M. Alternatively, the presence or absence of a foreign matter may be determined based on a statistical value (average value, etc.) of the signal value of the electrical signal of the first inspection result and the signal value of the electrical signal of the second inspection result. The number of inspections may be two or more, and the angle of the light receiving unit 3 may be set arbitrarily. By making the angle of the light receiving unit 3 variable in this way, the accuracy of foreign body inspection can be improved.

In addition, in this embodiment, it is possible to determine an appropriate inspection time and number of inspections within a range that satisfies the required inspection accuracy due to the constraints of the inspection time and inspection accuracy, and perform the inspection. For example, the inspection time can be shortened by increasing the irradiation intensity of the light projecting unit 2, increasing the driving speed of the driving unit 5, and reducing the number of inspections. Also, the inspection accuracy for foreign bodies can be improved by increasing the irradiation intensity of the light projecting unit 2, increasing the driving speed of the driving unit 5, and reducing the number of inspections. In this way, the irradiation intensity of the light projecting unit 2, the driving speed of the driving unit 5, the number of inspections, etc. can be changed depending on the required inspection time and inspection accuracy. Note that when multiple inspections are performed, the angle of the light receiving unit 3 can be changed for each inspection to detect scattered light in multiple directions for foreign bodies, thereby improving the inspection accuracy. Also, by slowing down the moving speed, it is possible to perform the inspection by lengthening the light storage time of the sensor in the light receiving unit 3, and it is possible to prevent erroneous detection due to flare of the light 8 or reflected light other than foreign bodies, thereby improving the inspection accuracy.

In practical operation, when the original M is stored and then immediately transported from the stocker 1 to the original stage MS, it is desirable to perform a foreign body inspection that prioritizes inspection time. Furthermore, when the original M is stored for a long time, it is desirable to perform a foreign body inspection that prioritizes inspection accuracy over time. At least one of the irradiation intensity of the light-projecting unit 2, the driving speed of the driving unit 5, the light accumulation time by the light-receiving unit 3, and the number of inspections is determined based on the time the original M has been stored in the stocker 1.

Figure 3 is a diagram showing the internal configuration of the light projecting unit 2. The light projecting unit 2 has a laser diode 10, a collimator lens 11, beam splitters 12a and 12b, a corner cube 13, and mirrors 14, 15, and 16. The laser light emitted from the laser diode 10 is converted into a parallel beam by the collimator lens 11. The parallel beam of laser light is then split by the beam splitter 12a into two beams A and B of approximately equal intensity.

Transmitted light B that passes through beam splitter 12a enters beam splitter 12b, and reflected light A that is reflected by beam splitter 12b enters corner cube 13. Corner cube 13 is shifted by a predetermined amount L/2 in the X-axis direction with respect to beam splitters 12a and 12b. After beam splitter 12b combines beams A and B, beams Aa and Ba that exit beam splitter 12b in the X-axis direction become parallel beams and have a shape in which the center distance between the two beams is L. Since beam splitter 12b is a half mirror, beams Ab and Bb that are separated by a center distance L exit beam splitter 12b in the Z-axis direction. Then, these combined beams Aa+Bb and Ab+Bb are irradiated in two directions onto the front and back of the master, respectively.

Figure 4 is an overall view of the stocker 1 of this embodiment. Figure 4 is a diagram of multiple slots 6 shown in Figure 1 stacked in the Z-axis direction. The stocker 1 of Figure 4 has slots 17a to 17i, and can be configured to store originals Ma to Mi in each slot and inspect each slot for foreign matter. In other words, all of the multiple slots can have an inspection means. Also, taking into consideration costs and space, only some of the slots can have an inspection means, and in this embodiment, it is sufficient that at least one of the multiple slots has an inspection means. Although not shown in Figure 4, the stocker 1 can be structured to be covered with a housing to prevent foreign matter from adhering to the stored originals Ma to Mi.

In this embodiment, since the stocker 1 has an inspection means, there is no need to prepare a separate foreign matter inspection device, and the time required to transport the original M can be shortened.

Second Embodiment
In the first embodiment, an example was described in which light from the light-projecting unit is projected so as to cross the vicinity of the surface of the original. In this embodiment, an example is described in which light from the light-projecting unit is projected so as to irradiate the surface of the original. Note that the basic configurations of the exposure apparatus EXP and the stocker 1 are similar to those of the first embodiment, and therefore description thereof will be omitted. Furthermore, matters not mentioned in this embodiment follow the first embodiment.

Figure 5 is a schematic diagram showing the stocker 1 in this embodiment. In the stocker 1 in this embodiment, an arrayed LED light source is used as the light projecting unit 18 instead of a laser light source. Unlike the first embodiment, the light projecting unit 18 projects light onto the surface of the original M, the projected light is reflected by foreign matter attached to the surface of the original M, and the light receiving unit 19 receives scattered light 20 to inspect for the presence or absence of foreign matter 21. The projection of light onto the surface of the original M can be, for example, oblique incidence illumination that is obliquely incident on the original M. In addition to the arrayed LEDs, laser light may be scanned and projected onto the surface of the original M. In addition, in the first embodiment, a line sensor is used as the sensor used in the light receiving unit, but an area sensor with pixels arranged two-dimensionally may be used to inspect a wider range of foreign matter, and may be freely selected according to the detection accuracy and detection range.

In this embodiment, therefore, since the stocker 1 has an inspection means, there is no need to prepare a separate foreign matter inspection device, and the time required to transport the original M can be shortened. In addition, by changing the method of directing light from the light projector 18 to the foreign matter depending on the type of foreign matter to be identified, the accuracy of foreign matter inspection can be further improved.

Third Embodiment
In the first and second embodiments, an example has been described in which a driving unit provided in one slot drives in the XY directions, thereby enabling foreign substance inspection of one original M. In this embodiment, an example will be described in which a driving unit drives in the Z direction in addition to the XY directions, thereby enabling foreign substance inspection of originals M accommodated in different slots. Note that the basic configurations of the exposure apparatus EXP and the stocker 1 are similar to those of the first embodiment, and therefore description thereof will be omitted. Furthermore, matters not mentioned in this embodiment will follow the first embodiment.

Figure 6 is a schematic diagram showing a part of the stocker 1 in this embodiment. The stocker 1 in this embodiment further has a Z drive unit 22 (storage shelf drive unit) and a Z linear guide 23. The light projecting unit and the light receiving unit in this embodiment can be driven in the vertical direction (Z direction) in addition to the horizontal direction. This makes it possible to inspect both originals Ma and Mb, which are stored at different positions in the Z direction, by one inspection means. Therefore, it becomes possible to inspect originals stored in multiple slots as shown in Figure 4 by one inspection means. That is, the Z drive unit 22 (storage shelf drive unit) is provided so that the detection means can drive between multiple slots (between storage shelves). Therefore, in this embodiment, since the stocker 1 has the inspection means, there is no need to prepare a separate foreign matter inspection device, and the time required to transport the original M can be shortened. In addition, since the number of inspection means can be reduced, it is advantageous in terms of cost and space within the stocker 1.

Fourth Embodiment
In the first to third embodiments, an example has been described in which one light projecting unit and one light receiving unit are used to inspect one side of the original M for foreign matter. In this embodiment, an example will be described in which multiple light projecting units and multiple light receiving units are used to inspect one side of the original M for foreign matter. Note that the basic configurations of the exposure apparatus EXP and the stocker 1 are similar to those of the first embodiment, and therefore description thereof will be omitted. Furthermore, matters not mentioned in this embodiment will follow the first embodiment.

Figure 7 is a schematic diagram showing the stocker 1 in this embodiment. In addition to the configuration of the stocker 1 described in Figure 1, the stocker 1 in this embodiment further includes a light-projecting unit 2' that projects light in the X-axis direction, a light-receiving unit 3' in which pixels are arranged in the X-axis direction, a linear guide 4' that enables driving in the Y-axis direction, and a driving unit 5' that drives in the Y-axis direction. Here, the X direction is also referred to as the first direction, and the Y direction is also referred to as the second direction. The light-projecting unit 2 and the light-receiving unit 3 are collectively referred to as the first detection means, and the light-projecting unit 2' and the light-receiving unit 3' are collectively referred to as the second detection means.

By performing foreign body inspection from two directions (a first direction and a second direction) and judging foreign bodies based on the results of both inspections, more accurate foreign body inspection can be performed. In addition, it is preferable that the two inspection directions are perpendicular to each other, but this is not limited thereto and they may be configured to intersect in accordance with the configuration of the stocker 1.

In this embodiment, since the stocker 1 has an inspection means, there is no need to prepare a separate foreign matter inspection device, and the time required to transport the original M can be shortened. In addition, by using multiple light-emitting elements and light-receiving elements to inspect one side of the original M for foreign matters, the accuracy of the foreign matter inspection can be further improved.

Fifth Embodiment
In the first to fourth embodiments, an example in which the original M is placed on the XY plane has been described. In this embodiment, an example in which the original M is placed on the XZ plane will be described. Note that the basic configurations of the exposure apparatus EXP and the stocker 1 are similar to those of the first embodiment, and therefore description thereof will be omitted. Furthermore, matters not mentioned in this embodiment follow the first embodiment.

Figure 8 is a schematic diagram showing the stocker 1 in this embodiment. This embodiment is characterized in that the original M is stored vertically. Storing the original M vertically has the effect of reducing adhesion of foreign matter to the surface of the original M. In addition, when foreign matter adheres to the original M, gravity makes it easier for the foreign matter to peel off from the surface of the original M.

The stocker 1 may also have a cleaning means for blowing gas into the stocker 1. By blowing clean air C vertically from upward to downward onto the original M, it is possible to further reduce adhesion of foreign matter to the surface of the original M and to enhance the effect of removing foreign matter. The inside of the stocker 1 may also be ionized to enhance the effect of reducing adhesion of foreign matter to the surface of the original M and to improve the effect of removing foreign matter.

In this embodiment, therefore, since the stocker 1 has an inspection means, there is no need to prepare a separate foreign matter inspection device, and the time required to transport the original M can be shortened. In addition, since the stocker 1 has a cleaning means, the effect of reducing adhesion of foreign matter to the surface of the original M can be improved, and the effect of removing foreign matter can be improved.

Sixth Embodiment
In the first to fifth embodiments, examples have been described in which the spaces between the slots are not shielded. In this embodiment, an example will be described in which the spaces between the slots are shielded. Note that the basic configurations of the exposure apparatus EXP and the stocker 1 are similar to those of the first embodiment, and therefore a description thereof will be omitted. Furthermore, matters not mentioned in this embodiment follow the first embodiment.

Figure 9 is a schematic diagram showing the stocker 1 in this embodiment. This embodiment is configured to prevent the foreign substance inspection of other originals M from affecting the inspection of other originals M when the inspection of multiple originals M is performed in parallel. Each slot of the stocker is divided by a panel 24, and the space between each slot is shielded, thereby preventing the influence of light generated by the foreign substance inspection of other originals M. In addition, erroneous inspections can be prevented by providing an incidence prevention plate 25 to the light receiving section, which reduces the incidence of unintended reflected light.

In this embodiment, therefore, since the stocker 1 has an inspection means, there is no need to prepare a separate foreign matter inspection device, and the time required to transport the original M can be shortened. In addition, by preventing unintended light from entering the light receiving section, the inspection accuracy of foreign matter inspection can be improved.

Seventh Embodiment
In this embodiment, the process of replacing the original M after performing foreign substance inspection using the stocker 1 (mask stocker) in the first to sixth embodiments, specifically the process of transporting the original M to be used for the next exposure to the original stage MS, will be described.

Figure 10 is a flowchart of the method for replacing the original M in this embodiment. Each step in the flowchart is controlled by the control unit 7 of the exposure apparatus EXP.

In step S101, the original M is loaded into the stocker 1 from outside the exposure apparatus EXP. It is preferable that the original M is loaded into the stocker 1 in advance, rather than waiting until a request to replace the original M is received.

In step S102, the master M is inspected for foreign matter in the stocker 1 (inspection process). If the inspection result indicates that foreign matter is attached to the master M, the foreign matter is removed by the cleaning means of the stocker 1 or the cleaning unit, and step S102 is executed again. If it is determined that no foreign matter is attached to the master M, the process proceeds to step S103.

In step S103, the original M is transported to the original stage M (transportation process). After that, an exposure process is performed to perform an exposure process (lithography process).

<Embodiments of a method for manufacturing an article>
The method for manufacturing an article according to the embodiment of the present invention is suitable for manufacturing articles such as flat panel displays (FPDs), semiconductor devices, sensors, and optical elements. FIG. 11 is a flowchart of the method for manufacturing an article according to the present embodiment. The method for manufacturing an article according to the present embodiment includes a step of inspecting the presence or absence of foreign matter on the original M by the above-mentioned stocker 1 (inspection step, step S11). The method for manufacturing an article according to the present embodiment also includes a step of forming a latent image pattern on the photosensitive material applied on the substrate by exposure using the above-mentioned exposure apparatus EXP through the original M inspected in the above step, thereby obtaining an exposed substrate (exposure step, step S12). The method also includes a step of developing the substrate exposed in the above step, thereby obtaining a developed substrate (development step, step S13). Furthermore, the manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.) (processing step, step S14). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

Although preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. The scope of application of the present invention can be, for example, a stocker of originals (mask stocker) in a lithography apparatus (exposure apparatus, imprint apparatus, planarization apparatus, flat panel display exposure apparatus, etc.) that forms a pattern of an original on a substrate. In other words, the scope of application of the present invention is, for example, a stocker of originals (reticles) for semiconductor exposure apparatuses, originals (molds) for imprint apparatuses, originals (superstrates) for planarization apparatuses, originals (masks) for flat panel display exposure apparatuses, etc.

The scope of application of the present invention is not limited to the master plates described above, but can also be a stocker (mask stocker) that stores substrates. In other words, the scope of application of the present invention includes, for example, stockers for wafers (silicon wafers), plates (glass plates), etc. in semiconductor exposure apparatuses, imprint apparatuses, planarization apparatuses, and flat panel display exposure apparatuses.

The disclosure of this specification includes at least the following mask stocker, stocker, lithography apparatus, inspection method, and method for manufacturing an article.

(Item 1)
A mask stocker having a plurality of storage shelves for storing originals used in a lithography apparatus,
4. A mask stocker comprising: a detection means for detecting foreign matter on an original in at least one of said plurality of storage shelves.

(Item 2)
2. The mask stocker according to claim 1, wherein the detection means is provided in each of the plurality of storage shelves.

(Item 3)
3. The mask stocker according to item 1 or 2, wherein the detection means includes a light projecting unit that projects light onto the foreign matter, and a light receiving unit that receives light scattered by the light being incident on the foreign matter.

(Item 4)
A driving unit that scans the light projecting unit and the light receiving unit,
4. The mask stocker according to claim 3, wherein the foreign matter is detected while the driving unit scans the light projecting unit and the light receiving unit.

(Item 5)
5. The mask stocker according to item 3 or 4, wherein the angle of the light receiving portion is variable.

(Item 6)
6. The mask stocker described in item 5, characterized in that the foreign matter is detected based on a first inspection result obtained by inspecting the original when the angle of the light receiving unit is a first angle and a second inspection result obtained by inspecting the original when the angle of the light receiving unit is a second angle different from the first angle.

(Item 7)
7. The mask stocker according to any one of items 4 to 6, characterized in that at least one of the irradiation intensity of the light-projecting unit, the drive speed of the drive unit, the light accumulation time of the light-receiving unit, and the number of inspections is determined based on the time the original is stored.

(Item 8)
8. The mask stocker according to any one of items 1 to 7, wherein the detection means inspects for foreign matter adhering to the front and back sides of the original.

(Item 9)
the light-projecting unit includes a first light-projecting unit that projects light onto a first foreign matter adhering to the front side of the original, and a second light-projecting unit that projects light onto a second foreign matter adhering to the back side of the original,
the light receiving unit includes a first light receiving unit that receives light scattered as a result of the light from the first light projecting unit being incident on the first foreign matter, and a second light receiving unit that receives light scattered as a result of the light from the second light projecting unit being incident on the second foreign matter.
9. The mask stocker according to any one of items 3 to 8,

(Item 10)
10. The mask stocker according to any one of items 3 to 9, wherein the light projecting unit projects light so as to traverse the vicinity of the surface of the original and project the light onto the foreign matter.

(Item 11)
11. The mask stocker according to any one of items 3 to 10, wherein the light projecting unit projects light so that the light is obliquely incident on the original.

(Item 12)
12. The mask stocker according to any one of items 1 to 11, further comprising a storage shelf drive section provided so that the detection means can drive between the plurality of storage shelves.

(Item 13)
The detection means includes:
a first detection means for detecting the foreign object while scanning a light projecting unit which projects light onto the foreign object and a light receiving unit which receives light scattered by the light projected onto the foreign object in a first direction;
a second detection means for detecting the foreign matter by scanning a light projecting unit which projects light onto the foreign matter and a light receiving unit which receives light scattered by the light being incident on the foreign matter in a second direction intersecting with the first direction;
13. The mask stocker according to any one of items 1 to 12, comprising:

(Item 14)
14. The mask stocker according to any one of items 1 to 13, further comprising a cleaning means for removing foreign matter on the original.

(Item 15)
15. The mask stocker according to item 14, wherein the cleaning means ionizes the inside of the mask stocker.

(Item 16)
16. The mask stocker according to any one of items 1 to 15, wherein the mask stocker is provided inside the lithography apparatus.

(Item 17)
16. The mask stocker according to any one of items 1 to 15, wherein the mask stocker is provided outside the lithography apparatus.

(Item 18)
A stocker having a plurality of storage shelves for storing substrates to be used in a lithography apparatus,
A stocker comprising: a detection means for detecting foreign matter on a substrate in at least one of the plurality of storage shelves.

(Item 19)
A mask stocker according to any one of items 1 to 16,
A pattern forming means for forming a pattern of an original plate on a substrate;
1. A lithography apparatus comprising:

(Item 20)
1. A method for replacing a master used in a lithography apparatus, comprising the steps of:
an inspection step of inspecting the originals stored in a mask stocker for foreign matter attached thereto;
a transport step of transporting the master inspected in the inspection step to a master stage where a lithography process is performed;
An inspection method comprising:

(Item 21)
An inspection step of inspecting an original for foreign matter by the mask stocker according to any one of items 1 to 17;
an exposure step of exposing a substrate through the original inspected in the inspection step to obtain an exposed substrate;
a developing step of developing the exposed substrate to obtain a developed substrate,
A method for manufacturing an article, comprising the steps of: manufacturing an article from the developed substrate.

1 Stocker (mask stocker)
2 Light projecting unit (detection means)
3 Light receiving unit (detection means)
6, 17a to 17i Slots (storage shelves)
EXP Exposure equipment (lithography equipment)
M Original

Claims (21)

A mask stocker having a plurality of storage shelves for storing originals used in a lithography apparatus,
4. A mask stocker comprising: a detection means for detecting foreign matter on an original in at least one of said plurality of storage shelves. The mask stocker according to claim 1, characterized in that the detection means is provided in all of the plurality of storage shelves. The mask storage device according to claim 1, wherein the detection means includes a light projecting section that projects light onto the foreign object, and a light receiving section that receives light scattered by the light being incident on the foreign object. A driving unit that scans the light projecting unit and the light receiving unit,
4. The mask stocker according to claim 3, wherein the foreign matter is detected while the driving section scans the light projecting section and the light receiving section. The mask storage device according to claim 3, characterized in that the angle of the light receiving portion is variable. The mask stocker according to claim 5, characterized in that the foreign matter is detected based on a first inspection result obtained by inspecting the original with the angle of the light receiving unit being a first angle, and a second inspection result obtained by inspecting the original with the angle of the light receiving unit being a second angle different from the first angle. The mask stocker according to claim 4, characterized in that at least one of the irradiation intensity of the light projecting unit, the driving speed of the driving unit, the light accumulation time of the light receiving unit, and the number of inspections is determined based on the time the original is stored. The mask stocker according to claim 1, characterized in that the detection means inspects for foreign matter adhering to the front and back sides of the original. the light-projecting unit includes a first light-projecting unit that projects light onto a first foreign matter adhering to the front side of the original, and a second light-projecting unit that projects light onto a second foreign matter adhering to the back side of the original,
the light receiving unit includes a first light receiving unit that receives light scattered as a result of the light from the first light projecting unit being incident on the first foreign matter, and a second light receiving unit that receives light scattered as a result of the light from the second light projecting unit being incident on the second foreign matter.
4. The mask storage device according to claim 3. The mask stocker according to claim 3, characterized in that the light projecting unit projects light across the vicinity of the surface of the original and onto the foreign matter. The mask stocker according to claim 3, characterized in that the light projecting unit projects light so that it is obliquely incident on the original. The mask stocker according to claim 1, further comprising a storage shelf drive unit that enables the detection means to drive between the multiple storage shelves. The detection means includes:
a first detection means for detecting the foreign object while scanning a light projecting unit which projects light onto the foreign object and a light receiving unit which receives light scattered by the light being incident on the foreign object in a first direction;
a second detection means for detecting the foreign matter while scanning a light projecting unit which projects light onto the foreign matter and a light receiving unit which receives light scattered by the light being incident on the foreign matter in a second direction intersecting with the first direction;
2. The mask storage device according to claim 1, further comprising: The mask storage device according to claim 1, further comprising a cleaning means for removing foreign matter from the original. The mask stocker according to claim 14, characterized in that the cleaning means ionizes the inside of the mask stocker. The mask stocker according to claim 1, characterized in that the mask stocker is provided inside the lithography apparatus. The mask stocker according to claim 1, characterized in that the mask stocker is provided outside the lithography apparatus. A stocker having a plurality of storage shelves for storing substrates to be used in a lithography apparatus,
A stocker comprising: a detection means for detecting foreign matter on a substrate in at least one of the plurality of storage shelves. A mask stocker according to any one of claims 1 to 16,
A pattern forming means for forming a pattern of an original plate on a substrate;
1. A lithography apparatus comprising: 1. A method for replacing a master used in a lithography apparatus, comprising the steps of:
an inspection step of inspecting the originals stored in a mask stocker for foreign matter attached thereto;
a transport step of transporting the master inspected in the inspection step to a master stage where a lithography process is performed;
An inspection method comprising: an inspection step of inspecting an original for foreign matter by the mask stocker according to any one of claims 1 to 17;
an exposure step of exposing a substrate through the original inspected in the inspection step to obtain an exposed substrate;
a developing step of developing the exposed substrate to obtain a developed substrate,
A method for manufacturing an article, comprising the steps of: manufacturing an article from the developed substrate.

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