JP2024055418A - 半導体装置の製造方法および半導体装置 - Google Patents

半導体装置の製造方法および半導体装置 Download PDF

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Publication number
JP2024055418A
JP2024055418A JP2022162340A JP2022162340A JP2024055418A JP 2024055418 A JP2024055418 A JP 2024055418A JP 2022162340 A JP2022162340 A JP 2022162340A JP 2022162340 A JP2022162340 A JP 2022162340A JP 2024055418 A JP2024055418 A JP 2024055418A
Authority
JP
Japan
Prior art keywords
bonding
substrate
heat sink
sintered body
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022162340A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024055418A5 (enExample
Inventor
和彦 南
Kazuhiko Minami
智哉 平野
Tomoya Hirano
偉夫 中子
Takeo Nakako
大 石川
Masaru Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Resonac Holdings Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Holdings Corp filed Critical Resonac Holdings Corp
Priority to JP2022162340A priority Critical patent/JP2024055418A/ja
Priority to DE102023127156.3A priority patent/DE102023127156A1/de
Priority to CN202311281057.9A priority patent/CN117855055A/zh
Publication of JP2024055418A publication Critical patent/JP2024055418A/ja
Publication of JP2024055418A5 publication Critical patent/JP2024055418A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022162340A 2022-10-07 2022-10-07 半導体装置の製造方法および半導体装置 Pending JP2024055418A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022162340A JP2024055418A (ja) 2022-10-07 2022-10-07 半導体装置の製造方法および半導体装置
DE102023127156.3A DE102023127156A1 (de) 2022-10-07 2023-10-05 Verfahren zur Herstellung einer Halbleitervorrichtung und Halbleitervorrichtung
CN202311281057.9A CN117855055A (zh) 2022-10-07 2023-10-07 半导体装置的制造方法及半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022162340A JP2024055418A (ja) 2022-10-07 2022-10-07 半導体装置の製造方法および半導体装置

Publications (2)

Publication Number Publication Date
JP2024055418A true JP2024055418A (ja) 2024-04-18
JP2024055418A5 JP2024055418A5 (enExample) 2025-09-25

Family

ID=90469226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022162340A Pending JP2024055418A (ja) 2022-10-07 2022-10-07 半導体装置の製造方法および半導体装置

Country Status (3)

Country Link
JP (1) JP2024055418A (enExample)
CN (1) CN117855055A (enExample)
DE (1) DE102023127156A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026140433A1 (ja) * 2024-12-23 2026-07-02 株式会社レゾナック 半導体装置及び半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026140433A1 (ja) * 2024-12-23 2026-07-02 株式会社レゾナック 半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
DE102023127156A1 (de) 2024-04-18
CN117855055A (zh) 2024-04-09

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