JP2024034720A - How to divide the package board - Google Patents

Abstract

An object of the present invention is to provide a method for dividing a package substrate that can reduce burrs generated around half-cut grooves without damaging the top surface of the package substrate. A method for dividing a package board includes a first measurement step of measuring the height of the top surface of a package board 100 held on a holding table 10 and generating first height data; a half-cut groove forming step of forming a half-cut groove with the first cutting blade 21 positioned at a height to form a groove of a predetermined depth based on the first height data; A burr reduction step in which the deburring tool and the holding table 10 are relatively moved with the deburring tool positioned at a height of A dividing step of dividing the package substrate with a second cutting blade having a blade thickness thinner than the groove. [Selection diagram] Figure 5

Description

The present invention relates to a method for dividing a package substrate.

In the process of forming grooves on a package substrate, there is a problem in that burrs are generated around the grooves. A processing method that removes burrs or presses them downward to reduce the height of burrs by scanning a cutting blade over the upper surface of the machined groove in order to remove at least a portion of the burrs or reduce the height of the burrs. known (for example, see Patent Document 1).

Japanese Patent Application Publication No. 2001-077055

However, if the processed groove is a half-cut groove, the warpage of the package substrate may not be sufficiently alleviated, and if the cutting blade is not positioned at a height that takes the warp into consideration, the step of reducing burrs may damage the package substrate. There was a risk that it would happen.

The present invention has been made in view of such problems, and an object thereof is to provide a method for dividing a package substrate that can reduce burrs generated around half-cut grooves without damaging the top surface of the package substrate. That's true.

In order to solve the above-mentioned problems and achieve the objectives, the method for dividing a package substrate of the present invention is a method for dividing a package substrate into a plurality of chips, which is attached to an opening of an annular frame via a dicing tape. The dividing method includes a holding step of holding the package substrate on a holding table, measuring at least one line of the height of the upper surface of the package substrate held on the holding table along a planned dividing line, and measuring a first height. A first measurement step that generates data, and a first cutting blade positioned at a height that forms a groove of a predetermined depth based on the first height data, cuts a half-cut groove along the planned dividing line. Based on the half-cut groove forming step and the first height data, the deburring tool is positioned at a predetermined height from the top surface of the package substrate, and the deburring tool is positioned along the dividing line. a burr reduction step of moving the holding table relatively to reduce the height of burrs generated around the half-cut groove; and after performing the burr reduction step, moving the half-cut groove along the half-cut groove; The present invention is characterized by comprising a dividing step of dividing the package substrate into a plurality of chips using a second cutting blade having a blade thickness thinner than the cut groove.

In addition, in order to solve the above-mentioned problems and achieve the object, the method for dividing a package substrate of the present invention includes dividing a package substrate stuck to an opening of an annular frame via a dicing tape into a plurality of chips. A method for dividing a substrate, comprising a holding step of holding a package substrate on a holding table, measuring the height of the upper surface of the package substrate held on the holding table at least one line along a planned dividing line; A first measurement step that generates height data, and a first cutting blade positioned at a height that forms a groove of a predetermined depth based on the first height data, and a half cut along the planned dividing line. a half-cut groove forming step of forming a groove, and a step of measuring at least one line of the height of the upper surface of the package substrate along the dividing line to generate second height data after the half-cut groove forming step; Based on the second measurement step and the second height data, with the deburring tool positioned at a predetermined height from the top surface of the package substrate, the deburring tool and the holding table are moved along the planned dividing line. a burr reduction step in which the height of burrs generated around the half-cut groove is reduced by relatively moving the burrs; The present invention is characterized by comprising a dividing step of dividing the package substrate into a plurality of chips using a second cutting blade having a thin blade thickness.

Before the holding step, the method may further include a protective member covering step of covering the upper surface of the package substrate with a protective member.

The second measuring step measures the height of the burr in addition to the height of the top surface of the package substrate, and the burr reduction step measures whether the height of the burr exceeds a threshold value based on the second height data. It may be carried out on the part where it is located.

The deburring tool may be the first cutting blade.

The deburring tool may be a cutting tool.

The present invention moves the deburring tool while adjusting the height of the deburring tool according to the position on the planned dividing line based on the first height data acquired in the first measuring step, and removes the burr. Since the height is reduced, the height of burrs generated around the half-cut groove can be reduced without damaging the top surface of the package substrate.

FIG. 1 is a top view showing a state in which a package substrate to be divided in the package substrate dividing method according to the first embodiment is supported by an annular frame. FIG. 2 is a perspective view showing a package chip obtained by dividing the package substrate of FIG. FIG. 3 is a perspective view illustrating a configuration example of a processing apparatus that implements the package substrate dividing method according to the first embodiment. FIG. 4 is a flowchart illustrating an example of the processing procedure of the package substrate dividing method according to the first embodiment. FIG. 5 is a cross-sectional view illustrating the holding step and first measurement step in FIG. 4. FIG. 6 is a cross-sectional view illustrating the half-cut groove forming step of FIG. 4. FIG. 7 is a cross-sectional view illustrating the half-cut groove forming step of FIG. 4. FIG. 8 is a cross-sectional view showing an example of the state of the package substrate after the half-cut groove forming step of FIG. 4 is performed. FIG. 9 is a cross-sectional view illustrating the burr reduction step of FIG. 4. FIG. 10 is a cross-sectional view illustrating the burr reduction step of FIG. 4. FIG. 11 is a cross-sectional view illustrating the burr reduction step of FIG. 4. FIG. 12 is a cross-sectional view illustrating the dividing step of FIG. 4. FIG. 13 is a flowchart illustrating an example of a processing procedure of a method for dividing a package substrate according to the second embodiment. FIG. 14 is a perspective view showing a configuration example of a processing apparatus that implements the method for dividing a package substrate according to the third embodiment. FIG. 15 is an explanatory diagram showing an example of the configuration of main parts of the processing apparatus shown in FIG. 14. FIG. 16 is a cross-sectional view illustrating the burr reduction step of the third embodiment.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Further, the constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Further, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
A method for dividing a package substrate according to Embodiment 1 of the present invention will be explained based on the drawings. First, in this specification, a package substrate 100 that is a processing target of the package substrate dividing method according to the first embodiment will be described with reference to the drawings. FIG. 1 is a top view showing a state in which a package substrate 100 to be divided in the package substrate dividing method according to the first embodiment is supported by an annular frame 132. FIG. 2 is a perspective view showing a package chip 140 obtained by dividing the package substrate 100 of FIG.

The package substrate 100 is partitioned on the surface by a plurality of dividing lines 112 formed along a first direction and a second direction intersecting (perpendicular in the first embodiment) the first direction. A device is placed in the area, and the device is sealed with resin. In the first embodiment, the package substrate 100 includes a metal frame 110 and a mold resin 120, as shown in FIGS. 1 and 2. The metal frame 110 is made of metal and is a flat plate having a rectangular planar shape. As shown in FIG. 1, the package substrate 100 has a plurality of dividing lines 112 formed along the longitudinal direction and the transverse direction on the surface 111 of the metal frame 110 (the surface on the back side of the paper in FIG. 1). A chip mounting area 113 is formed. The package substrate 100 is divided along the planned dividing line 112 to obtain a plurality of package chips 140. The package chip 140 is an example of a chip according to the present invention. As shown in FIG. 2 showing the package chip 140 after division, the package substrate 100 has the device chip 114 arranged in the chip mounting area 113 before division. Since the metal frame 110 is a ductile material, it is a member in which burrs 300 (see FIG. 8) are expected to be generated on the processed surface (back surface 117) by cutting with the first cutting blade 21 described later. The mold resin 120 is made of, for example, thermosetting resin. The mold resin 120 seals the device chip 114 mounted in the chip mounting area 113 of the metal frame 110 on the surface 111 of the metal frame 110, as shown in FIGS. 1 and 2.

In the package substrate 100 of the first embodiment, a plurality of (16 in the example shown in FIG. 1) chip mounting areas 113 are arranged adjacent to each other across the dividing line 112. In the first embodiment, the metal frame 110 of the package substrate 100 is a QFN package (Quad For Non-lead package) substrate with a leadless structure in which electrode pads are formed as connection terminals instead of leads, and a plurality of A chip mounting area 113, an electrode portion 115 corresponding to an electrode pad of a QFN package arranged around each chip mounting area 113 and protruding toward the dividing line 112, and a plurality of chip mounting areas arranged in a group adjacent to each other. 113 and a surplus area 116 in which no device chip 114 is mounted. As shown in FIG. 1, the electrode section 115 is divided from the outer periphery of the device chip 114 mounted in the chip mounting area 113 on the back surface 117 of the metal frame 110 opposite to the front surface 111. It is formed to extend across the planned division line 112 to the adjacent chip mounting area 113 or surplus area 116 with the planned line 112 in between, and to have a thickness equal to or greater than the depth 142 shown in FIG. 2 . The chip mounting area 113 and the electrode section 115 of the package substrate 100 are both covered with the mold resin 120 on the front surface 111 side, and are not covered with the mold resin 120 on the back surface 117 side and are exposed.

The mold resin 120 is formed so as to cover the surface 111 side of a plurality of chip mounting areas 113 that are arranged in a group adjacent to each other. In the example shown in FIG. 1, the package substrate 100 has groups of a plurality of chip mounting areas 113 arranged in the longitudinal direction and is formed in three locations, and molds are formed in correspondence with the groups of the plurality of chip mounting areas 113. Resin 120 is arranged in the longitudinal direction and formed at three locations.

Due to the difference in thermal contraction rate between the metal frame 110 and the mold resin 120, the package substrate 100 is curved in a direction that is convex toward the metal frame 110 and concave toward the mold resin 120 when viewed from the side. It has a warp. The package substrate 100 can be half-cut by cutting, which will be described later, depending on the combination of the metal frame 110 and the mold resin 120, the bonding state between the metal frame 110 and the mold resin 120, the processing conditions of the half-cut groove 201, etc. There are types in which the distribution of warpage changes only slightly even when the grooves 201 are formed, and types in which the distribution of warpage changes significantly. In the first embodiment, the package substrate 100 is of a type in which the distribution of warpage changes only within a small range, and in the second embodiment, which will be described later, the distribution of warp changes greatly.

In the first embodiment of the package substrate 100, as shown in FIG. 1, a dicing tape 131 is attached to the surface 111 side on which the mold resin 120 is formed, and the outer edge of the dicing tape 131 is attached to the annular frame 132. As a result, it is supported by being attached to the opening of the annular frame 132 via the dicing tape 131 with the back surface 117 side exposed. The dicing tape 131 is an adhesive tape with a two-layer structure having a base material layer that is flexible and non-adhesive, and an adhesive layer that is laminated on the base material layer and is flexible and adhesive, or an adhesive layer. A sheet made of thermoplastic resin that does not have When the dicing tape 131 is a non-adhesive thermoplastic resin sheet, it is preferably a polyolefin sheet, a polyethylene sheet, a polypropylene sheet, or a polystyrene sheet, and is adhered to the annular frame 132 and the package substrate 100 by thermocompression bonding.

In the package substrate 100, a half-cut groove 201 (see FIG. 7) having a depth of 142 is formed along the dividing line 112 of each chip mounting area 113 by a package substrate dividing method described later. The center portion in the width direction is cut and divided into package chips 140 shown in FIG. 2. The package chip 140 is a QFN package chip, and as shown in FIG. 2, a chip mounting area 113 on which the device chip 114 is mounted is arranged in the center, and an electrode portion 115 corresponding to the electrode pad of the QFN package chip is provided on the outer edge. It is placed. The electrode portion 115 of the package chip 140 is fixed to a wiring board such as a printed circuit board, for example, via solder. In the package chip 140, a step portion 141 with a depth of 142 is formed from the back surface 117 all around the outer edge by a half-cut groove 201 with a depth of 142, so that the outer edge including the cut surface of the electrode portion 115 is formed in a stepped shape. This is a so-called wettable flank type chip in which the solder contact area in the electrode portion 115 is increased by increasing the solder contact area in the electrode portion 115.

Next, in this specification, a processing apparatus 1 that implements a method for dividing a package substrate according to a first embodiment will be described with reference to the drawings. FIG. 3 is a perspective view showing a configuration example of a processing apparatus 1 that implements the method for dividing a package substrate according to the first embodiment. As shown in FIG. 3, the processing device 1 includes a holding table 10, a processing unit 20, an imaging unit 30, a height measurement unit 40, an X-axis movement unit 51, a Y-axis movement unit 52, and a Z-axis movement unit 51. It includes a moving unit 53 and a control unit 60.

The holding table 10 has a disc-shaped frame body in which a recess is formed, and a disc-shaped suction part fitted into the recess. The suction portion of the holding table 10 is made of porous ceramic or the like, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). As shown in FIG. 3, the upper surface of the suction section of the holding table 10 is a holding surface 11 on which the package substrate 100 is placed and which holds the placed package substrate 100 by suction. In the first embodiment, the package substrate 100 is placed on the holding surface 11 with the back surface 117 facing upward, and the holding surface 11 suction-holds the placed package substrate 100 from the front surface 111 side via the dicing tape 131 . The holding surface 11 and the upper surface of the frame of the holding table 10 are arranged on the same plane and are formed parallel to the horizontal plane XY plane. The holding table 10 is movable in the X-axis direction, which is one horizontal direction, by an X-axis moving unit 51, and is movable in the vertical direction, parallel to the Z-axis direction, which is perpendicular to the holding surface 11, by a rotational drive source (not shown). It is rotatable around an axis.

Further, as shown in FIG. 3, the holding table 10 includes four frames arranged on the outer periphery of the frame body and holding and fixing an annular frame 132 attached to the package substrate 100 via a dicing tape 131. It includes a clamp 12 which is a holding part.

As shown in FIG. 3, the processing unit 20 includes a processing unit 20-1 and a processing unit 20-2. The processing unit 20-1 and the processing unit 20-2 both process the package substrate 100 held on the holding table 10. The processing apparatus 1 is a so-called facing dual type processing apparatus (cutting apparatus) that includes two sets of processing units 20-1 and 20-2, that is, a two-spindle dicer. Hereinafter, when distinguishing each part related to the processing unit 20-1 from each part related to the processing unit 20-2, "-1" is added after the code, and each part related to the processing unit 20-2 is distinguished from each part related to the processing unit 20-2. When distinguishing each part related to 20-1, "-2" is added to the end of the code. If there is no need to distinguish between the machining unit 20-1 and the machining unit 20-2, the corresponding parts are assumed to be common to both, and neither "-1" nor "-2" is added after the code. They are omitted as appropriate without being attached.

In the first embodiment, the processing unit 20 includes a spindle 23 to which the first cutting blade 21 or the second cutting blade 22 is attached at the tip, as shown in FIG. This is a cutting unit that performs cutting processing. The first cutting blade 21 and the second cutting blade 22 are each detachably and replaceably attached to the tip of the spindle 23. Both the first cutting blade 21 and the second cutting blade 22 are rotated by a spindle 23 about an axis parallel to the Y-axis direction, which is another horizontal direction and perpendicular to the X-axis direction. , the package substrate 100 held on the holding table 10 is cut. The processing unit 20 is provided so as to be movable in the Y-axis direction by a Y-axis movement unit 52 with respect to the package substrate 100 held on the holding table 10, and is movable in the Z-axis direction by a Z-axis movement unit 53. It is provided.

In the first embodiment, the first cutting blade 21 and the second cutting blade 22 have annular cutting blades each having a first blade thickness of 25 (see FIG. 7) and a second blade thickness of 26 (see FIG. 12). . The cutting edge of the second cutting blade 22 has a thinner blade thickness than the cutting edge of the first cutting blade 21, that is, the second blade thickness 26 is smaller than the first blade thickness 25.

In the first embodiment, the first cutting blade 21 and the second cutting blade 22 are, for example, so-called metal made of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bond material (binding material) such as metal or resin. It has a bond type blade cutting edge. The first cutting blade 21 and the second cutting blade 22 may be hub blades having a hub or hubless blades not having a hub. The first cutting blade 21 and the second cutting blade 22 are not limited to this in the present invention, and may have a cutting edge of an electroformed bond type blade in which abrasive grains are fixed to the plating layer, or a high-speed Even if the metal saw has a serrated blade made of a thin steel plate blade made of high-speed steel or cemented carbide obtained by sintering tungsten carbide, cobalt, nickel, etc. good.

In the processing device 1, the first cutting blade 21 or the second cutting blade 22 attached to the tip of the spindle 23 is held on the holding table 10 by an X-axis movement unit 51, a Y-axis movement unit 52, and a Z-axis movement unit 53. The first cutting blade 21 or the second cutting blade 22 attached to the tip of the spindle 23 is set at a predetermined position with respect to the package substrate 100 and is rotated relative to the package substrate 100 along the dividing line 112. , the package substrate 100 is cut along the dividing line 112 with the first cutting blade 21 or the second cutting blade 22 attached to the tip of the spindle 23 to form the half-cut groove 201 or the processed groove 202. (see FIG. 12). Thus, in the processing device 1, the first cutting blade 21 and the second cutting blade 22 function as cutting tools.

The processing device 1 uses an X-axis movement unit 51, a Y-axis movement unit 52, and a Z-axis movement unit 53 to move a first cutting blade 21 attached to the tip of a spindle 23 to a package substrate after cutting, which is held on a holding table 10. 100 at a predetermined position, and while rotating the first cutting blade 21 attached to the tip of the spindle 23, the first cutting blade 21 is cut so as to intersect the half-cut groove 201 formed along the dividing line 112 in the package substrate 100. By moving the groove relatively along the direction, the first cutting blade 21 attached to the tip of the spindle 23 generates a groove upward (+Z direction) from the half-cut groove 201 formed in the package substrate 100 by cutting. A burr reduction process is performed to reduce the height of the burr 300. In this way, in the processing device 1, the first cutting blade 21 functions as a burr removal tool that further performs burr reduction processing.

In the first embodiment, the processing device 1 has the first cutting blade 21 attached to the tip of the spindle 23-1 of the processing unit 20-1, and is held on the holding table 10 by the first cutting blade 21 by the processing unit 20-1. The second cutting blade 22 is attached to the tip of the spindle 23-2 of the processing unit 20-2, and the holding table 10 is cut with the second cutting blade 22 by the processing unit 20-2. The package substrate 100 held by the package substrate 100 is cut. Note that the processing device 1 is not limited to this in the present invention, and the second cutting blade 22 may be attached to the tip of the spindle 23-1 of the processing unit 20-1, or the second cutting blade 22 may be attached to the tip of the spindle 23-1 of the processing unit 20-2. The first cutting blade 21 may be attached to the tip of -2.

In the first embodiment, the imaging unit 30 is fixed to the processing unit 20 so as to move integrally with the processing unit 20. The imaging unit 30 includes an imaging element that images the back surface 117 (exposed surface) of the uncut package substrate 100 held on the holding table 10 and the planned dividing line 112 . The image sensor is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor. The imaging unit 30 images the back surface 117 of the package substrate 100 before cutting, which is held on the holding table 10 , and images the package substrate 100 and the first cutting blade 21 or the second cutting blade attached to the tip of the spindle 23 . An image for performing alignment with 22 is obtained, and the obtained image is output to the control unit 60.

In the first embodiment, the height measurement unit 40 is fixed to the imaging unit 30 so as to move integrally with the processing unit 20 and the imaging unit 30. The height measurement unit 40 measures the height of the top surface (back surface 117 in the first embodiment) of the package substrate 100 held on the holding table 10. In the first embodiment, the height measurement unit 40 is a laser displacement meter that measures the distance to the top surface of the package substrate 100 by irradiating a laser beam toward the top surface of the package substrate 100. The height measurement unit 40 is positioned at a preset position in the Z-axis direction and measures the distance to the top surface of the package substrate 100, thereby measuring the height of the top surface of the package substrate 100 from the holding surface 11 of the holding table 10. The height is measured and the measurement result is output to the control unit 60. When a burr 300 is formed on the package substrate 100, the height measuring unit 40 can measure the height of the upper end of the burr 300 from the holding surface 11 of the holding table 10. Note that the height measuring unit 40 is not limited to a laser displacement meter in the present invention, and for example, measures the height of the upper surface of the package substrate 100 from the holding surface 11 of the holding table 10 by blowing air onto the upper surface of the package substrate 100. It may be a back pressure sensor that measures the height of the top surface of the package substrate 100 from the holding surface 11 of the holding table 10 using a contact that comes into contact with the top surface of the package substrate 100. There may be.

The X-axis moving unit 51 moves the holding table 10 along the X-axis direction relative to the processing unit 20, the imaging unit 30, and the height measurement unit 40. The Y-axis moving unit 52 moves the processing unit 20, the imaging unit 30, and the height measuring unit 40 along the Y-axis direction relative to the holding table 10. The Z-axis moving unit 53 moves the processing unit 20, the imaging unit 30, and the height measuring unit 40 along the Z-axis direction relative to the holding table 10. The X-axis movement unit 51, the Y-axis movement unit 52, and the Z-axis movement unit 53 each include, for example, well-known balls rotatably provided around axes along the X-axis direction, the Y-axis direction, and the Z-axis direction. It is equipped with a well-known pulse motor that rotates a screw or a ball screw around its axis, and a well-known guide rail that supports the holding table 10 or the processing unit 20 movably in the X-axis direction, Y-axis direction, and Z-axis direction. It is configured. The X-axis movement unit 51, the Y-axis movement unit 52, and the Z-axis movement unit 53 move the holding table 10, the processing unit 20, the imaging unit 30, and the height measurement unit 40 in the X-axis direction, Y-axis direction, and Z-axis direction. and outputs the detected relative position to the control unit 60.

The control unit 60 controls the operations of various components of the processing apparatus 1 and causes the processing apparatus 1 to implement the package substrate dividing method according to the first embodiment. Control unit 60 includes a computer system in this embodiment. The computer system included in the control unit 60 includes an arithmetic processing unit having a microprocessor such as a CPU (Central Processing Unit), a storage device having a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), It has an input/output interface device. The arithmetic processing device of the control unit 60 performs arithmetic processing according to a computer program stored in the storage device of the control unit 60 and sends control signals for controlling the processing device 1 to the input/output interface device of the control unit 60. It is output to each component of the processing device 1 via.

The processing apparatus 1 further includes a cassette mounting table 70, a cleaning unit 80, and a transport unit (not shown). The cassette mounting table 70 is a mounting table on which a cassette 75, which is a container for accommodating a plurality of package substrates 100, is placed, and the placed cassette 75 is raised and lowered in the Z-axis direction. The cleaning unit 80 cleans the package substrate 100 after cutting and removes foreign matter such as cutting debris attached to the package substrate 100. A transport unit (not shown) transports the package substrate 100 before cutting from inside the cassette 75 onto the holding table 10, transports the package substrate 100 after cutting from the holding table 10 to the cleaning unit 80, and transfers the package substrate 100 after cutting from the holding table 10 to the cleaning unit 80. The package substrate 100 is transferred from the cleaning unit 80 into the cassette 75.

Next, in this specification, a method for dividing a package substrate according to Embodiment 1 will be described with reference to the drawings. FIG. 4 is a flowchart illustrating an example of the processing procedure of the package substrate dividing method according to the first embodiment. FIG. 5 is a cross-sectional view illustrating the holding step 1002 and first measurement step 1003 in FIG. 6 and 7 are cross-sectional views illustrating the half-cut groove forming step 1004 of FIG. 4. FIG. 8 is a cross-sectional view showing an example of the state of the package substrate 100 after the half-cut groove forming step 1004 of FIG. 4 is performed. 9, 10, and 11 are cross-sectional views illustrating the burr reduction step 1005 of FIG. 4. FIG. 12 is a cross-sectional view illustrating the dividing step 1006 of FIG. The package substrate dividing method according to the first embodiment is an example of an operation process performed by the processing apparatus 1, and as shown in FIG. , a half-cut groove forming step 1004 , a burr reduction step 1005 , and a dividing step 1006 . The method for dividing a package substrate according to the first embodiment is to divide a package substrate 100 of a type in which it is known that the warp distribution of the package substrate 100 changes only slightly by forming the half-cut grooves 201 in the half-cut groove forming step 1004. This method is used when dividing the .

In the package substrate dividing method according to the first embodiment, first, a dicing tape 131 is attached to the front surface 111 side of the package substrate 100, and an annular frame 132 is attached to the outer edge of the dicing tape 131, thereby dividing the package substrate 100. The dicing tape 131 is attached to the opening of the annular frame 132 with the back surface 117 side exposed.

The protective member covering step 1001 is a step of covering the upper surface (the back surface 117 in the first embodiment) of the package substrate 100 with a protective member before the holding step 1002. The protective member covered in the protective member covering step 1001 can be composed of an adhesive sheet, a heat-softening wax, a temporary adhesive, an ultraviolet curing resin, or the like. By covering the back surface 117 of the package substrate 100 with this protective member, burrs 300 that tend to extend upward from the processed surface (back surface 117) (in the direction protruding from the processed surface in the thickness direction of the package substrate 100) are prevented. The occurrence of can be effectively suppressed.

In the protective member coating step 1001, for example, the package substrate 100 is placed on a hot plate, a thermosetting wax made of a material constituting the protective member is placed on the back surface 117 of the package substrate 100, and the hot plate is used to cover the package substrate 100. By increasing the temperature on the back surface 117 of the package substrate 100 by heating, the thermosetting wax on the back surface 117 of the package substrate 100 is melted, and the melted thermosetting wax is applied to the back surface 117 of the package substrate 100. A protective member is formed using melted thermosetting wax. Note that the protective member covering step 1001 is not limited to the method using thermosetting wax, but may also be performed by pasting an adhesive sheet as a protective member on the back surface 117 of the package substrate 100, or using a temporary adhesive or ultraviolet curing adhesive. A resin may be applied to the back surface 117 of the package substrate 100 as a protective member.

In Embodiment 1, the package substrate 100 is attached to the opening of the annular frame 132 via the dicing tape 131 and then covered with the protective member, but the present invention is not limited to this, and the protective member may be covered with the protective member. After coating, the package substrate 100 may be attached to the opening of the annular frame 132 via the dicing tape 131.

In the first embodiment, the package substrate 100 that is attached to the opening of the annular frame 132 via the dicing tape 131 and whose back surface 117 is coated with a protective member is housed in the cassette 75, and the cassette 75 is It is placed on the mounting table 70, and the holding step 1002 and subsequent steps are performed.

In the first embodiment, the protective member covering step 1001 is performed, but the present invention is not limited to this and may be omitted as it is not essential. When the protective member covering step 1001 is omitted, the package substrate 100 attached to the opening of the annular frame 132 via the dicing tape 131 is housed in the cassette 75, and the cassette 75 is placed on the cassette mounting table 70. Then, the holding step 1002 and subsequent steps are performed.

The holding step 1002 is a step of holding the package substrate 100 on the holding table 10. In the holding step 1002, as shown in FIG. 5, the control unit 60 uses the transport unit to hold the package substrate 100 stuck to the opening of the annular frame 132 via the dicing tape 131 with the back surface 117 facing upward. The package substrate 100 placed on the holding surface 11 of the table 10 is placed on the holding surface 11 of the table 10, and the package substrate 100 placed on the holding surface 11 is suction-held from the surface 111 side via the dicing tape 131. An annular frame 132 attached to the dicing tape 100 via a dicing tape 131 is held.

In the holding step 1002, the control unit 60 further detects the planned dividing line 112 using the imaging unit 30, and performs alignment to align the detected planned dividing line 112 and the processing unit 20. In the holding step 1002, in the first embodiment, the detected dividing line 112 and the processing units 20-1 and 20-2 are aligned.

The first measuring step 1003 is a step of measuring the height of the back surface 117, which is the upper surface of the package substrate 100 held on the holding table 10, along at least one line along the dividing line 112 to generate first height data. be. In Embodiment 1, the first measuring step 1003 is performed by the height measuring unit 40, which is fixed so as to move integrally with the processing unit 20-1, but in the present invention, this is not performed. The height measurement unit 40 may be fixed to move integrally with the processing unit 20-2, but is not limited thereto.

Here, the first height data includes height data along at least one scheduled dividing line 112 on the upper surface of the package substrate 100 before cutting held on the holding table 10 and all scheduled dividing lines 112. This is a database containing the height distribution of . Further, the height data along the planned dividing line 112 includes the X coordinate and Y coordinate representing each position on the planned dividing line 112, and the holding surface 11 of the holding table 10 on the upper surface of the package substrate 100 at each position. This is data that correlates the measurement data of the height from . The height data along this planned dividing line 112 can be expressed in a graph, for example, with the direction along the planned dividing line 112 as the horizontal axis and the measured height data as the vertical axis. Furthermore, the height data along this planned division line 112 is a curved line that is upwardly convex due to the nature of the package substrate 100 being curved in a direction that is convex toward the back surface 117 when viewed from the side. .

In the first measurement step 1003, as shown in FIG. While the unit 51 moves the height measuring unit 40 along the planned dividing line 112 relative to the package substrate 100 held on the holding table 10, the height measuring unit 40 measures the dividing line 112 along the scheduled dividing line 112. By measuring the height along the planned dividing line 112, data on the height along the planned dividing line 112 is obtained. In the first measurement step 1003, the control unit 60 similarly acquires height data along all the planned division lines 112 of the package substrate 100 held on the holding table 10 using the height measurement unit 40. By doing so, first height data is obtained. In the first embodiment, since the first height data acquired in the first measurement step 1003 is used in the burr reduction step 1005, the height measurement unit 40 measures the height of the package substrate 100 held on the holding table 10 in this way. It is preferable to obtain highly accurate first height data by obtaining height data along all of the planned division lines 112.

Note that in the first measurement step 1003, the control unit 60 measures the height data of the package substrate 100 held on the holding table 10 along all of the planned division lines 112 by using the height measurement unit 40. Then, the height data along some of the scheduled dividing lines 112 and at least one scheduled dividing line 112 is measured by the height measuring unit 40, and based on the data acquired by this measurement, the control unit 60 The first height data is generated by using a height calculation program stored in the storage device to generate height data along the planned division line 112 that is not measured by the height measurement unit 40. Good too. Here, the height calculation program estimates the height of the top surface of the package substrate 100 based on the height data obtained by measurement and the warpage tendency of the package substrate 100 inputted in advance. It is calculated. In addition, height data was obtained by measuring the height of a plurality of planned dividing lines 112 every few lines, and height data of the planned dividing lines 112 that were not measured was measured using a height calculation program. It may also be generated by finding the slope between the height data and interpolating it.

In the half-cut groove forming step 1004, the first cutting blade 21 is positioned at a height to form a half-cut groove 201 with a predetermined depth 142 based on the first height data generated in the first measurement step 1003. This is a step of forming a half-cut groove 201 along the planned line 112. In the first embodiment, the half-cut groove forming step 1004 is performed by the first cutting blade 21 attached to the spindle 23-1 of the processing unit 20-1, as shown in FIGS. 6 and 7.

In the half-cut groove forming step 1004, as shown in FIG. 6 and FIG. While adjusting the height of the blade 21 according to the position on the planned dividing line 112, the first cutting blade 21 is moved relative to the package substrate 100 along the planned dividing line 112 by the X-axis moving unit 51. By cutting the package substrate 100 from the back surface 117 side with the first cutting blade 21 along the planned dividing line 112, the depth 142 and the first blade thickness 25 are cut along the planned dividing line 112 of the package substrate 100. A half-cut groove 201 with a width corresponding to . In the half-cut groove forming step 1004, the control unit 60 sets the height of the lower end of the cutting blade of the first cutting blade 21 to a height that is lower by a depth of 142 than the upper surface of the package substrate 100 based on the first height data. position and adjust. In the half-cut groove forming step 1004, the control unit 60 moves the first cutting blade 21 relative to the package substrate 100 along an upwardly convex curve based on the first height data.

As shown in FIG. 8, when the package substrate 100 is cut to form the half-cut grooves 201 in the half-cut groove forming step 1004, the metal frame 110 on the processed surface (back surface 117) side is made of a ductile material. Due to certain characteristics, burrs 300 are generated upward from the half-cut groove 201 on the machined surface. Furthermore, in the first embodiment, the package substrate 100 is held on the holding table 10 due to the nature that the distribution of warpage changes only slightly due to the cutting process in the half-cut groove forming step 1004 to form the half-cut grooves 201. The height distribution of the back surface 117, which is the top surface of the package substrate 100, is maintained with only slight changes.

In the burr reduction step 1005, based on the first height data generated in the first measurement step 1003, the deburring tool is positioned at a predetermined height from the top surface of the package substrate 100, and along the planned dividing line 112, This is a step of relatively moving the deburring tool and the holding table 10 to reduce the height of the burr 300 generated upward from the half-cut groove 201. In the first embodiment, the burr reduction step 1005 uses the first cutting blade 21 attached to the spindle 23-1 of the processing unit 20-1 as a burr removal tool, as shown in FIGS. 9, 10, and 11. Implemented by Note that the burr reduction step 1005 may use the second cutting blade 22 or a third cutting blade that is different from both the first cutting blade 21 and the second cutting blade 22.

In the burr reduction step 1005, first, the control unit 60 rotates the first cutting blade 21 and selects the center in the width direction of the planned dividing line 112 in which the half-cut groove 201 is formed or the planned dividing line in which the half-cut groove 201 is formed. 112 in the width direction (see FIGS. 10 and 11), and the Z-axis moving unit 53 changes the height of the first cutting blade 21 to the first height based on the first height data. Adjustment is made according to the position on the planned division line 112 closest to the cutting blade 21. In the burr reduction step 1005, the control unit 60 sets the height of the lower end of the cutting blade of the first cutting blade 21 to a height higher than the upper surface of the package substrate 100 based on the first height data by a burr allowable height of 310. position and adjust. Here, the allowable burr height 310 is the height of the burr at which the wiring does not get caught during wire bonding, and the height at which the burr does not come into contact with the upper surface of the package substrate 100 based on the first height data in the burr reduction step 1005. , in Embodiment 1, it is, for example, 10 μm or more and 30 μm or less.

In the burr reduction step 1005, next, as shown in FIG. 9, the control unit 60 moves the first cutting blade 21 based on the first height data using the Z-axis moving unit 53 while rotating the first cutting blade 21. While adjusting the height of the first cutting blade 21 according to the position on the planned dividing line 112 closest to the first cutting blade 21, the X-axis moving unit 51 moves the first cutting blade 21 to the package substrate 100 along the planned dividing line 112. By relatively moving the rotating first cutting blade 21 (scanning with the first cutting blade 21), the rotating first cutting blade 21 removes the burr 300 exceeding the allowable burr height 310, or by extending the burr in the horizontal direction. The height of 300 is reduced to make the burr 320 less than the allowable burr height 310. In this manner, in the burr reduction step 1005, the height of the burr 300 generated around the half-cut groove 201 is reduced without bringing the first cutting blade 21 into contact with the upper surface of the package substrate 100.

To explain in more detail, in the burr reduction step 1005, the control unit 60 positions the first cutting blade 21 at the center in the width direction of the dividing line 112 in which the half-cut groove 201 is formed, and scans with the rotating first cutting blade 21. do. If the height of the burr 300 generated around the half-cut groove 201 can be reduced by this scanning, the burr reduction step 1005 for the planned division line 112 is ended. On the other hand, because the burr 300 extends outward in the width direction from the half-cut groove 201, it is not possible to scan the half-cut groove by only scanning with the first cutting blade 21 positioned at the center in the width direction on the dividing line 112. When the height of the burr 300 generated around the cut groove 201 cannot be reduced enough, the control unit 60 moves the first cutting blade 21 from the center of the planned dividing line 112 in the width direction to one side, as shown in FIG. By scanning with the rotating first cutting blade 21 while shifting the position (see FIG. 10), the height of the burr 300 generated on one side of the half-cut groove 201 is reduced. Thereafter, by moving the first cutting blade 21 to the other side (see FIG. 11) by the Y-axis moving unit 56 and scanning with the rotating first cutting blade 21, the The height of the burr 300 is reduced. By performing this operation sequentially along each scheduled dividing line 112, in the burr reduction step 1005, such a scanning process with the first cutting blade 21 is performed on the scheduled dividing line 112 in which all the half-cut grooves 201 have been formed. is carried out to reduce the height of burrs 300 generated around all half-cut grooves 201.

In the dividing step 1006, after performing the burr reduction step 1005, a second cutting process is performed along the half-cut groove 201 with a second blade thickness 26 narrower than the width of the half-cut groove 201 (width corresponding to the first blade thickness 25). This is a step of dividing the package substrate 100 using the blade 22 to generate a plurality of package chips 140. In the first embodiment, the dividing step 1006 is performed by the second cutting blade 22 attached to the spindle 23-2 of the processing unit 20-2, as shown in FIG.

In the dividing step 1006, as shown in FIG. 12, the control unit 60 moves the second cutting blade 22 to the planned dividing line 112 with respect to the package substrate 100 using the X-axis moving unit 51 while rotating the second cutting blade 22. By cutting the package substrate 100 from the back surface 117 side along the dividing line 112 with the second cutting blade 22, the depth 142 and the depth 142 formed in the half cut groove forming step 1004 are cut. Cutting the center part in the width direction of the half-cut groove 201 with a width corresponding to the first blade thickness 25 to a depth that reaches the front surface 111 from the back surface 117 of the package substrate 100 and a width corresponding to the second blade thickness 26. A groove 202 is formed. In the dividing step 1006, the package substrate 100 is cut along all the planned dividing lines 112 to form processed grooves 202, thereby dividing the package substrate 100 along the planned dividing lines 112 to manufacture the package chips 140. .

Note that a plating step in which the electrode portion 115 is plated may be performed between the burr reduction step 1005 and the dividing step 1006. In the plating step, for example, the package substrate 100 after the burr reduction step 1005 and before the dividing step 1006 is immersed in an electrolytic plating bath for a predetermined period of time by applying a predetermined voltage to the electrode portion 115, thereby removing metal such as nickel. A plating film is formed on the exposed portion of the electrode section 115. Here, the exposed portion of the electrode portion 115 is a portion of the electrode portion 115 that is exposed on the back surface 117 of the metal frame 110 and the side and bottom surfaces of the half-cut groove 201.

The method for dividing a package substrate according to the first embodiment having the above configuration is used when dividing a package substrate 100 of a type in which it is known that the distribution of warpage changes only slightly due to the formation of the half-cut grooves 201. In the half-cut groove forming step 1004 and the burr reduction step 1005, the height of the first cutting blade 21 is adjusted according to the position on the planned dividing line 112 based on the first height data acquired in the first measuring step 1003. At the same time, since the first cutting blade 21 is moved to form the half-cut groove 201 and reduce the height of the burr 300, the half-cut groove 201 with less variation in depth 142 is formed and the package substrate 100 is The effect is that the height of the burr 300 generated around the half-cut groove 201 can be reduced without damaging the upper surface of the half-cut groove 201.

Furthermore, the package substrate dividing method according to the first embodiment further includes a protective member covering step 1001 of covering the upper surface of the package substrate 100 with a protective member before the holding step 1002. The occurrence of burrs 300 that tend to extend upward from the top surface can be effectively suppressed.

Furthermore, in the package substrate dividing method according to the first embodiment, since the deburring tool used in the burr reduction step 1005 is the first cutting blade 21, the first cutting blade 21 attached to one spindle 23 is used to split the package board into half parts. The cut groove forming step 1004 and the burr reduction step 1005 can be efficiently performed.

[Embodiment 2]
A method for dividing a package substrate according to Embodiment 2 of the present invention will be explained based on the drawings. FIG. 13 is a flowchart illustrating an example of a processing procedure of a method for dividing a package substrate according to the second embodiment. In FIG. 13, the same parts as in Embodiment 1 are denoted by the same reference numerals, and the description thereof will be omitted.

The method for dividing a package substrate according to the second embodiment is the method for dividing a package substrate according to the first embodiment, as shown in FIG. 1007 is added, and the burr reduction step 1005 is changed accordingly. The method for dividing a package substrate according to the second embodiment is applicable to a type of package substrate 100 for which it is known that the distribution of warpage of the package substrate 100 will be greatly changed by forming the half-cut groove 201 in the half-cut groove forming step 1004, or for a predetermined type of package substrate 100. This method is carried out when dividing using the following processing conditions.

The second measuring step 1007 is a step of measuring at least one line of the height of the upper surface of the package substrate 100 along the dividing line 112 after the half-cut groove forming step 1004, and generating second height data. The second measurement step 1007 is performed after the half-cut groove forming step 1004 and is similar to the first measurement step 1003 except that second height data is obtained. The second height data acquired by the control unit 60 in the second measurement step 1007 is the height along all dividing lines 112 on the upper surface of the package substrate 100 after the half-cut grooves 201 held on the holding table 10 are formed. This is a database containing height data, and height standards and the like are the same as the first height data.

In the second measurement step 1007, the control unit 60 can further measure the height of the burr 300 in addition to the height of the top surface of the package substrate 100, and include the height data of the burr 300 in the second height data. Can be done. In this way, in the second measurement step 1007, the height of the burr 300 can also be measured, so the height measuring unit 40 measures the height along all the dividing lines 112 of the package substrate 100 held on the holding table 10. It is preferable to obtain highly accurate second height data for both the height of the upper surface and the height of the burr 300 by acquiring the data. In the second measurement step 1007, the control unit 60 measures the height of the burr 300 using the height measurement unit 40, and converts the measured height of the burr 300 into the height of the upper surface of the package substrate 100 near the position where the burr 300 exists. The height is converted to a height based on the height and included in the second height data. In the second height data, the height data of the burr 300 is based on the X coordinate and Y coordinate representing the position where the burr 300 exists on the upper surface of the package substrate 100, and the height of the upper surface of the package substrate 100 at the said position. This is data in which the height of the burr 300 and the height of the burr 300 are correlated with each other.

The burr reduction step 1005 of the second embodiment is the same as that of the burr reduction step 1005 of the first embodiment, in which the control unit 60 uses the Z-axis moving unit 53 to adjust the first height data based on the second height data instead of the first height data. The height of the cutting blade 21 is adjusted in accordance with the position on the planned dividing line 112 closest to the first cutting blade 21. In the burr reduction step 1005 of the second embodiment, the control unit 60 further controls whether the height of the burr 300 exceeds the threshold burr allowable height 310 based on the second height data including the height data of the burr 300. The height of the burr 300 is reduced by scanning the portion with the first cutting blade 21. The burr reduction step 1005 of the second embodiment is otherwise similar to the burr reduction step 1005 of the first embodiment.

The package substrate dividing method according to the second embodiment having the above configuration is a method for dividing the package substrate 100 of a type in which it is known that the distribution of warpage changes significantly due to the formation of the half-cut groove 201. In Embodiment 1, a second measurement step 1007 is added between the half-cut groove forming step 1004 and the burr reduction step 1005, and the burr reduction step 1005 is changed accordingly. Therefore, in the method for dividing the package substrate according to the second embodiment, in the half-cut groove forming step 1004, the position on the planned dividing line 112 is determined based on the first height data acquired in the first measuring step 1003. While adjusting the height of the first cutting blade 21 using Based on the data, the height of the first cutting blade 21 is adjusted according to the position on the planned dividing line 112, and the height of the burr 300 is reduced by moving the first cutting blade 21. Even when dividing the package substrate 100 in which the distribution of warpage changes greatly due to the formation of the cut grooves 201, it is possible to form the half-cut grooves 201 with a desired depth 142 with little variation and without damaging the top surface of the package substrate 100. The effect is that the height of the burr 300 generated around the half-cut groove 201 can be reduced.

Furthermore, in the package substrate dividing method according to the second embodiment, in a second measurement step 1007, in addition to the height of the top surface of the package substrate 100, the height of the burr 300 is also measured and included in the second height data. , in the burr reduction step 1005, scanning processing is performed with the first cutting blade 21 to reduce the height of the burr 300 in the portion where the height of the burr 300 exceeds the threshold value based on the second height data. do. Therefore, the package substrate dividing method according to the second embodiment has the effect that the height of the burr 300 generated around the half-cut groove 201 can be reduced more efficiently.

[Embodiment 3]
A method for dividing a package substrate according to Embodiment 3 of the present invention will be explained based on the drawings. FIG. 14 is a perspective view showing a configuration example of a processing apparatus 1-2 that implements the package substrate dividing method according to the third embodiment. FIG. 15 is an explanatory diagram showing an example of the configuration of main parts of the processing device 1-2 in FIG. 14. FIG. 16 is a cross-sectional view illustrating the burr reduction step 1005 of the third embodiment. In FIGS. 14, 15, and 16, the same parts as those in Embodiment 1 and Embodiment 2 are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 14, the processing apparatus 1-2 that implements the package substrate dividing method according to the third embodiment is a processing apparatus 1 that implements the package substrate dividing method according to the first and second embodiments, and further includes a processing unit. 20-3, and the other configurations are the same as the processing apparatus 1. As shown in FIG. 15, the processing unit 20-3 includes a cutting tool blade 27 with a sharp lower end, a cutting tool holder 29 that holds the cutting tool blade 27, and a cutting tool holder 29 that holds the cutting tool holder 29 in the Z-axis direction relative to the holding table 10. a Z-axis moving unit 55 that moves the cutting tool holder 29 along the Y-axis direction relative to the holding table 10, a Y-axis moving unit 56 that moves the cutting tool holder 29 along the Y-axis direction relative to the holding table 10; A distance recognition means (not shown) that recognizes the distance between the holding surface 11 and the holding surface 11 is provided. The cutting tool blade 27 is a serious cutting tool with a blade thickness 28 thicker than the width of the half-cut groove 201 (width corresponding to the first blade thickness 25), and the angle of the lower end corner is 120 degrees, for example, by screwing or the like. It is fixed to the tool holder 29. For example, when the Z-axis moving unit 55 is configured by a ball screw mechanism, the distance recognition means recognizes the height position of the tool holder 29 in the Z-axis direction based on the rotation speed of the motor that rotates the ball screw, and thereby the tool blade 27 and the holding surface 11 of the holding table 10 is recognized.

The package substrate dividing method according to the third embodiment is the same as the first and second embodiments except that the burr reduction step 1005 is changed, and the other configurations are the same as those of the first and second embodiments. The burr reduction step 1005 of the third embodiment is the same as the burr reduction step 1005 of the first embodiment, except that the deburring tool is changed from the first cutting blade 21 to the bit blade 27, and the other configurations are the same as those of the first and second embodiments. The same is true.

In the burr reduction step 1005 of the third embodiment, as shown in FIG. While adjusting according to the position on the planned dividing line 112, the cutting tool blade 27 is relatively moved by the X-axis moving unit 51 along the planned dividing line 112 in which the half-cut groove 201 is formed with respect to the package substrate 100. As a result, by performing burr reduction processing on the package substrate 100 from the back surface 117 side with the cutting tool blade 27 along the planned dividing line 112 where the half-cut groove 201 was formed, burrs generated on the planned dividing line 112 where the half-cut groove 201 was formed. The height of the burr 300 is reduced. In the burr reduction step 1005 of the third embodiment, the control unit 60 sets the height of the lower end of the cutting blade of the cutting tool blade 27 to be higher than the upper surface of the package substrate 100 based on the first height data (or second height data). , positioned at a height corresponding to the allowable burr height of 310 minutes. In the burr reduction step 1005 of the third embodiment, the control unit 60 moves the cutting tool blade 27 against the package substrate 100 along an upwardly convex curve based on the first height data (or second height data). Move relatively. Note that in the burr reduction step 1005 of the third embodiment, the cutting tool blade 27 whose blade thickness 28 is thicker than the width of the half-cut groove 201 (width corresponding to the first blade thickness 25) is used, so In this way, it is not necessary to perform scanning processing many times while moving the line to be scanned by the first cutting blade 21 regarding the planned dividing line 112 in which one half-cut groove 201 is formed.

The method for dividing a package board according to the third embodiment having the above configuration is the same as the burr reduction step 1005 in the first and second embodiments, since the burr reduction step 1005 is changed to use the bit blade 27 as the deburring tool. , the height of the burr 300 can be reduced more suitably and efficiently.

Note that the present invention is not limited to the above embodiments. That is, various modifications can be made without departing from the gist of the invention.

10 Holding table 21 First cutting blade (an example of the deburring tool of the present invention)
22 Second cutting blade 25 First blade thickness 26 Second blade thickness 27 Bit blade (an example of the deburring tool of the present invention)
100 Package board 112 Planned division line 117 Back surface (an example of the top surface of the present invention)
131 dicing tape 132 annular frame 140 package chip (an example of the chip of the present invention)
201 Half-cut groove 300, 320 Burr 310 Burr allowable height (an example of the predetermined height of the present invention)

Claims (6)

A method for dividing a package substrate, which divides a package substrate attached to an opening of an annular frame via a dicing tape into a plurality of chips, the method comprising:
a holding step for holding the package substrate on a holding table;
a first measuring step of measuring the height of the upper surface of the package substrate held on the holding table at least one line along the planned dividing line to generate first height data;
a half-cut groove forming step of forming a half-cut groove along the planned dividing line with a first cutting blade positioned at a height to form a groove of a predetermined depth based on the first height data;
With the deburring tool positioned at a predetermined height from the top surface of the package substrate based on the first height data, the deburring tool and the holding table are relatively moved along the planned dividing line. a burr reduction step of reducing the height of burrs generated upward around the half-cut groove;
After performing the burr reduction step, dividing the package substrate along the half-cut groove with a second cutting blade having a blade thickness thinner than the half-cut groove to generate a plurality of chips;
A method for dividing a package substrate, comprising: A method for dividing a package substrate, which divides a package substrate attached to an opening of an annular frame via a dicing tape into a plurality of chips, the method comprising:
a holding step for holding the package substrate on a holding table;
a first measuring step of measuring the height of the upper surface of the package substrate held on the holding table at least one line along the planned dividing line to generate first height data;
a half-cut groove forming step of forming a half-cut groove along the planned dividing line with a first cutting blade positioned at a height to form a groove of a predetermined depth based on the first height data;
After the half-cut groove forming step, a second measuring step of measuring the height of the upper surface of the package substrate at least one line along the dividing line to generate second height data;
With the deburring tool positioned at a predetermined height from the top surface of the package substrate based on the second height data, the deburring tool and the holding table are relatively moved along the planned dividing line. a burr reduction step of reducing the height of burrs generated around the half-cut groove;
After performing the burr reduction step, dividing the package substrate along the half-cut groove with a second cutting blade having a blade thickness thinner than the half-cut groove to generate a plurality of chips;
A method for dividing a package substrate, comprising: 3. The method for dividing a package substrate according to claim 1, further comprising a protective member coating step of coating the upper surface of the package substrate with a protective member before the holding step. The second measuring step measures the height of the burr in addition to the height of the top surface of the package substrate,
3. The package substrate dividing method according to claim 2, wherein the burr reduction step is performed on a portion where the burr height exceeds a threshold value based on the second height data. 3. The package substrate dividing method according to claim 1, wherein the deburring tool is the first cutting blade. 3. The method for dividing a package substrate according to claim 1, wherein the deburring tool is a cutting tool.

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