JP2024032720A - frame body - Google Patents

Abstract

An object of the present invention is to provide a frame body that can suppress the generation of distortion due to thermal expansion by reducing the difference in the amount of expansion due to heat. [Solution] An upper frame 16 and a lower frame 17 are provided, the upper frame 16 and the lower frame 17 are made of a metal material with a low coefficient of linear thermal expansion, and the upper frame 16 and the lower frame 17 are bonded via an adhesive layer 18. It is a frame body. A plurality of frames are stacked, and adjacent frames in the stacking direction are bonded to each other via an adhesive layer 19. [Selection diagram] Figure 7

Description

The present invention relates to a frame and can be used to support a mask body. The frame of the present invention can be applied to, for example, a vapor deposition mask (metal mask).

Organic EL displays, which are lighter and consume less power, have begun to be used in place of liquid crystal displays in mobile devices such as smartphones and tablets that have display devices, with the aim of making the devices lighter and extending their operating time. There is. An organic EL display is manufactured by forming a light emitting layer (deposited layer) of an organic EL element on a substrate (deposition target) using a deposition mask method. At this time, by using a larger evaporation mask with more mask bodies and manufacturing more products in one evaporation operation, it is possible to reduce the manufacturing cost of the organic EL display. Therefore, there is an increasing demand from manufacturers of organic EL displays for larger evaporation masks.

A vapor deposition mask used in the vapor deposition mask method is disclosed in Patent Document 1, for example. Patent Document 1 discloses a metal mask (mask main body) having a plurality of mask parts (vapor deposition patterns), a frame (frame body) made of an invar material formed in a picture frame shape, and fixedly holding the metal mask in a taut state. constitutes a vapor deposition mask. The metal mask is joined to the frame by spot welding.

This type of vapor deposition mask has also been proposed by the present applicant and is disclosed in, for example, Patent Document 2. Such a vapor deposition mask consists of a plurality of mask bodies provided with vapor deposition patterns, and a reinforcing frame body that is integrally and inseparably joined to the mask body. The frame body is made of Invar material (a material with a low coefficient of linear thermal expansion), and the outer peripheral edge of each mask body is joined to the frame body surrounding the mask body with a metal layer formed by electroforming.

JP2004-323888A Japanese Patent Application Publication No. 2005-15908

Like the vapor deposition masks of Patent Document 1 and Patent Document 2, the frame that fixes and holds the metal mask and the frame that reinforces the mask body are made of Invar material, so that the working environment during vapor deposition is a high temperature environment. Also, it is possible to suppress expansion of the vapor deposition mask and ensure reproducibility and vapor deposition accuracy of the vapor deposited layer (light-emitting layer). However, the metal mask of the vapor deposition mask of Patent Document 1,
Although the metal mask is fixedly held in a tensioned state by the frame, when the size of the vapor deposition mask is increased, the area of the metal mask that is not supported by the frame increases, and the metal mask is warped and deformed due to its own weight. Therefore, it is unavoidable that the reproducibility and deposition accuracy decrease.

In this regard, in the vapor deposition mask of Patent Document 2, each mask body is joined to the frame surrounding the mask body, so even when the vapor deposition mask is enlarged, the mask body does not warp or deform due to its own weight. It is possible to ensure the reproducibility and deposition accuracy of the deposited layer. However, even a frame made of Invar material expands slightly during vapor deposition. In addition, the frame body is made of Invar metal plate material, but since there is usually a thickness deviation in commonly available metal plate materials,
There are variations in plate thickness depending on the part of the frame. For this reason, the amount of expansion differs in each part of the frame,
Differences in the amount of expansion may appear as distortion of the entire vapor deposition mask. When the vapor deposition mask is distorted in this way, the flatness of the vapor deposition mask deteriorates, resulting in extremely low reproducibility and vapor deposition accuracy. This distortion becomes more noticeable as the size of the frame increases. The occurrence of such distortion due to thickness deviation of the base material can be suppressed by managing the manufacturing process of metal plate materials and exclusively manufacturing and using base materials with small thickness deviations. becomes expensive, leading to an increase in the manufacturing cost of the vapor deposition mask. Here, the plate thickness deviation means the range of variation in thickness of a metal plate relative to its standard dimensions.

An object of the present invention is to provide a frame that can suppress the generation of distortion due to thermal expansion by reducing the difference in the amount of expansion due to heat. Such a frame body is used, for example, to reinforce the mask body, and can increase the size of the mask while suppressing increases in manufacturing costs, maintain the flatness of the mask, and ensure the repeatability and deposition accuracy of the deposited layer. You can get a mask.

The vapor deposition mask of the present invention includes a mask main body 2 having a vapor deposition pattern 6 consisting of a large number of independent vapor deposition holes 5, and a reinforcing frame 3 made of a metal plate material with a low coefficient of linear thermal expansion arranged around the mask main body 2. Equipped with. The mask body 2 and the frame body 3 are integrally and inseparably joined via a metal layer 8. The frame body 3 is composed of an upper frame 16 and a lower frame 17 formed in the same shape, and the upper frame 16 and the lower frame 17 are joined and integrated via an adhesive layer 18. shall be.

A plurality of frames 3, 3 are stacked, and adjacent frames 3, 3 in the stacking direction are bonded to each other via an adhesive layer 19.

The upper frame 16 and the lower frame 17 are joined with their protruding arc surfaces or concave arc surfaces facing each other, so that the warpage of the two-dimensional curved surface or three-dimensional curved surface of the upper frame 16 and the lower frame 17 is canceled out. Then, the frame body 3 is formed into a flat shape.

The mask body 2 is formed into a rectangular shape, and a plurality of mask bodies 2 are arranged in a matrix.
The frame body 3 includes an outer peripheral frame 10 and a lattice frame-shaped vertical frame 12 and horizontal frame 13 that define a plurality of mask openings 11 within the outer peripheral frame 10. The width dimension of the vertical frame 12 parallel to the long side of the mask body 2 is W1.
When the width dimension of the horizontal frame 13 parallel to the short side of the mask body 2 is W2, the width dimension W1 of the vertical frame 12 and the width dimension W2 of the horizontal frame 13 are defined by the inequality (W1≦W2≦W1×1 .1).

The metal layer 8 can be formed integrally with the mask body 2.

It includes a support frame 46 fixed to the lower surface of the frame body 3 and an auxiliary frame 47 fixed to the lower surface of the support frame 46. A frame opening 48 corresponding to the mask opening 11 of the frame body 3 is formed in the support frame 46, and the frame opening 48 is formed in an opening shape that is slightly larger than the mask opening 11. The entire frame 13 is supported by a support frame 46. Further, the auxiliary frame 47 is formed into a picture frame shape, and supports the four peripheral edges of the support frame 46 with the auxiliary frame 47.

The vapor deposition mask according to the vapor deposition mask manufacturing method of the present invention includes a mask body 2 provided with a vapor deposition pattern 6 consisting of a large number of independent vapor deposition holes 5 in a pattern forming area 4, and a mask body 2 with low thermal linear expansion disposed around the mask body 2. It is provided with a reinforcing frame body 3 made of a metal plate material of a certain coefficient. The method for manufacturing a vapor deposition mask includes a frame forming step in which a reinforcing frame 3 is formed, and a primary pattern in which a primary pattern resist 29 having a resist body 29a corresponding to the vapor deposition through hole 5 is provided on the surface of the matrix 24. a second step of electroforming the electrodeposited metal onto the matrix 24 using the primary pattern resist 29, and forming a plurality of primary electroformed layers 30 at predetermined positions on the matrix 24 corresponding to the mask body 2; In the electroforming step 1, the frame 3 is placed on the matrix 24 while being aligned so that the primary electroformed layer 30 corresponding to the mask opening 11 is located in each mask opening 11 of the frame 3. A metal layer 8 is formed by electroforming in a state covering the surface of the frame 3 and the surface of the outer peripheral edge 4a of the pattern forming area 4 of the mask body 2, and the metal layer 8 is formed by electroforming. A second electroforming step in which the primary electroformed layer 30 and the frame body 3 are inseparably joined through the mold 24, and the primary electroformed layer 30, the frame body 3, and the metal layer 8 are integrally joined from the matrix 24. and a peeling step of peeling off. In the frame body forming process, the upper frame 16 and the lower frame 17 are bonded together with the adhesive layer 18 with the convex arc surfaces or concave arc surfaces of the upper frame 16 and the lower frame 17 facing each other. The method is characterized in that the frame body 3 is formed by including a joining step of forming the frame body 3 into a flat shape in a state where the warpage of the two-dimensional curved surface or the three-dimensional curved surface is canceled out.

Further, the vapor deposition mask according to the vapor deposition mask manufacturing method of the present invention includes a mask main body 2 having a vapor deposition pattern 6 consisting of a large number of independent vapor deposition holes 5 in the pattern forming area 4, and a low temperature mask disposed around the mask main body 2. A reinforcing frame body 3 made of a metal plate material having a coefficient of linear thermal expansion is provided. The method for manufacturing a vapor deposition mask includes a frame forming step in which a reinforcing frame 3 is formed, and a primary patterning step in which a primary pattern resist 29 having a resist body 29a corresponding to the mask body 2 is provided on the surface of a matrix 24. Step 1: Adhesive resist 43 is pasted on the entire upper surface of the matrix 24 including the primary pattern resist 29, and then the frame 3 is adhesively fixed onto the matrix 24 so as to surround the primary pattern resist 29. Adhesive resist 4 located on the lower surface of the frame 3
3, the mask body 2 is formed by electroforming the electrodeposited metal while covering the surface of the matrix 24 excluding the resist body 29a, and the surface of the frame body 3. An integrated electroforming process of integrally forming the primary electroformed layer 30 constituting the mask body 2 and the metal layer 8 that joins the mask body 2 and the frame 3; , and a peeling step of peeling the frame 3 together. In the frame body forming process, the upper frame 16 and the lower frame 17 are bonded together with the adhesive layer 18 with the convex arc surfaces or concave arc surfaces of the upper frame 16 and the lower frame 17 facing each other. The method is characterized in that the frame body 3 is formed by including a joining step of forming the frame body 3 into a flat shape in a state where the warpage of the two-dimensional curved surface or the three-dimensional curved surface is canceled out.

In the primary patterning step, a photoresist layer 25 was laminated on the surface of the conductive matrix 24, and a pattern film 26 having transparent holes 26a corresponding to the primary patterning was further laminated on the surface of the photoresist layer 25. A pre-patterning stage body 27 is formed. The photoresist layer 25 is exposed to light by the ultraviolet irradiation device in a state where the temperature of the pre-patterning body 27 and the furnace temperature of the ultraviolet irradiation device are preheated to the furnace temperature during the exposure operation.

The temperature range of the electroforming liquid used in the first electroforming process and the temperature range of the electroforming liquid used in the second electroforming process are set to substantially the same temperature range.

According to the vapor deposition mask according to the present invention, it is possible to reduce the difference in the amount of expansion due to heat in each part of the frame 3, thereby suppressing the occurrence of distortion in the frame 3 due to thermal expansion. Specifically, the thinner the generally available metal sheet material that is the base material of the frame 3 is, the more times it passes through rolling rolls in the manufacturing process, so the thinner the sheet thickness is, the smaller the sheet thickness deviation tends to be. There is. For this reason, the frame 3 is composed of an upper frame 16 and a lower frame 17, and by joining and integrating the upper and lower frames 16 and 17 via the adhesive layer 18, the frame 3 can have the same thickness as the conventional one. Since the frame body 3 can be formed using a thinner metal plate material when forming the frame body 3, the thickness deviation of the frame body 3 as a whole can be reduced. Thereby, even with a large-sized vapor deposition mask, it is possible to suppress the occurrence of distortion due to thermal expansion resulting from thickness deviation of the metal plate material. Furthermore, since a commonly available thin metal plate material is simply used as the base material, there is no need to form the frame 3 using a special metal plate material. As described above, according to the present invention, it is possible to increase the size of the vapor deposition mask while suppressing an increase in manufacturing costs, maintain the flatness of the vapor deposition mask, and achieve good reproducibility and vapor deposition accuracy of the vapor deposited layer. can be secured. Further, according to the frame body 3 in which the adhesive layer 18 is interposed between the upper frame 16 and the lower frame 17, when an external force that causes deflection deformation is applied to the vapor deposition mask, the frame body 3 is moved by an amount corresponding to the adhesive layer 18. It can be flexibly and elastically deformed to effectively prevent damage to the deposition mask.

By stacking a plurality of frames 3, 3 and bonding the frames 3, 3 adjacent to each other in the stacking direction via the adhesive layer 19, an even thinner metal plate material can be formed when forming the frame 3 of the same thickness as the conventional one. Since the frame body 3 can be formed using the metal plate material, it is possible to further suppress the occurrence of distortion due to thermal expansion resulting from the plate thickness deviation of the metal plate material. Therefore, it is possible to increase the size of the vapor deposition mask, maintain the flatness of the vapor deposition mask, and ensure better reproducibility and vapor deposition accuracy of the vapor deposited layer. Furthermore, by increasing the number of adhesive layers 18 and 19 that bond the frame bodies 3 together, it is possible to more flexibly deform elastically against external forces, so that damage to the vapor deposition mask can be more effectively prevented.

When the upper frame 16 and the lower frame 17 are joined with the warpage of the two-dimensional curved surface or three-dimensional curved surface canceled out to form the frame body 3 in a flat shape, slight warpage due to the metal plate material can be eliminated. hand,
Flatness can be further improved, and even better reproducibility and deposition accuracy of the deposited layer can be ensured.

The width dimension W1 of the vertical frame 12 and the width dimension W2 of the horizontal frame 13 are defined by the inequality (W1≦W2≦W1×1.
If 1) is set to satisfy, the cross-sectional area of the horizontal frame 13 can be the same as or larger than the cross-sectional area of the vertical frame 12, and the length of the horizontal frame 13 is smaller than the length of the vertical frame 12. , vertical frame 12
can be firmly supported by the horizontal frame 13 to prevent the long vertical frame 12 from bending and deforming due to its own weight. Therefore, deformation of the frame body 3 due to its own weight can be prevented and the size of the vapor deposition mask can be increased, and the flatness of the vapor deposition mask can be maintained, and the reproducibility and vapor deposition accuracy of the vapor deposition layer can be improved. In addition, since the rigidity of the vertical frame 12 and the horizontal frame 13 can be made substantially uniform throughout, when an external force that bends and deforms the vapor deposition mask 1 is applied, the external force can be evenly distributed and local concentration can be eliminated. , deformation and damage of the vapor deposition mask 1 can be effectively prevented. In addition, horizontal frame 13
Since the width dimension W2 is set as (W2≦W1×1.1), an increase in the weight of the frame body 3 due to an unnecessarily large cross-sectional area of the horizontal frame 13 is suppressed, and the weight of the entire vapor deposition mask is reduced. The structural strength and rigidity of the frame body 3 can be increased while eliminating the increase in size.

By forming the metal layer 8 integrally with the mask body 2 and joining the mask body 2 and frame 3 inseparably, it is possible to eliminate the trouble of separately forming the metal layer 8 and joining the mask body 2 and frame 3. Since the process required for manufacturing can be omitted and the time can be shortened, the manufacturing cost of the vapor deposition mask can be reduced.

By supporting the entire vertical frame 12 and horizontal frame 13 of the frame body 3 with the support frame 46, and further supporting the four peripheral edges of the support frame 46 with the auxiliary frame 47, the structural strength and rigidity of the entire vapor deposition mask can be further enhanced. , it is possible to prevent the vapor deposition mask from bending and deforming and maintain flatness, and the reproducibility and vapor deposition accuracy of the vapor deposition layer can be further improved.

According to the method for manufacturing a vapor deposition mask according to the present invention, in the frame forming step, the upper frame 16 and the lower frame 17 are joined in a flat state with the warpage of the two-dimensional curved surface or three-dimensional curved surface canceled out. , it is possible to eliminate slight warpage caused by the metal plate material and further improve flatness. Therefore, it is possible to obtain a vapor deposition mask that can be made larger while suppressing an increase in manufacturing costs, maintain flatness, and ensure good reproducibility and vapor deposition accuracy of the vapor deposited layer.

According to another method of manufacturing a vapor deposition mask according to the present invention, the trouble of forming the metal layer 8 is omitted, and
The flatness can be further improved in the same manner as described above, while the steps required for manufacturing are omitted and the time is shortened. Therefore, it is possible to obtain a vapor deposition mask that can be made larger while suppressing an increase in manufacturing costs, maintain flatness, and ensure good reproducibility and vapor deposition accuracy of the vapor deposited layer.

In the primary patterning step, the photoresist layer 25 is exposed to light by the ultraviolet irradiation device in a state where the temperature of the pre-patterning body 27 and the furnace temperature of the ultraviolet irradiation device are preheated to the furnace temperature during the exposure operation. In this way, the primary pattern resist 29 can be provided on the matrix 24 with good positional accuracy and in the intended shape. Specifically, the matrix 24, the photoresist layer 25, and the pattern film 26 that constitute the pre-patterning body 27 have different coefficients of linear thermal expansion. Therefore, when the patterning pre-stage body 27 is housed in a furnace at a temperature lower than the furnace temperature during the exposure operation and the exposure work is performed, the patterning pre-stage body 27 is heated and expanded by ultraviolet irradiation, and the above-mentioned three Exposure work is performed while the relative positional relationship of 24, 25, and 26 is shifted. As a result, the positional accuracy of the primary pattern resist 29 with respect to the matrix 24 decreases, and furthermore, the primary pattern resist 29
9 cannot be exposed as intended either. Decreased positional accuracy or defective shape of the primary pattern resist 29 will affect the formation of the mask body 2 in the first electroforming process or integral electroforming process, and the mask body 2 with the intended dimensional accuracy cannot be formed by electroforming. A problem occurs. However, by preheating the temperature in the furnace of the patterning pre-stage body 27 and the ultraviolet ray irradiation device to the furnace temperature at the time of exposure work, the temperature increase due to ultraviolet irradiation can be eliminated, and the temperature in the patterning pre-stage body 27 can be increased. Can prevent expansion. Therefore, it is possible to provide the primary pattern resist 29 on the master die 24 with good positional accuracy and in the intended shape, and to form the mask body 2 with good dimensional accuracy, which improves the reproducibility of the vapor deposition layer and the vapor deposition accuracy. It can contribute to higher precision.

The temperature range of the electroforming liquid used in the first electroforming process and the second electroforming process is set to be approximately the same, and the primary electroforming layer 30 and the frame body are connected to each other through the metal layer 8 that becomes the metal layer. By integrally joining the mask body 3 with the frame body 3, it is possible to prevent the mask body 2 from being joined to the frame body 3 while thermally expanding. Therefore, frame 3
It is possible to improve the positional accuracy of the bonding position of the mask body 2 to the mask body 2, and to obtain a vapor deposition mask with higher precision in reproducibility and vapor deposition accuracy of the vapor deposited layer.

FIG. 1 is a longitudinal sectional front view showing main parts of a vapor deposition mask according to a first embodiment of the present invention. It is a perspective view showing the whole vapor deposition mask concerning a 1st embodiment of the present invention. FIG. 1 is a longitudinal sectional side view of a vapor deposition mask according to a first embodiment of the present invention. FIG. 1 is a plan view showing main parts of a vapor deposition mask according to a first embodiment of the present invention. It is a top view of the frame of the vapor deposition mask concerning a 1st embodiment of the present invention. It is an explanatory view showing the first stage of a frame formation process in a manufacturing method of a vapor deposition mask concerning a 1st embodiment of the present invention. It is an explanatory view showing the latter stage of a frame formation process in a manufacturing method of a vapor deposition mask concerning a 1st embodiment of the present invention. FIG. 3 is an explanatory diagram showing a primary patterning step and a first electroforming step in the method for manufacturing a vapor deposition mask according to the first embodiment of the present invention. FIG. 3 is an explanatory diagram showing an activation treatment step in the method for manufacturing a vapor deposition mask according to the first embodiment of the present invention. FIG. 3 is an explanatory diagram showing a secondary patterning step, a frame arrangement step, a second electroforming step, and a peeling step in the method for manufacturing a vapor deposition mask according to the first embodiment of the present invention. FIG. 7 is a longitudinal sectional front view showing main parts of a vapor deposition mask according to a second embodiment of the present invention. It is explanatory drawing which shows the frame body arrangement process, the 2nd electroforming process, and the peeling process of the vapor deposition mask based on 2nd Embodiment of this invention. FIG. 7 is a longitudinal sectional front view showing main parts of a vapor deposition mask according to a third embodiment of the present invention. It is an explanatory view showing a primary patterning process and a 1st electroforming process in the manufacturing method of the vapor deposition mask concerning a 3rd embodiment of the present invention. It is an explanatory view showing a secondary patterning process, a frame body arrangement process, a 2nd electroforming process, and a peeling process in the manufacturing method of the vapor deposition mask concerning a 3rd embodiment of the present invention. FIG. 7 is a longitudinal sectional front view showing main parts of a vapor deposition mask according to a fourth embodiment of the present invention. It is an explanatory view showing a manufacturing method of a vapor deposition mask concerning a 4th embodiment of the present invention. It is a longitudinal sectional front view showing a vapor deposition mask concerning a 5th embodiment of the present invention. It is an exploded perspective view of the vapor deposition mask concerning a 5th embodiment of the present invention. It is a top view of the vapor deposition mask based on 5th Embodiment of this invention. It is an exploded perspective view showing a modification of a vapor deposition mask concerning a 5th embodiment of the present invention.

(First Embodiment) FIGS. 1 to 10 show a first embodiment of a vapor deposition mask and a method for manufacturing the same according to the present invention. Note that dimensions such as thickness and width in FIGS. 1 to 10 of this embodiment do not represent actual conditions, but are shown schematically. The same applies to the figures of each embodiment below.

As shown in FIGS. 2 and 3, the vapor deposition mask 1 includes a plurality of mask bodies 2 and a reinforcing frame 3 disposed around the mask bodies 2. The mask body 2 is formed into a rectangular shape with rounded corners, and has a pattern forming area 4 inside thereof. A vapor deposition pattern 6 consisting of a large number of independent vapor deposition holes 5 is formed in the pattern forming region 4 . As shown in FIG. 4, the mask body 2 is provided with a large number of bonding holes 7 all around the outer periphery 4a of the pattern forming area 4. As shown in FIG.

The mask body 2 is formed by electroforming using an electrodeposited metal made of nickel. The thickness of the mask body 2 is preferably in the range of 10 to 20 μm, and in this embodiment, it is set to 12 μm. Further, the dimensions of the mask body 2 in plan view were set to 108 mm in the longitudinal direction and 62 mm in the lateral direction, and 30 mask bodies 2 were arranged in a matrix of 6 rows and 5 columns. Note that the mask body 2 can be formed of a nickel alloy such as nickel cobalt or other electrodeposited metal other than nickel. The vapor deposition mask 1 of this embodiment is an organic
When applied to a vapor deposition mask for an L element, the vapor deposition pattern 6 is formed to correspond to the light emitting layer of the organic EL element.

As shown in FIG. 5, the frame body 3 includes an outer peripheral frame 10, and vertical frames 12 and horizontal frames 13 in the shape of a lattice frame, which define mask openings 11 within the outer peripheral frame 10. The vertical frame 12 is provided parallel to the long side of the mask body 2, and the horizontal frame 13 is provided parallel to the short side of the mask body 2. In this embodiment, the frame 3 is made of a metal plate made of Invar material, which is a nickel-iron alloy, and has a low coefficient of linear thermal expansion, and is formed to be sufficiently thicker than the mask body 2, with a thickness dimension of 1. 6mm
It was set to Further, in plan view, the dimensions of the frame 3 were set to 460 x 730 mm, and the dimensions of the mask opening 11 were set to 110 mm in the longitudinal direction and 64 mm in the transverse direction. The frame 3 may be made of super invar material, which is a nickel-iron-cobalt alloy, and its thickness can be set to, for example, about 1 to 5 mm. In addition, the reason why Invar material or Super Invar material is used as the material for forming the frame body 3 is because its thermal linear expansion coefficient is extremely small.
This is because dimensional changes in the mask body 2 due to thermal effects in the vapor deposition process can be suppressed well.

When the width dimension of the vertical frame 12 is W1 and the width dimension of the horizontal frame 13 is W2, the width dimension W1 of the vertical frame 12 and the width dimension W2 of the horizontal frame 13 are expressed by the inequality (W1≦W2≦W1×1. It is set to satisfy 1). In this embodiment, the width dimension W1 of the vertical frame 12 is set to 10 mm,
The width dimension W2 of the horizontal frame 13 was set to 10.64 mm. In this way, the width dimension W1 of the vertical frame 12
By setting the width dimension W2 of the horizontal frame 13 larger than that, the cross-sectional area of the horizontal frame 13 can be made larger than the cross-sectional area of the vertical frame 12, and since the length of the horizontal frame 13 is smaller than the length of the vertical frame 12, Vertical frame 12
can be firmly supported by the horizontal frame 13 to prevent the long vertical frame 12 from bending and deforming due to its own weight. Therefore, it is possible to prevent the frame 3 from deforming due to its own weight, and to increase the size of the vapor deposition mask 1.
Furthermore, the flatness of the vapor deposition mask 1 can be maintained, and the reproducibility of the vapor deposition pattern and the vapor deposition accuracy can be improved. In addition, since the rigidity of the vertical frame 12 and the horizontal frame 13 can be made substantially uniform throughout, when an external force that bends and deforms the vapor deposition mask 1 is applied, the external force can be evenly distributed and local concentration can be eliminated. , deformation and damage of the vapor deposition mask 1 can be effectively prevented. In addition, since the width dimension W2 of the horizontal frame 13 is set to (W2≦W1×1.1), the width of the horizontal frame 13 is larger than necessary.
The structural strength and rigidity of the frame 3 can be increased while suppressing an increase in the weight of the frame 3 due to an increase in the cross-sectional area of the frame 3 and preventing the weight of the entire vapor deposition mask from increasing unnecessarily.

As shown in FIGS. 1 and 6(a), the frame 3 is composed of an upper frame 16 and a lower frame 17 that are formed in the same shape and have the same thickness, and the upper frame 16 and the lower frame 17 are They are joined and integrated via an adhesive layer 18. Specifically, as shown in FIG. 6(b), the upper frame 16 and the lower frame 17 are
The frame body 3 is formed into a flat shape with the protruding arc surfaces facing each other and being joined to cancel out the warpage of the two-dimensional curved surface. Note that the two-dimensional curved warp is a slight warp originating from the metal plate material, and may also be a three-dimensional curved warp. In this embodiment, the adhesive layer 18
uses a sheet-like uncured photosensitive dry film resist, and has an upper frame 16 and a lower frame 1.
After bonding 7, unnecessary portions of the adhesive layer 18 are removed. For the adhesive layer 18, various commercially available adhesives may be used. The reason why the upper and lower frames 16 and 17 constituting the frame body 3 are made to have the same thickness is that the frame body 3 is formed into a flat shape by joining with the warpage of the two-dimensional curved surface canceled out. This is to make it easier. The convex arc surface may be a concave arc surface, or may include both. In addition, if the two-dimensional curved surface warpage can be canceled out and joined flatly, the upper and lower frames 16 and
The thickness dimension of 17 may be different.

As described above, when the upper frame 16 and the lower frame 17 are joined with the warpage of the two-dimensional curved surfaces canceled out to form the frame body 3 into a flat shape, the slight warpage caused by the metal plate material can be eliminated. As a result, the flatness can be further improved, and even better reproducibility and deposition accuracy of the deposited layer can be ensured.

As shown in FIG. 1, in this embodiment, a pair (plurality) of frames 3, 3 formed by the above method are stacked, and adjacent frames 3, 3 in the stacking direction are bonded to each other via an adhesive layer 19. I joined it.
The thickness dimensions of the upper and lower frames 16 and 17 that constitute the frame body 3 on the upper surface side are each set to 0.3 mm, and the thickness dimensions of the upper and lower frames 16 and 17 that constitute the frame body 3 on the lower surface side are each set to 0.3 mm. It was set to .5mm.

In FIG. 1, reference numeral 8 indicates a metal layer formed on the upper surface of the outer peripheral edge 4a of the pattern forming region 4 of the mask body 2. The metal layer 8 is formed by laminating nickel by electroforming. Each mask body 2 is arranged in the mask opening 11, and the outer periphery 4a of the pattern forming area 4 of the mask body 2 is integrally and inseparably joined to the frame 3 by a metal layer 8 formed by electroforming. has been done. As shown in FIGS. 1 and 4, the metal layer 8 is formed on the upper surface of the outer peripheral edge 4a of the pattern forming area 4, the upper surface of the frame 3, the side surface facing the pattern forming area 4, and the mask body 2 and frame 3. It is formed into a hat-shaped cross section over the gap portion. Further, the metal layer 8 is also formed within the bonding through hole 7, thereby improving the bonding strength between the mask body 2 and the frame body 3. Note that the metal layer 8 can be formed using a nickel alloy such as nickel cobalt or other electrodeposited metal other than nickel.

6 to 10 show a method for manufacturing the vapor deposition mask 1 according to this embodiment, in which:
First, a frame body forming step is performed to form a reinforcing frame body 3.

(Frame body forming process)
First, a cutting process is performed in which the metal plate is cut into the size of the upper frame 16 and the lower frame 17 using, for example, a wire electric discharge machine that has a small thermal effect on the metal plate. Next, by etching or laser processing the cut-out upper frame 16 and lower frame 17, a mask opening forming step is performed in which a plurality of openings that will become the mask openings 11 are formed, as shown in FIG. 6(a). Next, as shown in FIG. 6(b), the upper frame 16 and the lower frame 17, which are made of metal plate materials, are bonded together with an adhesive layer 18, with their protruding surfaces facing each other. In a state in which the warpage of the dimensional curved surface is canceled out, a joining process is performed to form the frame 3 into a flat shape. The adhesive layer 18 is made of a sheet-like uncured photosensitive dry film resist.

Next, as shown in FIG. 6(c), the upper and lower rolling rolls 2 are arranged at a predetermined inter-roll dimension.
A fixing step is performed in which the sample is passed between 2 and 22 and compressed. Furthermore, the frame 3 was obtained by removing (developing) unnecessary portions of the adhesive layer 18 (portions exposed outside the mask opening 11 and the outer peripheral frame 10). In this way, the reason why a sheet-like uncured photosensitive dry film resist is used for the adhesive layer 18 is that the uncured photosensitive dry film resist has adhesive properties and is further used in the primary patterning process described below. However, since it is a material that can be used, there is no need to separately prepare a commercially available adhesive or the like, and the manufacturing cost of the vapor deposition mask 1 can be reduced accordingly. In addition, in the cutting process, the upper and lower frames 16 are cut while cooling the metal plate using a laser cutting machine.
・You can also cut out 17.

Each of the above steps is performed using metal plate materials of different thicknesses to manufacture a pair of frames 3, 3 as shown in FIG. 7(a). These frames 3, 3 are stacked as shown in FIG. 7(b), and the frames 3, 3
They were bonded together with an adhesive layer 19 made of a sheet-like uncured photosensitive dry film resist. Thereafter, as shown in FIG. 7(c), a lamination step is performed in which the material is passed between upper and lower rolling rolls 22 arranged at a predetermined distance between the rolls and compressed. In this way, a pair of laminated frames 3.3 was obtained.

(Pre-patterning stage body formation process)
As shown in FIG. 8A, a photoresist layer 25 is formed on the surface of a conductive matrix 24 made of stainless steel or brass, for example. This photoresist layer 25 was formed by laminating one or several sheets of negative type photosensitive dry film resist and thermocompression bonding to a predetermined thickness. Next, on the photoresist layer 25, a pattern film 26 (glass mask) having transparent holes 26a corresponding to the vapor deposition holes 5 and the bonding holes 7 (primary patterning) is brought into close contact with the photoresist layer 25, and the pre-patterning body 27 is formed. Obtained.

(Preheating process)
The patterning pre-stage body 27 is preheated to the furnace temperature of the ultraviolet irradiation device during exposure work using, for example, a heater plate or a preheating furnace. In parallel with the preheating of the patterning pre-stage body 27, the inside of the furnace of the ultraviolet irradiation device is also preheated to the furnace temperature during the exposure operation. Preheating of the furnace of the ultraviolet irradiation device is performed by lighting the ultraviolet lamp 28 with no irradiation object accommodated in the furnace or with a dummy matrix (matrix+photoresist layer+protective film) accommodated. The pre-patterning stage body 27 and the inside of the furnace are preheated to, for example, 23±3°C. Incidentally, the maximum temperature inside the furnace of the ultraviolet irradiation device during exposure work is around 26°C.

(Primary patterning process)
After the preheating of the furnace of the ultraviolet irradiation device and the pre-patterning body 27 is completed, the pre-patterning body 27 is placed in the furnace of the ultraviolet irradiation device, and as shown in FIG. Exposure is performed by irradiating light, and each process of development and drying is performed. Next, by dissolving and removing the unexposed portions, the vapor deposition through holes 5 and the bonding through holes 7 are formed, as shown in FIG. 8(b).
A primary pattern resist 29 having a resist body 29a corresponding to the pattern was formed on the matrix 24. In this way, when the exposure work is performed with the furnace of the ultraviolet irradiation device and the patterning pre-stage body 27 preheated to the furnace temperature at the time of exposure work, the patterning pre-stage body 27 is heated by ultraviolet irradiation.
7 is heated and expands, and the exposure operation is performed while the relative positional relationship of the three members 24, 25, and 26 is shifted. Therefore, the primary pattern resist 29 can be provided on the master die 24 with good positional accuracy and in the intended shape, contributing to higher reproducibility and deposition accuracy of the vapor deposited layer.

(First electroforming process)
Next, the mother mold 24 is placed in an electroforming tank in which the temperature of the electroforming solution is set at 40 to 50°C.
As shown in FIG. 8(c), an electrodeposited metal made of nickel is primary electroformed on the surface of the matrix 24 that is not covered with the resist body 29a within the height range of the previous resist body 29a. Electroformed layer 3
0, that is, a layer that would become the mask body 2 was formed. Next, by dissolving and removing the resist body 29a, as shown in FIG. 8(d), a mask body 2 having a vapor deposition pattern 6 consisting of a large number of independent vapor deposition holes 5 and a bonding hole 7 was obtained. In addition, in FIG. 8(d), the symbol 30a is
The primary electrodeposition layer formed between the mask bodies 2 and 2 and removed in the peeling process described later is shown.

(Activation treatment process)
As shown in FIG. 9(a), a photoresist layer 3 is applied to the entire surface of the primary electroformed layers 30 and 30a.
3 is formed, a patterned film 34 having transparent holes 34a corresponding to the peripheral portions of the bonding through holes 7 is placed in close contact with the patterned film 34, housed in a furnace of an ultraviolet irradiation device, and irradiated with ultraviolet light using an ultraviolet light lamp 28. exposure, development, and drying. The photoresist layer 33 here was formed by laminating one or several sheets of negative type photosensitive dry film resist and thermocompression bonding to a predetermined thickness as before. Next, by dissolving and removing the unexposed portions of the photoresist layer 33, a patterned resist 35 having openings 35a corresponding to the peripheral portions of the bonding holes 7 was obtained, as shown in FIG. 9(b). In other words, the joint through hole 7
A patterned resist 35 was formed so that only the peripheral portion of the patterned resist 35 was exposed to the surface.

Next, the portion of the primary electroformed layer 30 exposed in the opening 35a of the pattern resist 35, that is, the primary electroformed layer 30 around the bonding through hole 7, is subjected to activation treatment such as acid immersion or electrolytic treatment, and further, as shown in FIG. As shown in (c), the pattern resist 35 was dissolved and removed. In FIG. 9(c), reference numeral 36 indicates a portion subjected to activation treatment. Specifically, the inner wall surface of the joining through hole 7 and the upper surface of the primary electroformed layer 30 around the joining through hole 7 are Activation treatment was performed. When the activation treatment is performed around the joint through hole 7 in this way, the strength of the joint between the primary electroformed layer 30 and the metal layer 8 formed in the second electroforming process to be described later is increased compared to the case without treatment. It can be improved significantly. Note that instead of the above activation treatment, a thin layer of strike nickel, matte nickel, or the like may be formed on the primary electroformed layer 30 around the joining through hole 7. This also makes it possible to improve the bonding strength between the peripheral portion of the bonding through hole 7 and the metal layer 8.

(Secondary patterning process and frame arrangement process)
As shown in FIG. 10(a), a photoresist layer 38 is formed on the entire surface of the master mold 24, including the portion where the primary electroformed layers 30 and 30a are to be formed. As before, this photoresist layer 38 was formed by laminating one or several sheets of negative type photosensitive dry film resist and thermocompression bonding to a predetermined thickness. Next, a pattern film 39 having transparent holes 39a corresponding to the pattern forming area 4 is placed in close contact with the film 39 and placed in a furnace of an ultraviolet irradiation device, exposed to ultraviolet light using an ultraviolet lamp 28, developed, and dried. Perform each process.
In this state, a photoresist layer 38 was obtained in which a portion (38a) related to the pattern formation region 4 was exposed and the other portion was an unexposed portion (38b) (see FIG. 10(b)).

Next, as shown in FIG. 10(b), the frame 3 was positioned and placed on the matrix 24 so as to surround the primary electroformed layer 30. Here, the frame 3 was temporarily fixed onto the matrix 24 by utilizing the adhesive properties of the unexposed photoresist layer 38b. Further, as shown in FIG. 10(c), the unexposed photoresist layer 38b exposed on the surface is dissolved and removed, and the pattern forming area 38b is removed.
A secondary pattern resist 40 having a resist body 40a covering the wafer was formed. At this time, the unexposed photoresist layer 38b on the lower surface of the frame 3 is covered by the frame 3 and remains on the matrix 24 without being dissolved and removed.

(Second electroforming process)
The above mother mold 24 was placed in an electroforming bath in which the temperature condition of the electroforming solution was set at 23±3°C.
), the upper surface of the primary electroformed layer 30 facing the outer peripheral edge 4a of the pattern forming area 4, the surface of the frame 3, and the matrix exposed on the surface between the frame 3 and the primary electroformed layer 30. A metal layer 8 was formed on the surface of the mold 24 and in the joint through hole 7 by electroforming an electrodeposited metal made of nickel. Thereby, the primary electrodeposited layer 30 and the frame 3 can be integrally and inseparably joined by the metal layer 8.

(Peeling process)
After peeling off the primary electroformed layer 30 and metal layer 8 from the matrix 24, the primary electroformed layer 30a located on the lower surface of the frame 3 was peeled off from both layers 30 and 8. Finally, the secondary pattern resist 40 and the unexposed photoresist layer 38b were removed to obtain the vapor deposition mask 1 shown in FIG. 3.

In this embodiment, the temperature range of the electroforming liquid in the first electroforming process is set to a higher temperature range than the temperature range of the electroforming liquid in the second electroforming process. According to this, the mask body 2
It can be held against the frame 3 under such tension that a stress is applied in the direction of inward contraction. Therefore, the expansion of the mask body 2 due to temperature rise in the vapor deposition oven can be absorbed by the tension, and the displacement of the mask body 2 with respect to the frame 3 and the generation of wrinkles due to the expansion can be prevented.

(Second Embodiment) FIGS. 11 and 12 show a second embodiment of a vapor deposition mask and a method for manufacturing the same according to the present invention. In this embodiment, as shown in FIG. 11, the mask body 2 and the frame body 3 are
In order to prevent the occurrence of distortion in the frame 3 due to internal stress in the metal layer 8 that integrally and inseparably joins the metal layer 8, the metal layer 8 should not be formed on the upper surface of the frame 3 other than on the periphery of the mask opening 11. This embodiment differs from the first embodiment in that the metal layer 8 is divided to provide a stress relaxation section 42.

Since the frame 3 according to the first embodiment is surrounded by the metal layer 8 on three sides of its upper surface and both edges of the mask opening 11 continuous to the upper surface, when forming the metal layer 8 by electroforming, Furthermore, if the frame body 3 is formed with internal stress, the internal stress may cause distortion in the frame 3, which may adversely affect the flatness of the vapor deposition mask 1. However, by providing the stress relaxation section 42 as in the present embodiment, the internal stress of the metal layer 8 can be released by the stress relaxation section 42, thereby preventing distortion from occurring in the frame body 3. Note that "dividing the metal layer 8" here means that the metal layer 8 does not need to be formed to be connected over the entire upper surface of the frame 3, and this mode is limited to that of this embodiment. do not have. Since the rest is the same as the first embodiment, the same members are given the same reference numerals and their explanations will be omitted. The same applies to the following embodiments.

In the method for manufacturing the vapor deposition mask 1 according to the present embodiment, in the final stage of the frame forming process,
A step of forming a resist body 42a corresponding to the stress relaxation part 42 on the upper surface of the frame 3 is performed, and the resist body 42a is provided on the upper surface of the frame 3. The subsequent patterning pre-stage body forming step and secondary patterning step are as shown in FIGS. 8(a) to (d), FIGS. 9(a) to (c), and
The method is similar to that shown in FIG. 10(a), but the first electroforming step is performed with the temperature range of the electroforming solution set at 23±2° C.

(Frame arrangement process)
As shown in FIG. 12(a), a resist body 4 is placed on the matrix 24 so as to surround the primary electroformed layer 30.
The frame body 3 provided with the frame 2a was arranged while being aligned. Here, the frame 3 was temporarily fixed onto the matrix 24 by utilizing the adhesive properties of the unexposed photoresist layer 38b. Furthermore, Fig. 12(b)
As shown in FIG. 3, the unexposed photoresist layer 38b exposed on the surface was dissolved and removed to form a secondary pattern resist 40 having a resist body 40a covering the pattern forming region 4. At this time, the unexposed photoresist layer 38b on the lower surface of the frame 3 is covered by the frame 3 and remains on the matrix 24 without being dissolved and removed.

(Second electroforming process)
The mother mold 24 was placed in an electroforming bath prepared with an electroforming solution temperature of 23±3°C.
), the upper surface of the primary electroformed layer 30 facing the outer peripheral edge 4a of the pattern forming area 4, the surface of the frame 3 not covered with the resist body 42a, and the relationship between the frame 3 and the primary electroformed layer 30. A metal layer 8 was formed by electroforming an electrodeposited metal made of nickel on the surface of the mother die 24 exposed to the surface between the two and inside the bonding through hole 7. Thereby, the primary electrodeposited layer 30 and the frame 3 can be integrally and inseparably joined by the metal layer 8. In this embodiment, the temperature range of the electroforming liquid used in the first electroforming process and the second electroforming process was set to be the same (23±3°C). This can prevent the primary electroformed layer 30, that is, the mask body 2 from thermally expanding and being joined to the frame 3 as much as possible, improving the positional accuracy of the joining position of the mask body 2 to the frame 3. Therefore, it is possible to obtain a vapor deposition mask with higher reproducibility and vapor deposition accuracy of the vapor deposited layer. In addition, in both the first electroforming process and the second electroforming process, the lower the temperature of the electroforming liquid in the electroforming tank is set, the more the primary electroformed layer 3
0 and the thermal expansion of the metal layer 8 can be suppressed as much as possible. At this time, the temperature of the electroforming liquid in the electroforming tank in the first electroforming process and the temperature of the electroforming liquid in the electroforming tank in the second electroforming process are the same or ±
More preferably, the temperature is 3°C.

(Peeling process)
After peeling off the primary electroformed layer 30 and metal layer 8 from the matrix 24, the primary electroformed layer 30a located on the lower surface of the frame 3 was peeled off from both layers 30 and 8. Finally, the secondary pattern resist 40, the resist body 42a, and the unexposed photoresist layer 38b were removed to obtain the vapor deposition mask 1 provided with the stress relaxation part 42 shown in FIG. 11.

(Third Embodiment) FIGS. 13 to 15 show a third embodiment of a vapor deposition mask and its manufacturing method according to the present invention.
An embodiment is shown. In this embodiment, as shown in FIG. 13, the mask body 2 is reinforced by constructing the frame 3 with one frame body 3, and the joint through hole 7 of the mask body 2 into which the metal layer 8 enters. This embodiment differs from the previous first embodiment in that . The upper frame 16 and the lower frame 17 in this embodiment are
It is formed using a metal plate material of 0.8 mm as a base material, and the frame body 3 is set to have the same thickness dimension as the first embodiment.

14 and 15 show a method of manufacturing the vapor deposition mask 1 according to the present embodiment, in which the frame forming process shown in FIG. 6 described in the first embodiment is first performed to form a reinforcing frame. form 3.

(Frame body forming process)
First, a cutting process is performed in which the metal plate is cut into the size of the upper frame 16 and the lower frame 17 using, for example, a wire electric discharge machine that has a small thermal effect on the metal plate. Next, by etching or laser processing the cut-out upper frame 16 and lower frame 17, a mask opening forming step is performed in which a plurality of openings that will become the mask openings 11 are formed, as shown in FIG. 6(a). Next, as shown in FIG. 6(b), the upper frame 16 and the lower frame 17, which are made of metal plate materials, are bonded together with an adhesive layer 18, with their protruding surfaces facing each other. In a state in which the warpage of the dimensional curved surface is canceled out, a joining process is performed to form the frame 3 into a flat shape. The adhesive layer 18 is made of a sheet-like uncured photosensitive dry film resist.

Next, as shown in FIG. 6(c), the upper and lower rolling rolls 2 are arranged at a predetermined inter-roll dimension.
A fixing step is performed in which the sample is passed between 2 and 22 and compressed. Furthermore, the frame 3 was obtained by removing (developing) unnecessary portions of the adhesive layer 18 (portions exposed outside the mask opening 11 and the outer peripheral frame 10). In this way, the reason why a sheet-like uncured photosensitive dry film resist is used for the adhesive layer 18 is that the uncured photosensitive dry film resist has adhesive properties and is further used in the primary patterning process described below. However, since it is a material that can be used, there is no need to separately prepare a commercially available adhesive or the like, and the manufacturing cost of the vapor deposition mask 1 can be reduced accordingly.

(Pre-patterning stage body formation process)
As shown in FIG. 14(a), a matrix 24 made of conductive material such as stainless steel or brass is used.
A photoresist layer 25 is formed on the surface. This photoresist layer 25 was formed by laminating one or several sheets of negative type photosensitive dry film resist and thermocompression bonding to a predetermined thickness. Next, on the photoresist layer 25, a pattern film 26 (glass mask) having transparent holes 26a corresponding to the vapor deposition holes 5 was closely attached to obtain a pre-patterning body 27.

(Preheating process)
The patterning pre-stage body 27 is preheated to the furnace temperature of the ultraviolet irradiation device during exposure work using, for example, a heater plate or a preheating furnace. In parallel with the preheating of the patterning pre-stage body 27, the inside of the furnace of the ultraviolet irradiation device is also preheated to the furnace temperature during the exposure operation. Preheating of the furnace of the ultraviolet irradiation device is performed by lighting the ultraviolet lamp 28 with no irradiation object accommodated in the furnace or with a dummy matrix (matrix+photoresist layer+protective film) accommodated. The pre-patterning stage body 27 and the inside of the furnace are preheated to, for example, 23±3°C. Incidentally, the maximum temperature inside the furnace of the ultraviolet irradiation device during exposure work is around 26°C.

(Primary patterning process)
After the preheating of the furnace of the ultraviolet irradiation device and the pre-patterning body 27 is completed, the pre-patterning body 27 is placed in the furnace of the ultraviolet irradiation device, and as shown in FIG. Exposure is performed by irradiating light, and each process of development and drying is performed. Next, by dissolving and removing the unexposed portions, a primary pattern resist 29 having resist bodies 29a corresponding to the vapor deposition through holes 5 (primary patterning) is formed on the matrix 24, as shown in FIG. 14(b). did. In this way, when the exposure work is performed with the furnace of the ultraviolet irradiation device and the pre-patterning body 27 preheated to the furnace temperature at the time of exposure work, the pre-patterning body 27 is heated and expanded by the ultraviolet irradiation. , it is possible to eliminate the situation where the exposure work is performed while the relative positional relationship of the three persons 24, 25, and 26 is shifted. Therefore, the primary pattern resist 29 can be provided on the master die 24 with good positional accuracy and in the intended shape, contributing to higher reproducibility and deposition accuracy of the vapor deposited layer.

(First electroforming process)
Next, the mother mold 24 is placed in an electroforming tank in which the temperature of the electroforming solution is set at 40 to 50°C.
As shown in FIG. 14(c), an electrodeposited metal made of nickel is primary electroformed on the surface of the matrix 24 that is not covered with the resist body 29a within the height range of the previous resist body 29a. An electroformed layer 30, that is, a layer that will become the mask body 2 was formed. Next, by dissolving and removing the resist body 29a, as shown in FIG. 14(d), a mask body 2 having a vapor deposition pattern 6 consisting of a large number of independent vapor deposition holes 5 was obtained.

(Secondary patterning process and frame arrangement process)
As shown in FIG. 15(a), the entire surface of the mother mold 24 including the formation part of the primary electroformed layer 30 is
A photoresist layer 38 was formed. As before, this photoresist layer 38 was formed by laminating one or several sheets of negative type photosensitive dry film resist and thermocompression bonding to a predetermined thickness. Next, a pattern film 39 having transparent holes 39a corresponding to the pattern forming area 4 is placed in close contact with the pattern film 39 and placed in a furnace of an ultraviolet irradiation device, and exposed by irradiating ultraviolet light with an ultraviolet light lamp 28. In this state, a photoresist layer 38 was obtained in which a portion (38a) related to the pattern formation region 4 was exposed and the other portion was an unexposed portion (38b) (see FIG. 15(b)). In this embodiment as well, an activation treatment step is performed prior to the secondary patterning step, and the primary electroformed layer 30, which forms the outer peripheral edge 4a of the pattern forming region 4, is subjected to activation treatment such as acid immersion or electrolytic treatment. may be applied.

Next, as shown in FIG. 15(b), the frame 3 was positioned and placed on the matrix 24 so as to surround the primary electroformed layer 30. Here, the frame 3 was temporarily fixed onto the matrix 24 by utilizing the adhesive properties of the unexposed photoresist layer 38b. Furthermore, as shown in FIG. 15(c), the unexposed photoresist layer 38b exposed on the surface is dissolved and removed, and the pattern forming area 38b is removed.
A secondary pattern resist 40 having a resist body 40a covering the wafer was formed. At this time, the unexposed photoresist layer 38b on the lower surface of the frame 3 is covered by the frame 3 and remains on the matrix 24 without being dissolved and removed.

(Second electroforming process)
Next, the mother mold 24 is placed in an electroforming bath in which the temperature condition of the electroforming solution is set to 23±3° C., and as shown in FIG. Electrodeposited metal made of nickel is electroformed on the upper surface of the electroformed layer 30, the surface of the frame 3, and the surface of the matrix 24 exposed on the surface between the frame 3 and the primary electroformed layer 30. A metal layer 8 was formed. Thereby, the primary electrodeposited layer 30 and the frame 3 can be integrally and inseparably joined by the metal layer 8.

(Peeling process)
After peeling off the primary electroformed layer 30 and metal layer 8 from the matrix 24, the primary electroformed layer 30a located on the lower surface of the frame 3 was peeled off from both layers 30 and 8. Finally, the secondary pattern resist 40 and the unexposed photoresist layer 38b were removed to obtain the vapor deposition mask 1 shown in FIG. 13.

(Fourth Embodiment) FIGS. 16 and 17 show a fourth embodiment of a vapor deposition mask and a method for manufacturing the same according to the present invention. In this embodiment, as shown in FIG. 16, the mask body 2 and the frame body 3 are
The metal layer 8 is inseparably joined to the primary electroformed layer 3 constituting the mask body 2.
It differs from the previous embodiments in that it is formed integrally with 0. In this way, when the metal layer 8 is integrally formed with the mask body 2, it is possible to eliminate the trouble of forming the metal layer 8 separately and joining the mask body 2 and the frame 3, thereby omitting the steps required for manufacturing and shortening the time. Therefore, the manufacturing cost of the vapor deposition mask 1 can be reduced.

FIG. 17 shows a method for manufacturing the vapor deposition mask 1 according to the present embodiment, in which the frame forming process shown in FIGS. 6 and 7 described in the first embodiment is first performed to form a reinforcing frame. form 3.

(Frame body forming process)
First, a cutting process is performed in which the metal plate is cut into the size of the upper frame 16 and the lower frame 17 using, for example, a wire electric discharge machine that has a small thermal effect on the metal plate. Next, by etching or laser processing the cut-out upper frame 16 and lower frame 17, a mask opening forming step is performed in which a plurality of openings that will become the mask openings 11 are formed, as shown in FIG. 6(a). Next, as shown in FIG. 6(b), the upper frame 16 and the lower frame 17, which are made of metal plate materials, are bonded together with an adhesive layer 18, with their protruding surfaces facing each other. In a state in which the warpage of the dimensional curved surface is canceled out, a joining process is performed to form the frame 3 into a flat shape. The adhesive layer 18 is made of a sheet-like uncured photosensitive dry film resist.

Next, as shown in FIG. 6(c), the upper and lower rolling rolls 2 are arranged at a predetermined inter-roll dimension.
A fixing step is performed in which the sample is passed between 2 and 22 and compressed. Furthermore, the frame 3 was obtained by removing (developing) unnecessary portions of the adhesive layer 18 (portions exposed outside the mask opening 11 and the outer peripheral frame 10). In this way, the reason why a sheet-like uncured photosensitive dry film resist is used for the adhesive layer 18 is that the uncured photosensitive dry film resist has adhesive properties and is further used in the primary patterning process described below. However, since it is a material that can be used, there is no need to separately prepare a commercially available adhesive or the like, and the manufacturing cost of the vapor deposition mask 1 can be reduced accordingly.

Each of the above steps is performed using metal plate materials of different thicknesses to manufacture a pair of frames 3, 3 as shown in FIG. 7(a). These frames 3, 3 are stacked as shown in FIG. 7(b), and the frames 3, 3
They were bonded together with an adhesive layer 19 made of a sheet-like uncured photosensitive dry film resist. Thereafter, as shown in FIG. 7(c), a lamination step is performed in which the material is passed between upper and lower rolling rolls 22 arranged at a predetermined distance between the rolls and compressed. In this way, a pair of laminated frames 3.3 was obtained.

(Pre-patterning stage body formation process)
As shown in FIG. 17(a), a matrix 24 made of conductive material such as stainless steel or brass is used.
A photoresist layer 25 is formed on the surface. This photoresist layer 25 was formed by laminating one or several sheets of negative type photosensitive dry film resist and thermocompression bonding to a predetermined thickness. Next, on the photoresist layer 25, a pattern film 26 (glass mask) having transparent holes 26a corresponding to the mask main body 2 was brought into close contact, to obtain a pre-patterning body 27.

(Preheating process)
The patterning pre-stage body 27 is preheated to the furnace temperature of the ultraviolet irradiation device during exposure work using, for example, a heater plate or a preheating furnace. In parallel with the preheating of the patterning pre-stage body 27, the inside of the furnace of the ultraviolet irradiation device is also preheated to the furnace temperature during the exposure operation. Preheating of the furnace of the ultraviolet irradiation device is performed by lighting the ultraviolet lamp 28 with no irradiation object accommodated in the furnace or with a dummy matrix (matrix+photoresist layer+protective film) accommodated. The pre-patterning stage body 27 and the inside of the furnace are preheated to, for example, 23±3°C. Incidentally, the maximum temperature inside the furnace of the ultraviolet irradiation device during exposure work is around 26°C.

(Primary patterning process)
After the preheating of the furnace of the ultraviolet irradiation device and the pre-patterning body 27 is completed, the pre-patterning body 27 is placed in the furnace of the ultraviolet irradiation device, and as shown in FIG. Exposure is performed by irradiating light, and each process of development and drying is performed. Next, by dissolving and removing the unexposed portions, a primary pattern resist 29 having a resist body 29a corresponding to the mask body 2 (primary patterning) is formed into a matrix 24, as shown in FIG. 17(b).
formed on top. In this way, the inside of the furnace of the ultraviolet irradiation device and the patterning pre-stage body 27 are
When the exposure work is performed with the furnace temperature preheated to the temperature during the exposure work, the patterning pre-stage body 27 is heated and expanded by ultraviolet irradiation, and the relative positional relationship of the three members 24, 25, and 26 is shifted. This eliminates the need for exposure work. Therefore, the primary pattern resist 29 can be provided on the matrix 24 with good positional accuracy and in the intended shape.
It can contribute to increasing the repeatability and deposition accuracy of the deposited layer.

(Frame arrangement process)
As shown in FIG. 17(c), an adhesive resist 43 was formed on the entire surface of the matrix 24 including the portion where the primary pattern resist 29 was formed. This adhesive resist 43 was formed by laminating one or several sheets of negative type photosensitive dry film resist and thermocompression bonding to a predetermined thickness as before. Next, the frame 3 was placed on the matrix 24 so as to surround the primary pattern resist 29 while being aligned. Here, the frame 3 was temporarily fixed onto the matrix 24 by utilizing the adhesive properties of the unexposed adhesive resist 43. Furthermore, Figure 17 (d
), the unexposed adhesive resist 43 exposed on the surface was dissolved and removed. At this time, the adhesive resist 43 on the lower surface of the frame 3 is covered by the frame 3 and remains on the matrix 24 without being dissolved and removed.

(integrated electroforming process)
The mother mold 24 was placed in an electroforming bath prepared with an electroforming solution temperature condition of 23±3°C.
), a metal layer 8 was formed by electroforming an electrodeposited metal made of nickel on the surface of the matrix 24 not covered with the resist body 29a and on the surface of the frame 3. Thereby, the primary electroformed layer 30 that constitutes the mask body 2 and the metal layer 8 that joins the mask body 2 and the frame 3 can be integrally formed.

(Peeling process)
By peeling the primary electroformed layer 30, metal layer 8, and frame 3 together from the matrix 24, and then removing the adhesive resist 43 located on the lower surface of the frame 3 from both layers 30, 8, A vapor deposition mask 1 shown in FIG. 16 was obtained.

According to the manufacturing method of the fourth embodiment described above, the rigidity of the frame 3 can be increased in the same manner as described above, while omitting the steps required for manufacturing and shortening the time by eliminating the labor of forming the metal layer 8. Therefore,
It is possible to obtain a vapor deposition mask 1 that can be increased in size while further suppressing an increase in manufacturing costs, can maintain flatness, and can ensure good reproducibility and vapor deposition accuracy of the vapor deposited layer.

(5th Embodiment) 5th Embodiment of the vapor deposition mask based on this invention is shown in FIGS. 18-20. The vapor deposition mask 1 in this embodiment includes a support frame 46 fixed to the lower surface of the frame 3 and an auxiliary frame 47 fixed to the lower surface of the support frame 46, as shown in FIG. The outer shapes of the support frame 46 and the auxiliary frame 47 are made to match the frame body 3. As shown in FIGS. 19 and 20, a frame opening 48 corresponding to the mask opening 11 of the frame body 3 is formed in the support frame 46, and the frame opening 48 is formed in an opening shape that is slightly larger than the mask opening 11. has been done. The entire vertical frame 12 and horizontal frame 13 of the frame body 3 are supported by a support frame 46. Furthermore, the auxiliary frame 47 is formed into a picture frame shape,
Four peripheral edges of the support frame 46 are supported by an auxiliary frame 47. After the vapor deposition mask 1, the support frame 46, and the auxiliary frame 47 are aligned, the three members 1 and 46 are aligned.
- Joined and integrated by spot welding 47. Spot welding location 4
9 are provided at the four corners and at the four peripheral edges on the extension line of the vertical frame 12 and the horizontal frame 13 (
(See Figure 20).

As described above, the entire vertical frame 12 and horizontal frame 13 of the frame body 3 are supported by the support frame 46,
Furthermore, by supporting the four peripheral edges of the support frame 46 with the auxiliary frame 47, the structural strength and rigidity of the entire vapor deposition mask can be further enhanced, and the vapor deposition mask 1 can be prevented from being deflected and deformed, thereby maintaining flatness. , the reproducibility and vapor deposition accuracy of the vapor deposited layer can be further improved.

FIG. 21 shows a modification of the fifth embodiment of the vapor deposition mask according to the present invention. In this embodiment, the vapor deposition mask 1 has ten mask bodies 2 arranged in a matrix of two rows and five columns. Three vapor deposition masks 1 were manufactured, and these three vapor deposition masks 1 were supported by a support frame 46 and an auxiliary frame 47. Specifically, first, one vapor deposition mask 1 is prepared, and after adjusting the position and tension, it is fixed to the support frame 46. Such fixing is performed by spot welding the corner portions of the frame body 3 and the peripheral portions on the extension lines of the vertical frames 12 and horizontal frames 13. The remaining two vapor deposition masks 1 are similarly fixed to the support frame 46. Finally, the auxiliary frame 47 is fixed (spot welded) to the side of the support frame 46 opposite to the side on which the vapor deposition mask 1 is fixed. With this configuration in which a plurality of vapor deposition masks 1 are supported by the support frame 46 and the auxiliary frame 47, the relative positions of adjacent vapor deposition masks 1 can be finely adjusted and arranged. The relative positional accuracy of the mask body 2 can be improved. Therefore, good reproducibility and deposition accuracy can be ensured. Moreover, the vapor deposition mask 1 of a desired size can be freely set.

As described above, in the vapor deposition masks and vapor deposition mask manufacturing methods of each of the above embodiments,
Since the frame 3 is composed of an upper frame 16 and a lower frame 17, and the upper and lower frames 16 and 17 are joined together via the adhesive layer 18, it is easier to form the frame 3 with the same thickness as before. , the frame 3 can be formed using a thinner metal plate material, and the thickness deviation of the entire frame 3 can be reduced. Thereby, even with the large-sized vapor deposition mask 1, it is possible to suppress the occurrence of distortion due to thermal expansion resulting from thickness deviation of the metal plate material. In addition, since we only use a commonly available thin metal plate material for the base material,
There is no need to form the frame 3 using a special metal plate material. As described above, according to the vapor deposition masks of the above embodiments, it is possible to increase the size of the vapor deposition mask 1 while suppressing an increase in manufacturing costs, and it is also possible to maintain the flatness of the vapor deposition mask 1, resulting in good reproduction. Accuracy and deposition accuracy can be ensured. Furthermore, according to the frame body 3 in which the adhesive layer 18 is interposed between the upper frame 16 and the lower frame 17,
When an external force that causes flexural deformation is applied to the vapor deposition mask 1, the frame body 3 deforms by an amount corresponding to the adhesive layer 18.
is flexibly and elastically deformed, and damage to the vapor deposition mask 1 can be effectively prevented.

Moreover, in the vapor deposition masks of the first, second, fourth, and fifth embodiments, a plurality of frames 3
・Since the frames 3 and 3 adjacent in the stacking direction are bonded together via the adhesive layer 19, when forming the frame 3 with the same thickness as before, it is possible to use a thinner metal plate material. Since the frame body 3 can be formed, it is possible to further suppress the occurrence of distortion due to thermal expansion resulting from thickness deviation of the metal plate material.

As in each of the above embodiments, the number and arrangement of mask bodies 2 included in the vapor deposition mask 1 are not limited to those shown in the above embodiments. Moreover, the number of mask bodies 2 does not need to be plural, and may be one. Prior to the joining process of the upper and lower frames 16 and 17, press working is performed on the cut out upper frame 16 and lower frame 17 using upper and lower molds for imparting curved surfaces to impart a two-dimensional curved surface or a three-dimensional curved surface. Can be done. In this case, by providing a two-dimensional curved surface or a three-dimensional curved surface having a line-symmetrical relationship, it is possible to easily form the frame 3 into a flat shape in the subsequent joining process. The primary electroformed layer 30 and the metal layer 8 may have a two-layer structure of bright nickel and matte nickel electroformed thereon. In this case, the bright nickel is less likely to stick to the matrix 24, and the step of peeling the vapor deposition mask 1 from the matrix 24 in the manufacturing process can proceed with high efficiency.

1 Vapor deposition mask 2 Mask body 3 Frame 4 Pattern formation area 4a Outer periphery 5 Vapor deposition through hole 6 Vapor deposition pattern 8 Metal layer 10 Outer frame 11 Mask opening 12 Vertical frame 13 Horizontal frame 16 Upper frame 17 Lower frame 18 Adhesive layer 19 Adhesive layer 24 Matrix 25 Photoresist layer 26 Pattern film 26a Transparent hole 27 Pre-patterning body 29 Primary pattern resist 29a Resist body 30 Primary electroformed layer 43 Adhesive resist 46 Support frame 47 Auxiliary frame 48 Frame opening W1 Width dimension of vertical frame W2 Horizontal frame width dimension

Claims (3)

Comprising an upper frame (16) and a lower frame (17),
The upper frame (16) and the lower frame (17) are made of a metal material with a low coefficient of linear thermal expansion,
A frame body in which an upper frame (16) and a lower frame (17) are joined via an adhesive layer (18),
A frame body characterized in that a plurality of the frame bodies are stacked, and the frames adjacent to each other in the stacking direction are bonded to each other via an adhesive layer (19). 2. The frame body according to claim 1, wherein a pair of frame bodies are stacked, and the thickness of the upper frame body is set to be smaller than the thickness dimension of the lower frame body. 3. The frame body according to claim 1, wherein the upper frame (16) and the lower frame (17) are joined with their protruding arc surfaces or concave arc surfaces facing each other.