JP2024055418A5 - - Google Patents
Info
- Publication number
- JP2024055418A5 JP2024055418A5 JP2022162340A JP2022162340A JP2024055418A5 JP 2024055418 A5 JP2024055418 A5 JP 2024055418A5 JP 2022162340 A JP2022162340 A JP 2022162340A JP 2022162340 A JP2022162340 A JP 2022162340A JP 2024055418 A5 JP2024055418 A5 JP 2024055418A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- substrate
- base material
- heat sink
- semiconductor element
- Prior art date
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022162340A JP2024055418A (ja) | 2022-10-07 | 2022-10-07 | 半導体装置の製造方法および半導体装置 |
| DE102023127156.3A DE102023127156A1 (de) | 2022-10-07 | 2023-10-05 | Verfahren zur Herstellung einer Halbleitervorrichtung und Halbleitervorrichtung |
| CN202311281057.9A CN117855055A (zh) | 2022-10-07 | 2023-10-07 | 半导体装置的制造方法及半导体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022162340A JP2024055418A (ja) | 2022-10-07 | 2022-10-07 | 半導体装置の製造方法および半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024055418A JP2024055418A (ja) | 2024-04-18 |
| JP2024055418A5 true JP2024055418A5 (enExample) | 2025-09-25 |
Family
ID=90469226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022162340A Pending JP2024055418A (ja) | 2022-10-07 | 2022-10-07 | 半導体装置の製造方法および半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2024055418A (enExample) |
| CN (1) | CN117855055A (enExample) |
| DE (1) | DE102023127156A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2026111163A (ja) * | 2024-12-23 | 2026-07-03 | 株式会社レゾナック | 半導体装置及び半導体装置の製造方法 |
-
2022
- 2022-10-07 JP JP2022162340A patent/JP2024055418A/ja active Pending
-
2023
- 2023-10-05 DE DE102023127156.3A patent/DE102023127156A1/de active Pending
- 2023-10-07 CN CN202311281057.9A patent/CN117855055A/zh active Pending
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