JP2024036861A - 半導体素子 - Google Patents

半導体素子 Download PDF

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Publication number
JP2024036861A
JP2024036861A JP2022141384A JP2022141384A JP2024036861A JP 2024036861 A JP2024036861 A JP 2024036861A JP 2022141384 A JP2022141384 A JP 2022141384A JP 2022141384 A JP2022141384 A JP 2022141384A JP 2024036861 A JP2024036861 A JP 2024036861A
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Japan
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layer
semiconductor layer
semiconductor
electrode
cnts
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JP2022141384A
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Japanese (ja)
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JP2024036861A5 (https=
Inventor
光夫 浅井
Mitsuo Asai
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Kao Corp
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Kao Corp
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Publication of JP2024036861A publication Critical patent/JP2024036861A/ja
Publication of JP2024036861A5 publication Critical patent/JP2024036861A5/ja
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  • Electrodes Of Semiconductors (AREA)
  • Thin Film Transistor (AREA)
JP2022141384A 2022-09-06 2022-09-06 半導体素子 Pending JP2024036861A (ja)

Priority Applications (1)

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JP2022141384A JP2024036861A (ja) 2022-09-06 2022-09-06 半導体素子

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JP2022141384A JP2024036861A (ja) 2022-09-06 2022-09-06 半導体素子

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JP2024036861A true JP2024036861A (ja) 2024-03-18
JP2024036861A5 JP2024036861A5 (https=) 2025-06-19

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250054755A1 (en) * 2023-08-07 2025-02-13 Wisconsin Alumni Research Foundation Surface-water-assisted deposition of patterned films of aligned nanoparticles

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009093698A1 (ja) * 2008-01-24 2009-07-30 Nec Corporation カーボンナノチューブ分散膜の形成方法及び半導体素子の製造方法
US20180204898A1 (en) * 2017-01-16 2018-07-19 Boe Technology Group Co., Ltd. Thin film transistor and manufacturing method thereof, array substrate and display device
WO2021054143A1 (ja) * 2019-09-20 2021-03-25 東レ株式会社 半導体装置用基板、半導体装置用基板の製造方法および無線通信装置の製造方法
WO2021149582A1 (ja) * 2020-01-24 2021-07-29 国立大学法人東海国立大学機構 積層体、積層体の製造方法、および、積層体を備えるデバイス
JP2022025051A (ja) * 2020-07-28 2022-02-09 日本電気株式会社 ボロメータ及びその製造方法
US20220069243A1 (en) * 2018-12-21 2022-03-03 National Research Council Of Canada Thin film transistors comprising carbon nanotube networks encapsulated by a polymeric layer and methods for the manufacture thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009093698A1 (ja) * 2008-01-24 2009-07-30 Nec Corporation カーボンナノチューブ分散膜の形成方法及び半導体素子の製造方法
US20180204898A1 (en) * 2017-01-16 2018-07-19 Boe Technology Group Co., Ltd. Thin film transistor and manufacturing method thereof, array substrate and display device
US20220069243A1 (en) * 2018-12-21 2022-03-03 National Research Council Of Canada Thin film transistors comprising carbon nanotube networks encapsulated by a polymeric layer and methods for the manufacture thereof
WO2021054143A1 (ja) * 2019-09-20 2021-03-25 東レ株式会社 半導体装置用基板、半導体装置用基板の製造方法および無線通信装置の製造方法
WO2021149582A1 (ja) * 2020-01-24 2021-07-29 国立大学法人東海国立大学機構 積層体、積層体の製造方法、および、積層体を備えるデバイス
JP2022025051A (ja) * 2020-07-28 2022-02-09 日本電気株式会社 ボロメータ及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250054755A1 (en) * 2023-08-07 2025-02-13 Wisconsin Alumni Research Foundation Surface-water-assisted deposition of patterned films of aligned nanoparticles

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