JP2024069866A - Electronic component and sensor module - Google Patents

Abstract

To provide an electronic component and a sensor module having an excellent anti-vibration property.SOLUTION: An electronic component has a flexible wiring board and a support plate joined to a first surface of the flexible wiring board, and comprises a substrate including: a first region in which the first surface is arranged along a first direction and a second direction orthogonal to each other; a second region erected on one side in the first direction of the first region; a third region erected on the other side in the first direction of the first region; a fourth region erected on one side in the second direction of the first region; and a fifth region erected on the other side in the second direction of the first region. In the substrate, the first surface side of the second region and the first surface side of the third region oppose to each other, the first surface side of the fourth region and the first surface side of the fifth region are bent so as to oppose to each other, and adjacent ends of the second region, the third region, the fourth region, and the fifth region are joined with each other.SELECTED DRAWING: Figure 2

Description

The present invention relates to electronic components and sensor modules.

Patent document 1 describes an electronic component having a flexible wiring board, a first substrate positioned along a first surface of the flexible wiring board, and a circuit chip positioned on the surface of the flexible wiring board opposite the first surface. The flexible wiring board is also bent with the circuit chip side facing inward. In addition, a seventh embodiment describes a flexible wiring board having six surfaces and configured into a hexahedron by bending it.

JP 2014-105997 A

However, the electronic component in Patent Document 1 is completed when the flexible wiring board is folded, and the area that stands at a right angle to the bottom surface and the upper area that forms the lid are not joined to other areas. Therefore, when vibrations or impacts are applied from the outside, there is a risk that the flexible wiring board itself will resonate and generate unwanted vibrations.

The electronic component has a flexible wiring board and a support plate bonded to a first surface of the flexible wiring board, and includes a substrate including a first region in which the first surface is aligned along a first direction and a second direction perpendicular to each other, a second region standing on one side of the first region in the first direction, a third region standing on the other side of the first region in the first direction, a fourth region standing on one side of the first region in the second direction, and a fifth region standing on the other side of the first region in the second direction, and the substrate is bent so that the first surface side of the second region faces the first surface side of the third region and the first surface side of the fourth region faces the first surface side of the fifth region, and adjacent ends of the second region, the third region, the fourth region, and the fifth region are bonded to each other.

The sensor module includes a substrate having a flexible wiring board and a support plate joined to a first surface of the flexible wiring board, the substrate including a first region in which the first surface is aligned along a first direction and a second direction perpendicular to each other, a second region standing on one side of the first region in the first direction, a third region standing on the other side of the first region in the first direction, a fourth region standing on one side of the first region in the second direction, and a fifth region standing on the other side of the first region in the second direction, a first sensor device disposed in the first region, and a second sensor device disposed in at least one of the second region and the third region, the substrate being folded such that the first surface side of the second region faces the first surface side of the third region, and the first surface side of the fourth region faces the first surface side of the fifth region. The second region, the third region, the fourth region, and the fifth region have adjacent ends joined together, and when three mutually orthogonal axes are the X-axis, the Y-axis, and the Z-axis, the first sensor device includes a first sensor element and a first package that houses the first sensor element and has a surface along the X-axis and the Y-axis and a thickness along the Z-axis, and the thickness direction of the first package intersects with the mounting surface of the first package attached to the substrate, and the second sensor device includes a second sensor element and a second package that houses the second sensor element and has a surface along the Y-axis and the Z-axis and a thickness along the X-axis, and the thickness direction of the second package intersects with the mounting surface of the second package attached to the substrate.

FIG. 1 is a perspective view showing a configuration of an electronic component according to a first embodiment. FIG. 1 is a perspective view showing a configuration of an electronic component according to a first embodiment. FIG. 2 is a perspective view showing the configuration of a sensor unit included in the electronic component according to the first embodiment. FIG. 4 is a plan view showing the configuration of a sensor unit included in the electronic component according to the first embodiment before being folded. FIG. 13 is a perspective view showing the configuration of a sensor unit included in an electronic component according to a second embodiment. FIG. 11 is a plan view showing the configuration of a sensor unit included in an electronic component according to a second embodiment before being folded. FIG. 13 is a perspective view showing the configuration of a sensor unit included in an electronic component according to a third embodiment. FIG. 13 is a plan view showing the configuration of a sensor unit included in an electronic component according to a third embodiment before being folded.

1. First Embodiment First, a sensor module 1 including a three-axis gyro sensor will be described as an example of an electronic component according to a first embodiment with reference to FIGS. 1 to 4. FIG.

2 shows the sensor module 1 with the case 12 removed for ease of explanation. FIG. 3 shows the sensor module 1 with the third and fifth regions 63 and 65 removed for ease of explanation. FIG. 4 shows the sensor module 13 with the substrate 20 in a state before bending for ease of explanation. For ease of explanation, the following figures show the X-axis, Y-axis, and Z-axis as three mutually orthogonal axes. The direction along the X-axis is called the "X-direction", the direction along the Y-axis is called the "Y-direction", and the direction along the Z-axis is called the "Z-direction". The arrow side of each axis is called the "plus side", and the opposite side of the arrow is called the "minus side". The plus side of the Z-direction is called the "upper" side, and the minus side of the Z-direction is called the "lower" side.

The sensor module 1 of this embodiment is a three-axis gyro sensor that detects angular velocities around the mutually orthogonal X-axis, Y-axis, and Z-axis, and as shown in Figures 1 and 2, has a base substrate 11, a case 12 that houses a sensor unit 13, and a sensor unit 13 that detects angular velocities around the three axes.

The base substrate 11 is a rectangular flat plate with multiple terminals provided on its top surface, which is the flat surface facing the case 12, and a sensor unit 13 that detects angular velocity around the mutually orthogonal X-axis, Y-axis, and Z-axis is mounted thereon via solder or the like. Additionally, multiple external terminals are provided on the bottom surface.

The case 12 has a recess that opens toward the base substrate 11, and houses the sensor unit 13 in the recess. The case 12 is joined to the base substrate 11 via an adhesive or the like.

As shown in Figures 3 and 4, the sensor unit 13 includes a substrate 20, a first sensor device 31 as a component arranged on the substrate 20, a second sensor device 32 as a component, a third sensor device 33 as a component, and a plurality of circuit components 34.

The substrate 20 comprises a flexible wiring board 21 having a first surface 21a and a second surface 21b, which are opposite surfaces, and a support plate 22 having five openings 23, 24, 25, 26, and 27 and joined to the first surface 21a of the flexible wiring board 21 via an adhesive 80.

The substrate 20 includes a first region 61, the first surface 21a of which is aligned along the X direction as a first direction and the Y direction as a second direction which are perpendicular to each other, a second region 62 erected on one side of the first region 61 in the X direction, that is, the negative X side, a third region 63 erected on the other side of the first region 61 in the X direction, that is, the positive X side, a fourth region 64 erected on one side of the first region 61 in the Y direction, that is, the positive Y side, and a fifth region 65 erected on the other side of the first region 61 in the Y direction, that is, the negative Y side. The substrate 20 also includes a first connection region 71 located between the first region 61 and the second region 62 and bent so that the support plate 22 side faces inward, a second connection region 72 located between the first region 61 and the third region 63 and bent so that the support plate 22 side faces inward, a third connection region 73 located between the first region 61 and the fourth region 64 and bent so that the support plate 22 side faces inward, and a fourth connection region 74 located between the first region 61 and the fifth region 65 and bent so that the support plate 22 side faces inward.

The substrate 20 is bent so that the first surface 21a of the second region 62 faces the first surface 21a of the third region 63, and the first surface 21a of the fourth region 64 faces the first surface 21a of the fifth region 65. The second region 62, the third region 63, the fourth region 64, and the fifth region 65 have adjacent ends joined together with a joining material 81 such as solder or adhesive. Therefore, when vibration or impact is applied from the outside, the substrate 20 in the second region 62, the third region 63, the fourth region 64, and the fifth region 65 is less likely to resonate, and the generation of unnecessary vibrations can be reduced.

The first surface 21a of the flexible wiring board 21 is provided with wiring for electrically connecting to each of the sensor devices 31, 32, and 33, and the second surface 21b of the flexible wiring board 21 is provided with wiring that electrically connects to the wiring provided on the first surface 21a via through-hole wiring or the like. The wiring provided on the second surface 21b is electrically connected to a terminal provided on the upper surface of the base substrate 11 via a conductive bonding member.

The first sensor device 31 is a gyro sensor that detects angular velocity around the Z axis, and includes a first sensor element 41, a first package 51 that houses the first sensor element 41 and has a surface along the X axis and Y axis and a thickness along the Z axis, and a lid 54 that seals the first package 51 that houses the first sensor element 41, and is attached to the first region 61. More specifically, the first sensor device 31 is attached to the first surface 21a of the first region 61 through the opening 23. The thickness direction of the first package 51 intersects with the mounting surface of the first package 51 attached to the substrate 20.

The second sensor device 32 is a gyro sensor that detects angular velocity around the X-axis, and includes a second sensor element 42, a second package 52 that houses the second sensor element 42 and has a surface along the Y-axis and Z-axis and a thickness along the X-axis, and a lid 55 that seals the second package 52 that houses the second sensor element 42, and is attached to the second region 62. More specifically, the second sensor device 32 is attached to the first surface 21a of the second region 62 through the opening 24. The thickness direction of the second package 52 intersects with the mounting surface of the second package 52 attached to the substrate 20.

The third sensor device 33 is a gyro sensor that detects angular velocity around the Y axis, and includes a third sensor element 43, a third package 53 that houses the third sensor element 43 and has a surface along the X axis and Z axis and a thickness along the Y axis, and a lid 56 that seals the third package 53 that houses the third sensor element 43, and is attached to the fourth region 64. More specifically, the third sensor device 33 is attached to the first surface 21a of the fourth region 64 through the opening 26. The thickness direction of the third package 53 intersects with the mounting surface of the third package 53 attached to the substrate 20.

The first sensor device 31, the second sensor device 32, and the third sensor device 33 each have a mounting surface attached to the first surface 21a, a lid surface opposite the mounting surface, a side surface connecting the mounting surface and the lid surface, and a terminal arranged from the mounting surface to the side surface, and the terminal and the wiring provided on the first surface 21a of the flexible wiring board 21 are electrically connected via a conductive bonding member. This eliminates the need for electrical connection using a bonding wire, and the reliability of the electrical connection can be improved even when vibration or impact is applied.

The circuit component 34 is attached to the third region 63 and the fifth region 65. More specifically, the circuit component 34 is attached to the first surface 21a of the third region 63 through the opening 25 and to the first surface 21a of the fifth region 65 through the opening 27.

In this embodiment, the second sensor device 32 is attached to the first surface 21a of the second region 62, but it may be attached to the first surface 21a of the third region 63. Also, the third sensor device 33 is attached to the first surface 21a of the fourth region 64, but it may be attached to the first surface 21a of the fifth region 65. Also, the circuit component 34 is attached to the first surface 21a of the third region 63 and the first surface 21a of the fifth region 65, but it may be attached to the first surface 21a of the second region 62 and the first surface 21a of the fourth region 64.

As described above, in the sensor module 1 as an electronic component of this embodiment, adjacent ends of the second region 62, the third region 63, the fourth region 64, and the fifth region 65 are joined together with a bonding material 81 such as solder or adhesive. Therefore, when vibration or impact is applied from the outside, the substrate 20 in the second region 62, the third region 63, the fourth region 64, and the fifth region 65 is less likely to resonate, and the occurrence of unnecessary vibrations can be reduced. Therefore, a sensor module 1 with excellent vibration resistance can be obtained.

2. Second Embodiment Next, a sensor module 1a as an electronic component according to a second embodiment will be described with reference to FIGS.
5 shows only the sensor unit 13a for convenience of explaining the internal configuration of the sensor module 1a, and FIG. 6 shows the sensor unit 13a in a state before the substrate 20a is folded for convenience of explaining the internal configuration of the sensor module 1a.

The sensor module 1a of this embodiment is similar to the sensor module 1 of the first embodiment, except that the structure of the sensor unit 13a is different from that of the sensor module 1 of the first embodiment. Note that the following description will focus on the differences from the first embodiment described above, and similar items will be denoted by the same reference numerals and their description will be omitted.

The sensor module 1a of this embodiment has a base substrate 11 (not shown), a case 12 (not shown) that houses the sensor unit 13a, and the sensor unit 13a that detects angular velocity around three axes.

As shown in Figures 5 and 6, the sensor unit 13a includes a substrate 20a, a first sensor device 31 as a component arranged on the substrate 20a, a second sensor device 32 as a component, a third sensor device 33 as a component, and a plurality of circuit components 34.

The substrate 20a includes a flexible wiring board 21c having a first surface 21a and a second surface 21b, which are opposite surfaces, and a support plate 22a having an opening 23 and joined to the first surface 21a of the flexible wiring board 21c.

The first sensor device 31 is a gyro sensor that detects angular velocity around the Z axis, and is attached to the first region 61. More specifically, the first sensor device 31 is attached to the first surface 21a of the first region 61 through the opening 23.

The second sensor device 32 is a gyro sensor that detects angular velocity around the X-axis, and is attached to the second surface 21b of the second region 62.

The third sensor device 33 is a gyro sensor that detects angular velocity around the Y axis, and is attached to the second surface 21b of the fourth region 64.

The circuit components 34 are attached to the third region 63 and the fifth region 65. More specifically, the circuit components 34 are attached to the second surface 21b of the third region 63 and the second surface 21b of the fifth region 65.

In this embodiment, the second sensor device 32 is attached to the second surface 21b of the second region 62, but it may be attached to the second surface 21b of the third region 63. Also, the third sensor device 33 is attached to the second surface 21b of the fourth region 64, but it may be attached to the second surface 21b of the fifth region 65. Also, the circuit component 34 is attached to the second surface 21b of the third region 63 and the second surface 21b of the fifth region 65, but it may be attached to the second surface 21b of the second region 62 and the second surface 21b of the fourth region 64.

This configuration provides the same effect as that obtained in the first embodiment.

3. Third Embodiment Next, a sensor module 1b as an electronic component according to a third embodiment will be described with reference to FIGS.
In addition, in Fig. 7, for the convenience of explaining the internal configuration of the sensor module 1b, only the sensor unit 13b is illustrated, and in Fig. 8, for the convenience of explaining the internal configuration of the sensor unit 13b, a state before the substrate 20b is folded is illustrated.

The sensor module 1b of this embodiment is similar to the sensor module 1 of the first embodiment, except that the structure of the sensor unit 13b is different from that of the sensor module 1 of the first embodiment. Note that the following description will focus on the differences from the first embodiment described above, and similar items will be denoted by the same reference numerals and their description will be omitted.

The sensor module 1b of this embodiment has a base substrate 11 (not shown), a case 12 (not shown) that houses the sensor unit 13b, and the sensor unit 13b that detects angular velocity around three axes.

As shown in Figures 7 and 8, the sensor unit 13b includes a substrate 20b, a first sensor device 31 as a component arranged on the substrate 20b, a second sensor device 32 as a component, a third sensor device 33 as a component, and a plurality of circuit components 34.

The substrate 20b includes a flexible wiring board 21d having a first surface 21a and a second surface 21b, which are opposite surfaces, and a support plate 22d having five openings 23, 24, 25, 26, and 27 and joined to the first surface 21a of the flexible wiring board 21d.

The substrate 20b includes the first region 61, the second region 62, the third region 63, the fourth region 64, the fifth region 65, and the sixth region 66 connected to the end of the fourth region 64 on the opposite side to the first region 61 side, and the first connection region 71, the second connection region 72, the third connection region 73, the fourth connection region 74, and the fifth connection region 75 located between the fourth region 64 and the sixth region 66 and bent so that the support plate 22d side is on the inside. The substrate 20b is bent so that the first surface 21a side of the sixth region 66 faces the first surface 21a side of the first region 61. A part of the outer edge of the sixth region 66 is joined to the end of the second region 62, the third region 63, and the fifth region 65 by a bonding material 81 such as solder or adhesive. Furthermore, a portion of the outer edge of the sixth region 66 may be joined to at least one of the ends of the second region 62, the third region 63, and the fifth region 65.

The circuit component 34 is attached to the second surface 21b of the sixth region 66. Therefore, the substrate 20b has sensor devices 31, 32, 33 or circuit components 34 attached as components in all of the first region 61, the second region 62, the third region 63, the fourth region 64, the fifth region 65, and the sixth region 66.

In this embodiment, the sixth region 66 is connected to the fourth region 64, but this is not limited thereto, and it may be connected to any one of the second region 62, the third region 63, and the fifth region 65. In addition, the circuit component 34 is attached to the second surface 21b of the sixth region 66, but this is not limited thereto, and it may be attached to the first surface 21a of the sixth region 66.

This configuration provides the same effect as that obtained in the first embodiment.

1, 1a, 1b...sensor module as electronic component, 11...base substrate, 12...case, 13...sensor section, 20...substrate, 21...flexible wiring board, 21a...first surface, 21b...second surface, 22...support plate, 23, 24, 25, 26, 27...opening, 31...first sensor device as component, 32...second sensor device as component, 33...third sensor device as component, 34...circuit component, 41... First sensor element, 42...second sensor element, 43...third sensor element, 51...first package, 52...second package, 53...third package, 54, 55, 56...lid, 61...first region, 62...second region, 63...third region, 64...fourth region, 65...fifth region, 71...first connection region, 72...second connection region, 73...third connection region, 74...fourth connection region, 75...fifth connection region, 80...adhesive, 81...bonding material.

Claims (12)

A flexible wiring board and a support plate joined to a first surface of the flexible wiring board,
a first region in which the first surface extends along a first direction and a second direction perpendicular to each other;
A second region provided on one side of the first region in the first direction;
A third region provided on the other side of the first region in the first direction;
a fourth region provided on one side of the first region in the second direction;
a fifth region provided on the other side of the first region in the second direction,
the substrate is bent such that the first surface side of the second region faces the first surface side of the third region and the first surface side of the fourth region faces the first surface side of the fifth region,
Adjacent ends of the second region, the third region, the fourth region, and the fifth region are joined to each other.
Electronic components. A component is attached to at least one of the first region, the second region, the third region, the fourth region, and the fifth region.
The electronic component according to claim 1 . the support plate has an opening, and the component is attached to the first surface through the opening;
The electronic component according to claim 2 . any one of the second region, the third region, the fourth region, and the fifth region includes a sixth region connected to an end portion on an opposite side to the first region,
the substrate is bent so that the first surface side of the sixth region faces the first surface side of the first region,
A part of an outer edge of the sixth region is joined to at least one of the second region to the fifth region.
The electronic component according to claim 1 . the components or circuit components are attached to all of the first region, the second region, the third region, the fourth region, the fifth region, and the sixth region;
The electronic component according to claim 4. A flexible wiring board and a support plate joined to a first surface of the flexible wiring board,
a substrate including a first region, the first surface of which is aligned along a first direction and a second direction perpendicular to each other, a second region standing on one side of the first region in the first direction, a third region standing on the other side of the first region in the first direction, a fourth region standing on one side of the first region in the second direction, and a fifth region standing on the other side of the first region in the second direction;
a first sensor device disposed in the first area;
a second sensor device disposed in at least one of the second area and the third area;
Equipped with
the substrate is bent such that the first surface side of the second region faces the first surface side of the third region and the first surface side of the fourth region faces the first surface side of the fifth region;
adjacent ends of the second region, the third region, the fourth region, and the fifth region are joined to each other,
When the three mutually orthogonal axes are the X-axis, Y-axis, and Z-axis,
the first sensor device includes a first sensor element and a first package that houses the first sensor element and has a surface along the X-axis and the Y-axis and a thickness along the Z-axis, the thickness direction of the first package intersecting a mounting surface of the first package attached to the substrate;
the second sensor device includes a second sensor element and a second package that houses the second sensor element and has a surface along the Y-axis and the Z-axis and a thickness along the X-axis, and the direction of the thickness of the second package intersects with a mounting surface of the second package attached to the substrate;
Sensor module. a third sensor device attached to at least one of the fourth region and the fifth region;
the third sensor device includes a third sensor element and a third package that houses the third sensor element and has a surface along the X-axis and the Z-axis and a thickness along the Y-axis, and the direction of the thickness of the third package intersects with a mounting surface of the third package attached to the substrate;
The sensor module according to claim 6. a circuit component is attached to at least one of the second region, the third region, the fourth region, and the fifth region;
The sensor module according to claim 6 or 7. the support plate has an opening, and at least one of the first sensor device, the second sensor device, and the third sensor device is attached to the first surface through the opening.
The sensor module according to claim 7. the support plate has an opening, and the circuit component is attached to the first surface through the opening.
The sensor module according to claim 8. any one of the second region, the third region, the fourth region, and the fifth region includes a sixth region connected to an end portion on an opposite side to the first region,
the substrate is bent so that the first surface side of the sixth region faces the first surface side of the first region,
A part of an outer edge of the sixth region is joined to at least one of the second region to the fifth region.
The sensor module according to claim 6 or 7. A circuit component is attached to the sixth region.
The sensor module according to claim 11.

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