JP2024049249A - Original plate, information processing device, lithography device, and method for manufacturing article - Google Patents

Abstract

[Problem] To provide a master that is advantageous in improving the accuracy of a pattern projected onto a substrate. [Solution] A master used for divided exposure in which a plurality of patterns are exposed in a plurality of separate steps has a plurality of pattern areas arranged at positions corresponding to a plurality of chip areas, and a light-shielding area adjacent to the pattern areas in a second direction different from a first direction in which the plurality of pattern areas are arranged, and the light-shielding area has a length in the second direction that is equal to or greater than the length of the pattern areas. [Selected Figure] Figure 3

Description

The present invention relates to an original plate, an information processing device, a lithography device, and a method for manufacturing an article.

In the manufacturing process of semiconductor devices, liquid crystal display devices, and the like, a step-and-scan exposure apparatus is used, which performs exposure by linking a substrate and an original plate on which a pattern is formed. In addition, the pattern projected onto the substrate may be distorted during the exposure process, and the exposure apparatus must take the distortion of the pattern into account and make corrections while performing the exposure process. Patent Document 1 discloses a method for correcting the pattern projected onto a second substrate based on the results of measuring the distortion of the pattern on a first substrate.

JP 2017-111186 A

Here, when using a step-and-scan exposure apparatus for exposure, if the spacing between chip areas arranged in the scan direction is small and the scan speed is fast, the substrate stage may not be able to keep up with the drive to correct the pattern distortion in the scan direction. This can reduce the accuracy of correcting the pattern distortion, and the accuracy of the pattern projected onto the substrate.

Therefore, the present invention aims to provide a master plate that is advantageous in improving the accuracy of the pattern projected onto the substrate.

In order to achieve the above object, an original plate according to one aspect of the present invention is an original plate used for divided exposure in which a plurality of patterns are exposed in a plurality of separate exposures, and is characterized in that it has a plurality of pattern areas arranged at positions corresponding to a plurality of chip areas, and a light-shielding area adjacent to the pattern areas in a second direction different from a first direction in which the plurality of pattern areas are arranged, and that the light-shielding area has a length in the second direction that is equal to or greater than the length of the pattern areas.

Further objects and other aspects of the present invention will become apparent from the embodiments described below with reference to the drawings.

The present invention provides a master that is advantageous in improving the accuracy of the pattern projected onto the substrate.

1 is a schematic diagram showing a configuration of a substrate processing apparatus according to a first embodiment; 1 is a schematic diagram of a layout of chip areas in one of a plurality of shot areas on a substrate. FIG. 2 is a schematic diagram of a master in the first embodiment. 1A to 1C are schematic diagrams illustrating a pattern forming method using a master in a first embodiment. FIG. 11 is a schematic view showing a configuration of a substrate processing apparatus according to a second embodiment. 13 illustrates an example of a determination made by a determination unit in the second embodiment. 10 is a flowchart showing a process performed when a determination unit determines the type of original in the second embodiment. 13A and 13B are schematic diagrams of a light blocking member and a normal original according to a third embodiment. 10 is a flowchart of a method for manufacturing an article in a fourth embodiment.

Below, an embodiment of the present invention will be described with reference to the drawings. Note that the following embodiment does not limit the invention according to the claims. Although the embodiment describes multiple features, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined in any manner. Furthermore, in the drawings, the same reference numbers are used for the same or similar configurations, and duplicate explanations will be omitted.

In addition, in this specification and drawings, directions are basically shown using an XYZ coordinate system in which the vertical direction is the Z axis, the horizontal plane perpendicular to the vertical direction is the XY plane, and each axis is orthogonal to each other. However, if an XYZ coordinate system is shown in each drawing, that coordinate system takes precedence.

The specific configuration of each embodiment is described below.

First Embodiment
1 is a schematic diagram showing the configuration of a substrate processing apparatus 100 according to the present embodiment. In this embodiment, the substrate processing apparatus 100 is a projection exposure apparatus that exposes a pattern of an original (mask, reticle) onto a substrate via a projection optical system by a step-and-scan method.

The substrate processing apparatus 100 has an illumination optical system 3 for irradiating light, a projection optical system 5, an original stage 4 for holding an original 1, a substrate chuck 6 for holding a substrate 2, and a stage 7 on which the substrate chuck 6 is placed and which can be driven in the XY directions. The substrate processing apparatus 100 also has a control unit 8 for controlling each part in the apparatus. The original 1 is, for example, an original having a pattern (e.g., a circuit pattern) to be transferred onto the surface of quartz glass formed of chrome. The substrate 2 is, for example, single crystal silicon, and when the substrate processing apparatus 100 is an exposure apparatus, the substrate 2 transported to the substrate processing apparatus 100 has a photosensitive material (resist) applied to its surface.

In the substrate processing apparatus 100, exposure light from a light source (not shown) passes through an illumination optical system 3 and illuminates the original 1 held on an original stage 4. The light transmitted through the original 1 is irradiated onto the substrate 2 via a projection optical system 5. At this time, light from the pattern formed on the original 1 is imaged on the surface of the substrate 2. In this way, the substrate processing apparatus 100 exposes the shot area on the substrate 2.

Figure 2 is a schematic diagram of the layout of chip areas in one of the multiple shot areas on the substrate 2. Figure 2(a) is an example of the layout of chip areas 20 when the spacing between chip areas 20 in the scanning direction (Y direction) is small. Note that in Figure 2(a), only one of the multiple chip areas 20 is indicated by a symbol, but the other rectangular areas are also chip areas 20. In the example of Figure 2(a), there is a row in which four chip areas 20 are lined up in the X direction, and there are four rows of these rows in the Y direction, so a total of 16 chip areas 20 are arranged.

The step-and-scan exposure apparatus performs exposure processing by scanning while performing distortion correction or magnification correction in the scanning direction (hereinafter, referred to as distortion (magnification) correction). This correction is performed, for example, by driving the stage 7. In the example of FIG. 2(a), scanning is performed from position A, which is the furthest side in the -Y direction, to positions B, C, and D. Here, while driving from position A to position B, that is, while scanning one chip area 20 in the Y direction, distortion (magnification) correction is performed according to the scanning position within the chip area 20. Then, when position B is reached, when scanning the chip area 20 arranged between position B and position C, distortion (magnification) correction is performed similarly to when driving from position A to position B. Similarly, when scanning the chip area 20 arranged between position C and position D, distortion (magnification) correction is performed similarly to when driving from position A to position B (position B to position C).

Here, it is preferable that the distortion (magnification) correction when scanning is started for the chip region 20 arranged between positions A and B is the same as the distortion (magnification) correction when scanning is started for the chip region 20 arranged between positions B and C. Similarly, it is preferable that the distortion (magnification) correction when scanning is started for the chip region 20 arranged between positions A and B is the same as the distortion (magnification) correction when scanning is started for the chip region 20 arranged between positions C and D. However, if the interval between the chip region 20 arranged between positions A and B (positions B and C) and the chip region 20 arranged between positions B and C (positions C and D) is small, it may not be possible to make the distortion (magnification) correction the same. This is because the driving of the stage 7 is not in time when scanning (exposure) of the chip region 20 arranged between positions A and B (positions B and C) is completed and scanning of the chip region 20 arranged between positions B and C (positions C and D) is started. If the distortion (magnification) correction is not performed appropriately in this way, the overlay accuracy in the chip region 20 decreases.

2(b) is an example of the layout of the chip area 20 when the interval between the chip areas 20 in the scan direction (Y direction) is large. In the case of FIG. 2(b), the interval between the chip area 20 arranged between position A and position B (position B and position C) and the chip area 20 arranged between position B and position C (position C and position D) is large, so the time during which the stage 7 can be driven between the chip areas 20 is longer than in FIG. 2(a). Therefore, the distortion (magnification) correction when starting scanning for the chip area 20 arranged between position A and position B can be made the same as the distortion (magnification) correction when starting scanning for the chip area 20 arranged between position B and position C (position C and position D). As a result, the distortion (magnification) correction is appropriately performed in each chip area 20 according to the scan position, and the overlay accuracy in the chip area 20 is improved. However, the layout of the chip area 20 in FIG. 2(b) improves the overlay accuracy, but the number of chip areas 20 per unit area is small, resulting in low productivity.

Figure 3 is a schematic diagram of the original 1 in this embodiment. In the original 1 in this embodiment, pattern areas 11 are arranged at positions corresponding to the chip areas 20 between positions A and B and between positions C and D in Figure 2(a). Note that in Figure 3, only one of the multiple pattern areas 11 is indicated by a reference symbol, but other rectangular areas of the same shape are also pattern areas 11. In the example of Figure 3, there is a row in which four pattern areas 11 are lined up in the X direction, and there are two rows of these rows in the Y direction, so a total of eight pattern areas 11 are arranged. In this pattern area 11, a pattern to be formed at a position corresponding to the chip area 20 on the substrate 2 is provided.

In addition, the original plate 1 in this embodiment is provided with a light-shielding region 12 between positions B and C in FIG. 2(a) and at a position corresponding to the chip region 20 on the +Y direction side of position D. The light-shielding region 12 is formed, for example, from a chromium film or a material that does not transmit light but diffuses it. The light-shielding region 12 is provided to extend in a first direction (X-axis direction), which is one of the arrangement directions of the multiple pattern regions 11. The light-shielding region 12 is provided to be adjacent to one or more pattern regions 11 of the multiple pattern regions in a second direction (Y-axis direction) that is non-parallel (different) to the first direction. The length of the light-shielding region 12 in the second direction is provided to be equal to or longer than the length of the chip region 20 in the second direction. Note that the second direction in this embodiment is the scanning direction. By providing the light-shielding region 12 so as to cover the row of chip regions 20 arranged in the X direction in this way, it is possible to perform divided exposure (exposure processing of two or more times) in which multiple patterns are exposed in multiple parts.

Figure 4 is a schematic diagram showing a pattern formation method using original 1 in this embodiment, showing pattern formation in one of multiple shot areas on substrate 2. In this embodiment, original 1 is used to first expose chip areas 20 between positions A and B and between positions C and D, as shown in Figure 4(a). At this time, the exposure light is blocked by light-shielding area 12, so the exposure light does not reach positions between positions B and C and on the +Y direction side of position D. This scan (exposure) is referred to as the first exposure process.

Next, the original 1 is moved in the +Y direction and positioned so that the light-shielding region 12 on the -Y direction side corresponds to a position between positions C and D. Then, as shown in FIG. 4(b), the position of the pattern region 11 of the original 1 and the chip region 20 between positions B and C where no pattern has yet been formed, and on the +Y direction side of position D, are exposed. At this time, the exposure light is blocked by the light-shielding region 12, so the exposure light does not reach the chip region 20 between positions A and B and between positions C and D where exposure has already been performed. This scan (exposure) is referred to as the second exposure process.

In this way, the master 1 of this embodiment has a light-shielding region 12, which enables divided exposure in which the shot area is divided and exposed using a first exposure process and a second exposure process. This divided exposure allows the chip area over the entire surface of the shot area to be exposed.

In addition, in this embodiment, an example in which a light-shielding region 12 is provided has been described, but if the photosensitive material has positive type characteristics, a transparent region may be provided instead of the light-shielding region 12. This transparent region is a region that does not have a pattern region 11 and transmits the exposure light. If the photosensitive material has positive type characteristics, the exposed portion of the photosensitive material dissolves in the development process, and the unexposed portion remains as a pattern. When such a positive type photosensitive material is used, by providing a transparent region, it is possible to perform a split exposure in the scan exposure. In addition, the stage 7 can be driven to a position where distortion (magnification) correction can be appropriately performed while scanning the transparent region in the scan exposure.

For example, the chip region 20 arranged at a position corresponding to the pattern region 11 in the first exposure process is irradiated with the exposure light that has passed through the transparent region in the second exposure process. By adjusting the exposure amount in the first exposure process and the exposure amount in the second exposure process, the total exposure amount is set to the desired exposure amount.

By using the master 1 of this embodiment for exposure, even if the distance between the chip regions 20 in the scanning direction (Y direction) is small, the stage 7 can be driven to a position where distortion (magnification) correction can be properly performed while scanning the light-shielding region 12. Therefore, according to this embodiment, distortion (magnification) correction can be properly performed, and the pattern overlay accuracy can be improved.

Second Embodiment
The substrate processing apparatus 200 of this embodiment is characterized in that it judges the original to be used for exposure in addition to the features of the first embodiment. FIG. 5 is a schematic diagram showing the configuration of the substrate processing apparatus 200 of this embodiment. The substrate processing apparatus 200 has a judgment unit (information processing apparatus) 80 that judges the original to be used for exposure based on the scanning speed (speed at which the exposure process is performed) in the exposure process, the slit width through which the exposure light passes, the number of products manufactured per unit time, and the layout in the shot area. More specifically, based on the exposure process conditions and the arrangement of the chip area 20, it is judged whether or not to use the original 1 having the light-shielding area 12, and based on the judgment result, the original to be used for exposure is judged by taking into consideration the number of products manufactured per unit time (productivity). Here, the exposure process conditions preferably include one or both of the speed at which the exposure process is performed and the slit width through which the exposure light passes in the exposure process.

The determination unit 80 may also function as a control unit that controls each part in the substrate processing apparatus 200. The determination unit 80 determines whether to use a normal master that does not have a light-shielding area 12 (does not have a light-shielding area 12) or to use the master 1 described in the first embodiment that has a light-shielding area 12 (has a light-shielding area 12). The determination unit 80 also has a transmission unit 90 that transmits the information determined by the determination unit 80.

Figure 6 shows an example of the judgment made by the judgment unit 80 in this embodiment. Layout B is a layout in which the spacing between chip regions 20 in the scanning direction (Y direction) is smaller than that in layout A. The judgment unit 80 judges the original to be used for exposure based on the conditions of the scanning speed, slit width, and number of chips to be manufactured shown in Figure 6, and the magnitude of the correction residual caused by the spacing between chip regions 20 in the scanning direction in the shot area. In other words, it judges whether to use a normal original or to use the original 1 described in the first embodiment in which a light-shielding region 12 is provided.

The correction of the distortion (magnification) in the scanning direction is performed according to the scanning position, and the accuracy of the correction is affected by the scanning speed and the slit width. The faster the scanning speed, the less the correction is performed properly, and the larger the correction residual, which indicates the amount of distortion that cannot be removed even by correction. Also, the larger the slit width, the less the correction is performed properly, and the larger the correction residual. And, the narrower the interval in the scanning direction of the chip areas 20 to be exposed, the larger the correction residual. The judgment unit 80 obtains (estimates) the correction residual that occurs from the conditions of the scanning speed and the slit width and the arrangement of the chip areas 20, and compares the obtained correction residual with a threshold value to select the type of original to be used for exposure. Here, the judgment unit 80 selects the original taking into consideration the number of productions per unit time. When using an original 1 provided with a light-shielding region 12, the position of the original 1 is moved and exposure is performed twice to complete exposure for all chip areas 20 in the shot area. In other words, by using an original 1 provided with a light-shielding region 12, it is necessary to perform two exposure processes, the first exposure process and the second exposure process, and although the distortion (magnification) in the scanning direction can be properly corrected, the time required for the exposure process is doubled. Therefore, the number of productions per unit time is half that of a normal master. The judgment unit 80 judges whether the number of productions per unit time preset by the user can be achieved (fulfilled) even when using a master 1 provided with a light-shielding region 12, and if it can be achieved, the master 1 provided with a light-shielding region 12 is used. If it cannot be achieved, the number of productions per unit time is prioritized and a normal master is used. Note that the number of productions per unit time preset by the user is set for each combination of the scan speed condition and the slit width condition.

For example, if the threshold value for the correction residual is set to 1.0 (nm), in the example of FIG. 6, when the scan speed is 300 (mm/s), the correction residual is less than the threshold value for both layout A and layout B. Therefore, since the correction residual is less than the threshold value and a larger number of parts per unit time is produced using a normal master, the determination unit 80 determines to use a normal master.

When the scan speed is 500 (mm/s), the correction residual of layout A is less than the threshold value, so the judgment unit 80 decides to use a normal original. On the other hand, when the scan speed is 500 (mm/s), the correction residual of layout B is equal to or greater than the threshold value, so the judgment unit 80 selects original 1 with a light-shielding region 12. Here, assume that the user has set the number of productions per unit time to 200 (wph) or more when the scan speed is 500 (mm/s) and the slit width is 3.3 (mm). The judgment unit 80 calculates (estimates) the number of productions per unit time from the conditions of the scan speed and the slit width, and decides to use original 1 with a light-shielding region 12 if the number of productions is 200 (wph) or more. In this embodiment, an example of determining the original to be used for exposure based on the scan speed, slit width, and number of productions per unit time has been shown, but the original to be used for exposure may be determined based on other factors. In addition, in this embodiment, an example is shown in which the determination unit (information processing device) 80 is disposed inside the substrate processing device 200, but the determination unit (information processing device) 80 may also be disposed outside the substrate processing device 200 and communicate information with the substrate processing device 200.

FIG. 7 is a flowchart when the determination unit 80 in this embodiment determines the type of master. First, the determination unit 80 determines whether the correction residual obtained from the conditions is equal to or greater than a threshold value (S10). If the correction residual is less than the threshold value, the determination unit 80 determines whether a normal master is used (S40) and ends the process. If the correction residual is equal to or greater than the threshold value, the determination unit 80 determines whether the number of productions per unit time is achieved even when a master 1 with a light-shielding region 12 is used (S20). If the number of productions per unit time is not achieved, the determination unit 80 determines that a normal master is used (S40) and ends the process. If it is determined in step S20 that the number of productions per unit time is not achieved and it is determined that a normal master is used, the scan speed may be changed within a range that achieves the number of productions per unit time to improve the accuracy of the exposure process. If the number of productions per unit time is achieved, the determination unit 80 determines that a master 1 with a light-shielding region 12 is used (S30) and ends the process. Here, when the judgment unit 80 decides to use a normal original, it is deciding to perform a one-shot exposure (complete the exposure process with one exposure). Also, when the judgment unit 80 decides to use an original 1 with a light-shielding region 12, it is deciding to perform a split exposure (complete the exposure process with two or more exposures).

The transmission unit 90 transmits the result of the judgment made by the judgment unit 80 to a display control unit (not shown), and the display control unit controls the information displayed on the display unit (not shown). The user can check the type of master to be used from the information displayed on the display unit.

According to this embodiment, the determination unit 80 can determine the type of original to be used for exposure based on the exposure process conditions, the arrangement of the chip regions 20, and the number of products manufactured per unit time, that is, based on the accuracy and productivity of the exposure process. This allows the exposure process to be performed while taking into account the accuracy and productivity of the exposure process.

Third Embodiment
This embodiment is different from the first embodiment in the method of providing a light-shielding portion on the original 1. In the first embodiment, the light-shielding region 12 is fixed to the original 1. In this embodiment, a removable light-shielding member (light-shielding portion) 40 is provided on a normal original 30.

Figure 8 is a schematic diagram of the light shielding member 40 and the normal original plate 30 in this embodiment. Figure 8 (a) is a diagram of the normal original plate 30 with the light shielding member 40 attached, viewed from the +Z direction side. The normal original plate 30 has pattern regions 11 arranged at positions corresponding to the chip regions 20 in the shot region. The light shielding member 40 is attached in the same position as the light shielding region 12 in the first embodiment. The light shielding member 40 also has claws 41 for fixing the position when attached to the normal original plate 30. Two claws 41 are provided for each light shielding member 40 at positions where the normal original plate 30 can be fixed. In this embodiment, claws 41 are provided at both ends of the light shielding member 40 in the X-axis direction.

Figure 8 (b) is a diagram of a normal original 30 with a light-shielding member 40 attached, viewed from the +X direction. The light-shielding member 40 is attached on top of the normal original 30. This light-shielding member 40 is removable, and by removing the light-shielding member 40, the normal original 30 can be used as an original without a light-shielding portion. When the light-shielding member 40 is not attached, a one-shot exposure is performed.

The determination unit 80 determines whether or not to attach a light-shielding member 40 to the normal master 30. Then, when the determination unit 80 determines that a light-shielding part needs to be provided, the light-shielding member 40 is transported, for example, by a transport unit (not shown) and attached to the normal master 30. Also, when the determination unit 80 determines that a light-shielding part is not necessary when the light-shielding member 40 is attached to the normal master 30, the transport unit removes the light-shielding member 40 from the normal master 30.

By attaching the light-shielding member 40 to a normal original 30, the same effect as when the original 1 shown in the first embodiment is used can be obtained. In other words, even if the distance between the chip regions 20 in the scanning direction (Y direction) is small, the stage 7 can be driven to a position where distortion (magnification) correction can be properly performed while scanning the light-shielding member 40. Therefore, according to this embodiment, distortion (magnification) correction can be properly performed, and the overlay accuracy of the patterns can be improved. Note that when the light-shielding member 40 is attached, divided exposure is performed.

According to this embodiment, by attaching and detaching a removable light-shielding member 40 to and from a normal original 30, it is possible to switch between normal full-shot exposure and divided exposure using a light-shielding member with a single original.

By combining this embodiment with the second embodiment, if the determination unit 80 decides to perform divided exposure, it is possible to attach a light-shielding member 40 to the normal original 30, and if the determination unit 80 decides to perform collective exposure, it is possible to decide not to attach a light-shielding member 40 to the normal original 30.

In addition, in this embodiment, an example is shown in which the light-shielding member 40 is attached to a normal original 30, but the light-shielding member 40 may move in conjunction with the normal original 30 along the scanning direction. In this case, the time required for attaching and removing the light-shielding member 40 can be saved.

Fourth Embodiment
The present embodiment is characterized in that an article is manufactured using a master provided with the above-described light-shielding region, light-shielding member, or transmissive region.

Figure 9 is a flowchart of a method for manufacturing an article in this embodiment. Using the information processing device described in the second embodiment, a determination step (S510) is performed to determine the original to be used for exposure. Next, a formation step (S520) is performed to form a pattern on a substrate using the original determined in the determination step. Next, a manufacturing step (S530) is performed to manufacture an article from the substrate on which the pattern has been formed in the formation step.

Items manufactured using this manufacturing method include, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, etc.

The formation process involves, for example, forming a pattern on a substrate (silicon wafer, glass plate, etc.) by exposing the substrate, on which a photosensitive material has been applied, to light using an exposure device (lithography device).

The manufacturing process includes, for example, developing the substrate (photosensitive material) on which the pattern is formed, etching the developed substrate, removing the resist, dicing, bonding, and packaging. This manufacturing method makes it possible to manufacture higher quality articles than ever before.

The disclosure of this specification includes the following original plate, information processing device, lithography device, and method for manufacturing an article.

(Item 1)
A master plate used for divided exposure in which a plurality of patterns are exposed in a plurality of times,
a plurality of pattern areas arranged at positions corresponding to the plurality of chip areas,
a light-shielding region adjacent to the pattern region in a second direction different from a first direction which is an arrangement direction of the plurality of pattern regions;
The original plate, wherein the light-shielding region has a length in the second direction that is equal to or greater than the length of the pattern region.

(Item 2)
A master plate used for divided exposure in which a plurality of patterns are exposed in a plurality of times,
a plurality of pattern areas arranged at positions corresponding to the plurality of chip areas,
a transmission region adjacent to the pattern region in a second direction different from a first direction which is an arrangement direction of the plurality of pattern regions;
The transparent region is free of the pattern and has a length in the second direction that is equal to or greater than the length of the pattern region.

(Item 3)
1. An information processing device that determines whether to use an original having a light-shielding region in exposure by an exposure device,
The master having the light-shielding region is
It is used for split exposure, which exposes multiple patterns in multiple steps.
a plurality of pattern areas arranged at positions corresponding to the plurality of chip areas,
the light-shielding region is adjacent to the pattern region in a second direction different from a first direction which is an arrangement direction of the plurality of pattern regions,
the light-shielding region has a length in the second direction that is equal to or greater than the length of the pattern region,
13. An information processing apparatus comprising: a determining unit for determining whether or not to use an original having the light-shielding region, based on an exposure processing condition and an arrangement of chip regions.

(Item 4)
The information processing device described in item 3, characterized in that the judgment unit calculates a correction residual indicating an amount of distortion that cannot be removed even when distortion correction or magnification correction is performed in the exposure process based on the exposure process conditions and the arrangement of the chip area.

(Item 5)
The information processing device described in item 4, characterized in that the judgment unit judges to use an original plate that does not have the light-shielding area when the correction residual is smaller than a threshold value, and judges whether to use an original plate that has the light-shielding area based on the number of productions per unit time when the correction residual is larger than the threshold value.

(Item 6)
The information processing device described in item 4 or 5, characterized in that when the correction residual is greater than a threshold value, the judgment unit judges whether or not the number of productions per unit time previously set by the user will be met even if a master having the light-shielding area is used, and if the number of productions is met, judges to use a master having the light-shielding area, and if the number of productions is not met, judges to use a master without the light-shielding area.

(Item 7)
7. The information processing device according to any one of items 3 to 6, wherein the exposure processing conditions include one or both of a speed at which the exposure processing is performed and a slit width through which the exposure light passes in the exposure processing.

(Item 8)
The information processing device according to any one of items 4 to 7, characterized in that the correction residual is a distortion amount that cannot be removed even if the correction is performed according to a scanning position in scanning exposure.

(Item 9)
9. The information processing device according to any one of items 3 to 8, further comprising a transmission unit that transmits the result determined by the determination unit.

(Item 10)
a determination unit that determines a mask to be used based on exposure processing conditions and an arrangement of chip regions;
The information processing apparatus, wherein the determination unit determines whether the exposure process is to be completed by one exposure or by two or more exposures.

(Item 11)
a determination unit that determines a mask to be used based on exposure processing conditions and an arrangement of chip regions;
The information processing apparatus, wherein the determining unit determines whether or not a light blocking member is attached to the original.

(Item 12)
An information processing apparatus according to any one of items 3 to 9, which judges an original used for exposure;
a projection optical system that projects a pattern provided on the original determined to be used for exposure by the information processing device;
1. A lithography apparatus comprising:

(Item 13)
A determination step of determining an original to be used for exposure using the information processing device according to any one of items 3 to 9;
a forming step of forming a pattern on a substrate using the original determined in the determining step;
a manufacturing process for manufacturing an article from the substrate on which the pattern is formed in the forming process;
A method for producing an article, comprising the steps of:

The invention is not limited to the above-described embodiment, and various modifications and variations are possible without departing from the spirit and scope of the invention. Therefore, the following claims are appended to disclose the scope of the invention.

Claims (13)

A master plate used for divided exposure in which a plurality of patterns are exposed in a plurality of times,
a plurality of pattern areas arranged at positions corresponding to the plurality of chip areas,
a light-shielding region adjacent to the pattern region in a second direction different from a first direction which is an arrangement direction of the plurality of pattern regions;
The original plate, wherein the light-shielding region has a length in the second direction that is equal to or greater than the length of the pattern region. A master plate used for divided exposure in which a plurality of patterns are exposed in a plurality of times,
a plurality of pattern areas arranged at positions corresponding to the plurality of chip areas,
a transmission region adjacent to the pattern region in a second direction different from a first direction which is an arrangement direction of the plurality of pattern regions;
The transparent region is free of the pattern and has a length in the second direction that is equal to or greater than the length of the pattern region. 1. An information processing device that determines whether to use an original having a light-shielding region in exposure by an exposure device,
The master having the light-shielding region is
It is used for split exposure, which exposes multiple patterns in multiple steps.
a plurality of pattern areas arranged at positions corresponding to the plurality of chip areas,
the light-shielding region is adjacent to the pattern region in a second direction different from a first direction which is an arrangement direction of the plurality of pattern regions,
the light-shielding region has a length in the second direction that is equal to or greater than the length of the pattern region,
13. An information processing apparatus comprising: a determining unit for determining whether or not to use an original having the light-shielding region, based on an exposure processing condition and an arrangement of chip regions. The information processing device according to claim 3, characterized in that the determination unit determines a correction residual that indicates an amount of distortion that cannot be removed even if distortion correction or magnification correction is performed in the exposure process based on the exposure process conditions and the arrangement of the chip region. The information processing device according to claim 4, characterized in that the determination unit determines to use an original plate that does not have the light-shielding region when the correction residual is smaller than a threshold value, and determines whether to use an original plate that has the light-shielding region based on the number of productions per unit time when the correction residual is larger than the threshold value. The information processing device according to claim 5, characterized in that, when the correction residual is greater than a threshold value, the determination unit determines whether or not the number of productions per unit time previously set by the user is satisfied even if an original having the light-shielding region is used, and if the number of productions is satisfied, determines to use an original having the light-shielding region, and if the number of productions is not satisfied, determines to use an original not having the light-shielding region. The information processing device according to claim 3, characterized in that the exposure processing conditions include one or both of the speed at which the exposure processing is performed and the slit width through which the exposure light passes in the exposure processing. The information processing device according to claim 4, characterized in that the correction residual is a distortion amount that cannot be removed even if the correction is performed according to the scanning position in scanning exposure. The information processing device according to claim 3, further comprising a transmission unit that transmits the result determined by the determination unit. a determination unit that determines a mask to be used based on exposure processing conditions and an arrangement of chip regions;
The information processing apparatus, wherein the determination unit determines whether the exposure process is to be completed by one exposure or by two or more exposures. a determination unit that determines a mask to be used based on exposure processing conditions and an arrangement of chip regions;
The information processing apparatus, wherein the determining unit determines whether or not a light blocking member is attached to the original. An information processing apparatus according to any one of claims 3 to 9, which judges an original used for exposure;
a projection optical system that projects a pattern provided on the original determined to be used for exposure by the information processing device;
1. A lithography apparatus comprising: A determination step of determining an original to be used for exposure by using the information processing device according to any one of claims 3 to 9;
a forming step of forming a pattern on a substrate using the original determined in the determining step;
a manufacturing process for manufacturing an article from the substrate on which the pattern is formed in the forming process;
A method for producing an article, comprising the steps of:

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